Ethernet PCIe bridge IC anticipates zoning in automotive networks

Anticipating the movement towards zonal architecture in automotive design, Toshiba Electronics Europe has developed the TC9563XBG Ethernet bridge IC.   

It incorporates two 10Gbits per second Ethernet media access controllers (MACs) supporting USXGMII (universal serial 10 Gbit media independent interface), XFI (the 10Gbit serial interface), the SGMII (serial Gbit media independent interface) and the RGMII (reduced Gigabit media independent interface) Ethernet interface standards.

Both ports support Ethernet IEEE802.1 audio/video bridging (AVB) for real time processing and low latency IEEE802.1 time sensitive networking (TSN) for synchronous processing. The ports also support single root I/O virtualisation (SR-IOV) on PCIe devices.

The IC is intended for use in automotive zonal-architecture, infotainment, telematics or gateways as well as industrial equipment. Toshiba said automotive networks are evolving toward zonal architecture that requires real time transmission between the zones using multi-gigabit Ethernet communication. It developed the TC9563XBG with dual 10Gbits per second AVB and TSN-capable Ethernet interfaces for this networking technology.

The TC9563XBG includes a PCIe Gen 3 switch with three external ports for communications with the host controller SoC and additional devices equipped with PCIe interfaces like 5G-modem modules. The PCIe switch upstream port supports up to four lanes (32G transfers per second) for connection with the host SoC. Depending on the configuration, the downstream ports can connect with one and two lanes to PCIe-capable devices.

As automotive communication requirements increase in terms of the amount of data as well as the required speeds, the bridge IC will support various automotive applications including in-vehicle infotainment (IVI) and telematics. It can also replace Toshiba’s Ethernet-to-PCIe TC9560 and TC9562 bridges, to upgrade system throughput and performance.

The use of PCIe interfaces has proliferated for device-to-device communication such as Wi-Fi, which can occupy PCIe interfaces on the host SoC. Using the TC9563XBG’s three-port PCIe switch function for these connections addresses this conflict.

Housed in a 10mm x 10mm, 0.65mm pitch P-FBGA package, the TC9563XBG bridge IC will be compliant with AEC-Q100 (Grade 3).

Samples are shipping now and volume production ramp-up will be in April 2022.

http://www.toshiba.semicon-storage.com

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Software engine makes lidar data hardware-agnostic

3D spatial intelligence specialist, Outsight, offers the Augmented Lidar Box (ALB), believed to be the first real-time lidar (light detection and ranging) software engine that allows developers to seamlessly use lidar data from any hardware supplier. 

The software within a small computing device works with sensors from different manufacturers (including Velodyne, Ouster, Hesai, Robosense and Innoviz) and  instantly converts raw 3D data input to accessible, actionable data. 

Lidar technology is increasingly used across a range of industries outside of the automotive sector, such as energy, intelligent transportation systems, logistics, manufacturing, smart infrastructure, defence, space and agriculture.

3D lidar was introduced in 2005 to give autonomous vehicles real time, 360 degree perception. It allows cars to determine the situation on the road, but also to cope with other, more complex tasks, for example, analysing people’s interactions in a certain space, calculating the exact volume and quantity of objects in a truck, or enabling many robotics applications. It is estimated there will be 16 million lidar sensors in smart cities, security and industry verticals by 2030, and 13 million installed in vehicles. Intelligent transportation systems (ITS) such as smart intersections and smart infrastructure applications are expected to be the main drivers of market growth, with software for lidar in smart infrastructure and ITS applications expected to account for at least 40 per cent of the value.

Lidar sensor prices are dropping as more companies operate in the market but there are problems of data interpretation and ease of use of available devices, reports Outsight. Selecting the right lidar sensor from dozens of hardware suppliers and more than 100 available products, without any standard, is a time-consuming and inefficient use of engineering resources, argues the company.

It says its ALB real time software allows any engineer from any market segment to use lidar data without needing to become a 3D expert because it includes the fundamental insight commonly required by users (e.g., localisation and mapping, object identification and tracking, segmentation and classification).

The ALB is believed to be the first lidar pre-processor. It is a real time software engine that turns any lidar into a spatial intelligence device. It overcomes the complexity of using raw 3D data, so any application developer or integrator can efficiently use lidar without needing to become a 3D lidar expert, says Outsight.   

http://www.outsight.tech 

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Magnachip expands OLED DDIC for automotive displays

Organic light-emitting diode (OLED) display driver integrated circuits (DDICs) from Magnachip now include models for automotive displays. 

The company has responded to an increase in demand for automotive semiconductors required for electric vehicles (EVs), autonomous driving and connected cars and their infotainment and safety systems. OLED panels offer image quality, high visibility and fast response times.

Magnachip is developing an OLED DDIC for automotive systems’ centre stack and instrument cluster displays, based on its 40nm process technology. The next-generation DDIC supports a wide range of resolutions including FHD (full high definition) and is suitable for both rigid and flexible OLED displays. The DDIC will integrate source drivers, gate drivers and timing controllers in a single chip. This feature will enable the production of cost-effective display panels consisting of fewer components, says Magnachip. 

Market research company, Omdia, expects the automotive display market to grow from $8.2 billion in 2021 to $9.7 billion in 2025. The revenue of global automotive OLED panel market reached $117 million in 2021 and it is expected to increase approximately 350 per cent to $524 million in 2025, says the company.

YJ Kim, CEO of Magnachip, believes: “Vehicles incorporating displays based on our next-generation OLED DDIC technology represents another step in improved safety, functionality and convenience for consumers.”  

The company plans to supply the new product to premium European car manufacturers in the first half of 2023.

Magnachip Semiconductor designs and manufactures analogue and mixed-signal semiconductors for communications, IoT, consumer, industrial and automotive applications. The company provides a broad range of standard products to customers worldwide. It has more than 40 years of operating history and a portfolio of approximately 1,200 registered patents and pending applications, together with extensive engineering, design and manufacturing process expertise. 

http://www.magnachip.com 

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5Mpixel RGB-IR global shutter sensor is a first for in-cabin monitoring

For simultaneous driver and occupant monitoring in vehicles, the OX05B1S has been introduced by Omnivision. It is claimed to be the smallest 2.2 micron pixel with the highest near infrared (NIR) sensitivity.

It is also believed to be the automotive industry’s first 5Mpixel RGB-IR BSI global shutter sensor for in-cabin driver monitoring systems (DMS). Despite its pixel size of just 2.2 micron, it offers 940nm NIR sensitivity for performance in extremely low light conditions. It has a wide field of view and enough pixels to view both the driver and occupants, adds the company. It is also claimed to be the first RGB-IR sensor for in-cabin monitoring to feature integrated cybersecurity.

The introduction supports the automotive industry’s transition to 5Mpixel operation and only one camera is needed instead of two for simultaneous driver and occupant monitoring systems, reducing complexity, cost and space,” points out Andy Hanvey, director of automotive marketing at Omnivision. The company adds that the OX05B1S was developed with “strong ecosystem partner support, working with companies such as Seeing Machines, to enable a complete, seamless solution for automotive OEMs”.

The sensor is based on Omnivision’s Nyxel NIR technology which uses novel silicon semiconductor architectures and processes to achieve the world’s best quantum efficiency (QE) at the 940nm NIR wavelength, claims the company. The OX05B1S has an NIR QE of 35 per cent which is four times the capability of the previous generation of sensor. This enables the OX05B1S to detect and recognise objects that other image sensors would miss under extremely low lighting conditions, to enhance in-cabin camera capabilities for occupant and driver monitoring and security. In other non-automotive systems it can be used to enhance selfie images and videoconferencing.

The sensor comes in Omnivision’s stacked a‑CSP package that is 50 per cent smaller than competitive products and allows for higher-performance image sensors in tighter camera spaces. It is also available in a reconstructed wafer option for designers who want to customise their own package.

The OX05B1S has an optional always on optional feature. 

Samples are available now and the sensors will be in mass production in Q1 2023.

http://www.ovt.com

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