Solid state digital beam steering technology is automotive-grade

Digital beam steering for lidar smart sensors has been announced by LeddarTech. LeddarSteer is designed for smart sensor developers and Tier 1 / Tier-2 automotive suppliers.

Digital beam steering refers to changing the direction of laser pulses in a lidar system. A stack of alternating liquid crystal cells and polarisation gratings enables light to be steered at different angles and at a specific wavelength in order to augment a lidar field of view.

LeddarSteer digital beam steering offers benefits such as software-controlled, on the fly adjustment, noted LeddarTech. It also allows for frame by frame adjustment, a pre-set or customised configuration, voltage controlled steering and is claimed to be easy to set up and interface with systems. It is also compatible with a range of lidar architectures and enables one lidar to address multiple use cases.

It is also field of view adjustable to accommodate a range of driver actions, such as turns, lane changes and slopes. Therefore, the same lidar can be used for motorway/highway and city driving.

Another benefit, said LeddarTech is that the resulting reduction in the number of sensors, contributes to bill of materials savings. In addition, said the company, the automotive-grade solid state technology results in a significantly higher MTBF (mean time between failures).

LeddarSteer can be seamlessly integrated into an existing lidar to expand the field of view or it can be integrated into a new lidar development. It provides an enhanced signal to noise ratio by concentrating laser power on a small region of interest while reducing the size, cost and complexity of lidar components whilst maintaining or increasing the pixel count and resolution.

According to LeddarTech CEO, Charles Boulanger: “LeddarSteer is the only digital beam steering smart component designed for mass production with the flexibility, reliability, cost, size and performance required by the most demanding 3D sensing applications and supported by standard automotive manufacturing process”. 

Founded in 2007, LeddarTech is an environmental sensing company that enables customers to solve critical sensing, fusion and perception challenges across the entire value chain. Its portfolio includes LeddarVision, a raw data sensor fusion and perception platform that generates a comprehensive 3D environmental model from a variety of sensor types and configurations. LeddarTech also supports lidar manufacturers and Tier-1 / Tier- 2 automotive suppliers with LeddarSteer digital beam steering and the LeddarEngine, which is built on the company’s Leddar technology employing patented signal acquisition and processing techniques to generate a richer and cleaner return signal at a lower cost.

The LeddarEngine comprises a highly integrated, scalable lidar SoC and software combination.

The company is responsible for several innovations in cutting-edge automotive and mobility remote-sensing applications, with over 120 patents granted or applied for, enhancing ADAS and autonomous driving capabilities.

http://www.leddartech.com 

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Global shutter image sensor simplifies driver monitoring system design

Using 3D chip technology, STMicroelectronics has developed the VB56G4A, global-shutter sensor for vehicle driver monitoring safety systems.

It is the company’s second generation automotive global-shutter image sensor. Driver monitoring systems (DMS) continually watch the driver’s head movements to recognise signs of drowsiness and distraction for vehicle systems to generate safety warnings.

Global-shutter sensor offers big advantages over rolling-shutter imagers. By simultaneously exposing all pixels to the image, a global-shutter sensor allows simple synchronisation with near infra red (NIR) illumination, improving the illumination-subsystem power budget. 

The VB56G4A sensor achieves high quantum efficiency (QE), reaching 24 per cent at 940nm NIR wavelength, with linear dynamic range up to 60dB. This enables a simple low-power, non-visible LED emitter to provide adequate illumination for the sensor. Operating outside the visible spectrum also ensures consistent response in day or night driving and in bright or overcast conditions, said ST

The sensor’s high QE, combined with a pixel size of just 2.6 micron, helps optimise total power consumption and camera size. In addition, integrated automatic exposure control eases use and simplifies the application software design by minimising system interaction with the sensor.

The sensor also provides flexible operating modes that help optimise system features and performance. These include programmable sequences of four-frame contexts, illumination control outputs synchronised with sensor integration periods, an input for an external frame-start signal, automatic dark calibration, dynamic defective-pixel correction, image cropping, and a mirror / flip-image readout.

External connections include eight programmable general-purpose I/O (GPIO) pins and a dual-lane MIPI CSI-2 transmitter interface operating up to 1.5 Gbits per lane. The sensor can operate at up to 88 frames per second (fps) at full resolution and typical power consumption is 145mW at 60 fps.

It is estimated that around 95 per cent of driving accidents result from human error leading to the introduction of legislation in Europe that DMS will be mandatory in all new car models from 2024 and for existing models in 2026. In Europe, there were nearly 19,000 accident fatalities in 20201 and twice as many in the US, leading the National Transportation Safety Board (NTSB) to recommend DMS for all semi-autonomous vehicles.

“Drivers may not realize that they are unsafe to drive due to tiredness or distraction. DMS removes uncertainty by detecting the problem automatically, which protects all occupants as well as others traveling on the road,” said Eric Aussedat, executive vice president, imaging sub-group general manager, STMicroelectronics. The VB56G4A is sensitive and compact to simplify DMS hardware and reduce overall system cost, he added. 

The VB56G4A global shutter sensor uses ST’s 3D-stacked back-side illuminated (BSI-3D) image sensors. These are more sensitive, smaller, and more reliable than conventional front-side illuminated (FSI) sensors typically used in DMS, said the company.

ST is supplying samples of the sensor to lead customers now and mass production is scheduled for the beginning of 2023 for adoption in model year 2024 vehicles.

http://www.st.com

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Optical physical layer adds network interface to Renesas vehicle computer

Renesas has integrated KDPOF’s KD1053 PHY IC and KD9351 fibre optic transceiver (FOT) into the automotive vehicle computer VC4, communication gateway engine control unit (ECU). The VC4 integrates an optical Ethernet interface into our automotive evaluation boards. The 1000BASE-RH transceiver KD1053 and KD9351 FOT is certified to IEEE 802.3bv. 

In order to meet the increasing complexity and computation demands of the next generation vehicles, the VC4 communication gateway ECU is intended to be a universal development platform for automotive customers based on the R-Car-S4 SoC.

Optical connectivity solves the challenges posed by electrical interference in vehicles, says KDPOF, thanks to the low weight, low cost and electromagnetic compatibility due to inherent galvanic isolation. “With the integrated KD9351 FOT in combination with the KD1053 PHY IC, we deliver a complete automotive 1000BASE-RHC physical layer,” said Carlos Pardo, CEO and co-founder of KDPOF.

Applications include safe Ethernet backbones, smart antenna modules, and sensor connections for advanced driving assistance system (ADAS) and audio/video.

The KD9351 optical transceiver incorporates the transmission and reception optoelectronics – such as transimpedance amplifier, photodiode, LED driver, and LED – into one single component. The KD9351 optical transceiver operates at 100Mbits per second up to 1Gbits per second. In addition to a small footprint, it benefits from a shorter supply chain and no test duplication with the final test at the Tier 1. The assembly is simplified and the connector offers snap-fit without soldering. The KD9351 reuses low-cost MEMs encapsulation and allows surface mount reflow assembly with 8.0 by 7.0mm LGA components. It is shielded against electromagnetic radiation, added KDPOF. The temperature range, from -40 to +105 degrees C, conforms with harsh automotive environmental requirements.

KDPOF will present latest highlights of the optical in-vehicle network technology at the Automotive Ethernet Congress (01 to 02 June 2022 in Munich, Germany). On 2 June, Carlos Pardo will present “Automotive Optical Ethernet Reaching for 50Gbits per second”.

https://www.kdpof.com 

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Nexperia extends DFN packaging to AEC-Q101-compliant discretes

Discrete components from Nexperia are now available in miniature DFN packaging with side-wettable flanks. The company has introduced the AEC-Q101-compliant components to save board space in automotive designs.

The components are intended for applications in smart and electric vehicles, explained the company, with AEC-Q101 devices available cuts across all Nexperia’s product groups.

The new releases are the BC817QBH-Q and BC807QBH-Q series 45V, 500mA NPN / PNP general purpose transistors in a DFN1110D-3 package. There is also the BAT32LS-Q and BAT42LS-Q general purpose Schottky diode in a DFN1006BD-2
package and the BAS21LS-Q high-speed switching diode in a DFN1006BD-2 package.

Nexperia has also introduced the PDTA143 / 114 / 124 / 144EQB-Q series 50V 100mA PNP resistor-equipped transistor (RET) family in the DFN1110D-3 package. 

Finally, there are two trench MOSFETs, the 2N7002KQB 60V and the BSS84AKQB  50V, P-channel devices, both in the DFN1110D-3 package.

According to Nexperia, leadless DFN packages are up to 90 per cent smaller than SOT23 packages, contributing to a reduction in the amount of board space required for an increasing number of electronic components in vehicles. The side-wettable flank offers very reliable automated optical inspection (AOI) of solder joint quality, added the company. Nexperia’s DFN packages deliver thermal performance with high Ptot and are claimed to be the most rugged in the industry passing extended lifetime and reliability tests.

Nexperia claims to offer the widest range of AEC-Q101 qualified discrete components in these miniature leadless packages. According to Mark Roeloffzen, senior vice president and general manager of Nexperia’s Bipolar Discretes business group, more than 460 different high volume devices are available in the recently released DFN1412D-3, DFN1110D-3, and DFN1006BD-2 packages. “By offering even more devices in these miniature packages, Nexperia provides design engineers with greater opportunities to make their designs future-proof, having an impact on the mobility of the future,” he said. 

The new technology already has design-in and commitment from major Tier 1 automotive suppliers, he added.

Samples and production quantities are available now.

http://www.nexperia.com 

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