Integrated connected car module is scalable

Targeted at the global automotive industry, the Laird Modular Automotive Connectivity (MAX) module is believed to be the first fully integrated connected car platform.

The integrated and scalable module is for secure mobile connectivity and automotive Ethernet for reliable internet use inside and outside the vehicle.

Laird MAX has been introduced worldwide and brings together communications technologies, an open software concept, a Linux-based security module, and Laird’s integrated antenna system.

MAX enables a range of services for safety and comfort, explains Laird, from driver-assisted navigation, advanced diagnostics for maintenance, theft protection and over-the-air software updates that can be scaled to meet the needs of automakers and their customers.

Worldwide sales of connected cars are expected to reach 72.5 million in the next five years, according to industry analyst IHS Markit, with almost 70 per cent of all passenger vehicles sold around the globe will be exchanging data with external sources, bringing new services and new business models to bear in automotive markets by 2023.

The modularisation of MAX enables automakers to have a short time-to-market compared to tailor-made solutions, says Laird. It can be integrated into a Laird system solution, including control unit and antenna, and used for external service providers as the basis for a back-end connection or for app development.

Its scalability means it can cater for customers who only need networking for small batches.

Applications that can be implemented on MAX include internet gateway functionality, a remote diagnostic tool, a remote-control system, location functions, and driver statistics. It can be used to set up a wide range of services for OEMs, fleet operators and insurance companies.

MAX enables a connected vehicle to continuously and securely stream and share data with multiple wireless devices and applications inside and outside the vehicle’s immediate environment. It can serve as a communication basis for networked and autonomous vehicles in smart cities, as well as with trucks, fork-lifts or machines in networked logistics or for smart farming.

The use of custom features limits the number of components and their weight, to make MAX is environmentally-friendly, says Laird. By optimizing the energy management, the power consumption is reduced, which is a differentiation advantage especially for electric vehicles.

http://www.laird.com

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Software improves operation efficiency for distributed systems management

Designed to improve operational efficiency and decrease maintenance costs through a centralised interface for automating tasks, SystemLink application software is for distributed systems management.

NI has introduced the software in response to trends like the industrial IoT, 5G and the electrification of vehicles, coupled with maintaining distributed legacy systems. NI believes the drive towards connected and centrally co-ordinated systems has transformed theories and pilot projects into large-scale, distributed deployments. Companies derive returns from the actionable, data-driven insights that help them maximise uptime, increase efficiency and drive future product innovation. At the same time, companies need to balance their adoption of new, connected technologies while preserving support for valuable legacy assets with long life cycles.

Systems that manage, maintain and extract insight from small-scale pilots or groups of systems are relatively straightforward to implement, explains NI. The next challenge is to scale and manage large deployments, varying life cycle stages and distributed testers and nodes across entire plants, fabs and factories. This includes tasks like remote software and system configuration as well as data management and performance monitoring in industries from aerospace and defence to transportation and manufacturing.

SystemLink enables engineers to connect, deploy, and manage distributed systems, both NI and third-party, through a centralised interface accessible from anywhere. As a result it is possible to remotely configure and deploy software, monitor the health and performance of their equipment, manage alarms, and visualise application parameters. Additionally, engineers can automate the communication of data to

To meet demands like testing higher complexity devices under test and shorter timeframes, engineers need tools tailored to their needs. SystemLink is the latest addition to NI’s software-centric platform. It has LabVIEW engineering system design software at its core and TestStand test management software for overall execution. The workflow helps to improve the productivity of test and validation labs, says NI. Each piece of the workflow is also interoperable with third-party software to maximise code/IP reuse and draws on the LabVIEW Tools Network ecosystem of add-ons and tools for more application-specific requirements.

http://www.ni.com/systemlink

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Deep learning ASIC is in production qualification

Independent FinFET-class ASIC, custom IP and 2.5D packaging provider, eSilicon, has announced that the deep learning ASIC that taped out last September has moved to production qualification.

The ASIC includes custom pseudo two-port memories designed by eSilicon, TSMC’s Chip on Wafer on Substrate (CoWoS) technology, 28G SerDes, and four second-generation High-Bandwidth Memory (HBM2) stacks. eSilicon’s end-to-end 2.5D/HBM2 structure includes 2.5D ecosystem management, silicon-proven HBM2 PHY, ASIC physical design, 2.5D package design, manufacturing, assembly and test.

The CoWoS interposer is over 1,000 square mm and contains over 170,000 microbumps. The design has successfully passed test bring-up and is in final qualification, reports eSilicon. Four-high and eight-high HBM stack versions are in qualification. This design is in the industry vanguard of ASICs targeting deep learning applications, says eSilicon.

The 2.5D/HBM2 single package implementation gives the ASIC advantages such as orders of magnitude higher total bandwidth in a much smaller board footprint. Another benefit, says eSilicon, is that it affords highly parallel connections to memory stacks inside the package for fast access and a “significant” reduction in power consumption.

“This design greatly expands the possibilities for deep learning, and we are delighted to enter final qualification,” said Ajay Lalwani, vice president, global manufacturing operations at eSilicon. “TSMC’s 2.5D CoWoS packaging technology has been a key differentiater for this advanced design.”

As well as complex FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, eSilicon provides complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 14,16 and 17nm as well as SerDes, specialised memory compilers and I/O libraries. It has a patented knowledge base and optimisation technology that it provides to customers serving the high-bandwidth networking, high-performance computing, artificial intelligence and 5G infrastructure markets.

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Picture credit – TSMC foundry

www.esilicon.com

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Multi-phase PMICs offer efficiency in “smallest” footprint, says Renesas Electronics

Three power management ICs (PMICs) from Renesas Electronics are claimed to offer the highest power efficiency and smallest footprint for application processors in smartphones and tablets. The ISL91302B, ISL91301A, and ISL91301B multi-phase PMICs also deliver power to artificial intelligence (AI) processors, FPGAs, and industrial microprocessors, and can power the supply rails in solid state drives (SSDs), optical transceivers, and a range of consumer, industrial and networking devices.

The ISL91302B dual/single output, multi-phase PMIC provides up to 20A of output current and 94 per cent peak efficiency in a 70mm2 package that is more than 40 per cent smaller than competitive PMICs, says Renesas.

The ISL91301A triple output PMIC and ISL91301B quad output PMIC deliver up to 16A of output power with 94 per cent peak efficiency. The programmable PMICs leverage Renesas’ R5 Modulation Technology to provide fast single-cycle transient response, digitally tuned compensation, and high 6.0MHz (maximum) switching frequency during load transients. Power supply designers can design boards with 2.0 x 2.0mm, 1.0mm low profile inductors, small capacitors, and only a few passive components.

Renesas PMICs do not require external compensation components or external dividers to set operating conditions. Each PMIC dynamically changes the number of active phases for optimum efficiency at all output currents. Their low quiescent current, light load efficiency, regulation accuracy, and fast dynamic response extend battery life for mobile devices.

The ISL91302B PMIC is available in three factory configurable options for one or two output rails. The dual-phase configuration supports 10A from each output, the triple-phase configuration supports 15A from one output and 5.0A from the second output and the quad-phase configuration supports 20A from one output. Input supply voltage range is 2.5 to 5.5V with I2C or SPI programmable Vout from 0.3 to 2.0V. The PMIC provides 75-microA quiescent current in discontinuous current mode (DCM). Integrated telemetry ADC senses phase currents, output current, input/output voltages, and die temperature, enable PMIC diagnostics during operation. Protection features include soft-start and fault protection against under-voltage, over-voltage, over-current, over-temperature and short circuit conditions.

The ISL91301A and ISL91301B PMICs are available in two factory-configurable options. The ISL91301A is a dual-phase, three output rail device, configured as 2+1+1 phase. The ISL91301B is a single-phase, four output rail device, configured as 1+1+1+1 phase. Current is 4.0A per phase for 2.8 to 5.5V supply voltage and 3.0A per phase for 2.5 to 5.5V supply voltage. The PMICs have I2C or SPI programmable Vout from 0.3 to 2.0V to provide 62-microA quiescent current in discontinuous current mode. Renesas reports ±0.7 per cent system accuracy for -10 to +85 degree C with remote voltage sensing. The ISL91301A and ISL91301B PMICs have soft-start and fault protection against under-voltage, over-voltage, over-current, over-temperature and short circuit conditions.

The ISL91302B PMIC is available now in a 2.551 x 3.670mm, 54-ball WLCSP package. The ISL91301A triple-output PMIC and ISL91301B quad-output PMIC are available now in 2.551 x 2.87mm, 42-ball WLCSP packages.

http://www.intersil.com/products

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About Smart Cities

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