Simpleware ScanIP software enhances its machine learning operation

Synopsys introduces a machine learning (ML) -based auto segmentation module for 3D image processing in the Simpleware ScanIP software. The ML-based option speeds up operation by up to a factor of 20 to 50, says the company and precisely automates segmentation for medical device design and pre-surgical planning.

The new ScanIP software module, Simpleware AS Ortho, uses automated algorithms to shorten segmentation time and produce accurate results significantly faster for medical image data, says the company.

The ML-based auto segmentation module builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.

The Simpleware AS Ortho module is specifically designed for segmentation needs in patients’ hips and knees. When applying this automated option with Synopsys’ ScanIP software to run analysis, users will easily see a 20 to 50 times faster rate of segmentation for clinical images, Synopsys reports.

The technology is scalable and helps to achieve more consistency and increased reliability in biomechanical compatibility. It can also dramatically streamline the workflow process in both pre-surgical planning and medical device design.

“Image segmentation of MRI and CT scans presents a significant challenge for our surgical and engineering multidisciplinary teams. We’re excited to collaborate with the Simpleware product group at Synopsys for solutions to this challenge,” said  Johann Henckel, MD orthopedic surgeon at the Royal National Orthopaedic Hospital, in the UK. “What is currently a laborious process that occupies significant engineering resources and time can now be completed quickly, accurately and with less variability, promising a scalable solution for generating high-fidelity patient specific models, surgical tools and bespoke implants,” he said.

“The demand for image-based modeling of human anatomy tools with ML-enabled intelligence is rapidly growing, especially in markets that include patient specific workflows for medical devices, surgical guides and planning, and in silico clinical trials,” said Terry Ma, vice president of engineering at Synopsys.

Synopsys’ Simpleware AS Ortho (Auto Segmenter for Orthopedics) launches in March 2020 as a Simpleware ScanIP software add-on module for hips and knees. Synopsys plans further modules to provide automated segmentation options for other anatomical regions. For users wanting any customisation or workflows applied to different anatomies, Synopsys’ Simpleware Custom Modeler option is also available as a tailored and automated software option.

http://www.synopsys.com

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Richardson RFPD introduces Sucoflex 550S test cables from Huber+Suhner

Claimed to offer “outstanding performance with excellent price-performance ratio and short delivery time” the latest family of test cables from Huber+Suhner is available from Richardson RFPD. The Arrow Electronics company has announced availability and full design support capabilities for Sucoflex 550S test cables.

According to the company, the cables have a lifetime of more than 100,000 flex cycles and are characterised by features such as a high electrical performance with an enhanced mechanical design for durability. The longer service life also results in less testing downtime and improved cost efficiency, adds Richardson RFPD.

Huber+Suhner’s patented rotary swaging technology gives the Sucoflex 550S the flexibility of a stranded inner conductor while maintaining the electrical properties of a solid inner conductor.

Key features include operation up to 50GHz, insertion loss of 3.41dB per metre, typical, phase and amplitude stability with flexure and movement, torque, crush and kink resistance and resistance to abrasion, moisture and dust.

The 50GHz Sucoflex 550S microwave cables are available now.

Richardson RFPD, an Arrow Electronics company, specialises in the RF, wireless, IoT and power technologies markets and has relationships with many of the industry’s top RF and power component suppliers. Richardson RFPD’s worldwide design centres and technical sales team provide comprehensive support for designing components or engineering complete solutions and support customers from prototype to production.

http://www.richardsonrfpd.com

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Infineon and Qualcomm enable standard solution for 3D authentication

A reference design developed by Infineon Technologies, working with Qualcomm Technologies is for 3D authentication based on the Qualcomm Snapdragon 865 mobile platform.

The reference design uses the REAL3 3D time of flight (ToF) sensor and enables a standardised integration for smartphone manufacturers.

At CES 2020, Infineon introduced the 4.4 x 5.1mm ToF sensor, describing it as the world’s smallest yet most powerful 3D image sensor with VGA resolution. It can be used for face authentication, enhanced photo features and authentic augmented

Andreas Urschitz, division president power management and multimarket at Infineon, commented: “3D sensors enable new uses and additional applications such as secured authentication or payment by facial recognition. We continue to focus on this market and have clear growth targets”.

Infineon develops the 3D ToF sensor technology in co-operation with the software and 3D time-of-flight system specialist pmdtechnologies.

From this month, Infineon’s REAL3 ToF sensor will enable the video bokeh function for the first time in a 5G-capable smartphone for optimal image effects even in moving images. Using the precise 3D point cloud algorithm and software, the received 3D image data is processed for the application. The 3D image sensor captures 940nm infrared light reflected from the user and the scanned objects. It also uses high-level data processing to achieve accurate depth measurements. The patented SBI (Suppression of Background Illumination) technology offers a wide dynamic measuring range from bright sunlight to dimly lit rooms for robust operation without loss of data processing quality.

pmdtechnologies is a fabless IC company headquartered in Siegen, Dresden and Ulm with subsidiaries in the USA, China and Korea. It claims to be the leading 3D ToF CMOS-based digital imaging technology supplier. Founded in 2002, the company owns over 350 worldwide patents concerning pmd-based applications, the pmd measurement principle and its realisation. The company operates in industrial applications.

http://www.infineon.com

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Three-phase SiC MOSFET IPM focuses on e-mobility

For e-mobility applications, a three-phase SiC MOSFET intelligent power module (IPM) from Cissoid has been designed to improve time to market for electric vehicle (EV) OEMs.

The IPM technology includes a three-phase water-cooled SiC MOSFET module with built-in gate drivers. For OEMs and electric motor manufacturers willing to adopt SiC-based inverters for more efficient and compact motor drives, the IPM is claimed to optimise the electrical, mechanical and thermal design of the power module and its proximity control for automotive and industrial markets.

The first product in this scalable platform, a three-phase 1200V/450A SiC MOSFET IPM, features low conduction losses, with 3.25mOhms on resistance and low switching losses, with 8.3mJ turn-on and 11.2mJ turn-off energies at 600V/300A. It reduces losses by at least a factor three, says Cissoid, compared with the highest performing IGBT power modules. Cissoid’s module is water-cooled through a lightweight AlSiC pin-fin baseplate for a junction-to-fluid thermal resistance of 0.15°C/W. The power module is rated for junction temperature up to +175 degrees C. The IPM withstands isolation voltages up to 3,600V (50Hz,  60 seconds).

 The built-in gate driver includes three on-board isolated power supplies (one per phase) delivering each up to 5W allowing it to easily drive the power module up to 25KHz and at ambient temperatures up to +125 degrees C. Peak gate current up to 10A and immunity to high dV/dt (>50KV/µs) enable fast switching of the power module and low switching losses. Protection functions include under-voltage lockout (UVLO), active Miller clamping (AMC), desaturation detection and soft shutdown (SSD).

Dave Hutton, CEO at Cissoid, believes: “With this new SiC intelligent power modules, which is the outcome of years of experience in the development of power modules and gate drivers for extreme temperature and voltage environments, we are happy to deliver our first IPM samples to early SiC adopters and to support the automotive industry in its transition towards highly efficient e-mobility solutions.”

http://www.cissoid.com

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