Hi-rel, rad-hard regulator, isolators and FET are for satellite power management

Renesas is targeting satellite power management with the ISL71001SLHM/SEHM point of load (PoL) buck regulator, ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver.

The ICs combine the board area savings and cost advantages of plastic packaging for space-grade projects missions in medium/geosynchronous Earth orbit (MEO/GEO) with longer lifetime requirements. They can also be specified for small satellites and higher density electronics where they reduce size, weight, and power (SWaP) costs, says Renesas.

The ICs also complement the radiation-tolerant plastic-package ICs Renesas introduced in 2017 for small satellites in low Earth orbit (LEO). Renesas says that its plastic IC offering supports multiple orbit ranges, balancing radiation performance and optimal cost for a variety of satellite subsystems and payloads.

“With every new mission, customers want more functionality, which requires larger satellite payloads and has traditionally translated into increased SWaP for the satellite systems,” said Philip Chesley, vice president, Industrial and Communications Business division at Renesas. He continued that the new ICs offer customers the “SWaP advantages of plastic packaging to save up to 50 per cent of the board area compared to ceramic-packaged devices, while maintaining the reliability and radiation assurance required for higher orbit missions with lifespans ranging up to and beyond 15 years.”

Traditionally, radiation-hardened (rad-hard) ICs were almost exclusively produced using hermetically sealed ceramic packages, which achieved the required reliability but had significant trade offs in terms of size and weight. The Renesas rad-hard plastic ICs help customers reduce their electronics footprint and cost without compromising performance, assured Renesas.

To ensure the plastic ICs adhere to the highest quality for operation in harsh space environments, the ICs have QMLV-like production level testing, and all devices will undergo radiation lot acceptance testing (RLAT).

The production test flow includes 100 per cent CSAM, x-ray, temperature cycling, static and dynamic burn-in, and visual inspection. It also aligns with the SAE AS6294/1 standard for plastic encapsulated microelectronics in space. Additional screening includes lot assurance testing per assembly and wafer lot product for HAST (highly accelerated stress test), life testing, and moisture sensitivity.

The rad-hard ICs are characterisation tested at a total ionising dose (TID) of up to 75krad(Si) for low dose rate (LDR) and at a linear energy transfer (LET) of 60MeV•cm2/mg or LET 86MeV•cm2/mg for single event effects (SEE). The ISL71001SEHM is rated at TID up to 100krad(Si) for high dose rate (HDR).

The ISL73033SLHM low-side driver and 100V GaN FET combines the GaN FET driver and GaN FET in a single package to simply gate design and improve efficiency. It is claimed to reduce area size by 20 per cent compared with an SMD 0.5 rad-hard MOSFET. Tolerance is 30A with 7.5mOhm (typical) RDS on with 100V VDS. The total gate charge is just 14nC (typical). The integrated driver features 4.5V regulated gate drive voltage and 3A/2.8A sink/source capability.

The ISL71610SLHM and ISL71710SLHM digital isolators are based on giant magneto-resistive (GMR) isolation technology, claimed to deliver better radiation tolerance compared with existing space grade optocouplers on the market. Other features are 2.5kV RMS isolation, 1.3A quiescent current, low EMI with no carrier or clock noise and up to 100Mbits per second data rates (ISL71610SLHM) or 150Mbits per second for the ISL71710SLHM.

The 6A ISL71001SLHM/SEHM buck regulator has 95 per cent peak efficiency, fixed 1MHz switching frequency and adjustable output voltage.

Customers can add the new rad-hard plastic ICs to their existing architecture with a new package type and production flow. The ISL71610SLHM and ISL71710SLHM ICs can also be combined with Renesas’ rad-hard and rad-tolerant CAN bus transceiver and RS-422 transceiver product families for use in serial communications systems.

The ISL71610SLHM, ISL73033SLHM and ISL71001SLHM are available now. The ISL71710SLHM will be available in September 2021 and the ISL71001SEHM will be available in Q4 2021.

https://www.renesas.com

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AcceleRate arrays support PICMG COM-HPC interconnect data rates

Artificial intelligence (AI) accelerators, ASIC emulators and next-gen edge computing benefit from the PICMG COM-HPC Interconnect, says Samtec, at the release of its AcceleRate HP high performance arrays. AcceleRate HP supports 112Gbits per second PAM4 extreme performance in a micro footprint.

Samtec’s AcceleRate HP high performance arrays feature an open pin field array which maximises grounding and routing flexibility. System architects can route high performance differential pairs, single ended signals and high current voltage rails via the same interconnect.

The 2.2, 2.4 and 2.2mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and with more ground vias around the differential signals.

The arrays include dense 0.635mm pitch, a low profile 5.0 and up to 10mm stack heights. Up to 400 pins are available. Samtec has also published a roadmap to develop arrays with 1,000 or more pins.

The AcceleRate HP high performance arrays are data rate compatible with PCIe 5.0 and 100 GbE. The array has a BGA termination for easy assembly and self-alignment.

Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high speed board-to-board, high speed cables, mid-board and panel optics, precision RF, flexible stacking and micro / rugged components and cables.

http://www.samtec.com

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Qi1.3 wireless charging reference design accelerates transmitter development

Following swiftly on the heels of the Wireless Power Consortium (WPC)’s Qi 1.3 specification, Microchip has released a compliant reference design. It includes everything needed to quickly develop a Qi 1.3-certified transmitter, says the company.

The Qi 1.3 specification requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet these requirements, Microchip’s wireless charging reference design includes the necessary tools and support for the seamless integration and certification of wireless charging systems in automotive and consumer applications.

The three-coil Qi 1.3 reference design integrates secure storage subsystem software with the wireless power microcontroller and enables custom topologies and foreign object detection (FOD) implementation.

Microchip is a regular member in the Wireless Power Consortium (WPC) and provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5.0W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

The reference design includes a Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. It also includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

The reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

Microchip’s dsPIC33C family of devices run the Qi application software and the company also offers the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority.

The Qi 1.3 wireless charging transmitter reference design is available for demonstrations and evaluations for qualified customers. The company will provide a license agreement to access the reference design software. Evaluation boards for these reference design will be available for purchase for qualified customers through Avnet in August 2021.

https://www.microchip.com   

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Mouser Electronics signs global distribution agreement with Telink Semiconductor

Low power radio frequency and mixed signal chips for the IoT from Telink Semiconductor are now available from Mouser Electronics, following the signing of a global distribution agreement.

Mouser will add Telink’s range of SoCs, starter kits and multi-protocol IoT products to its portfolio. Among the highlights of the range are the Telink TLSR827x series of low power, concurrent, multi-protocol IoT devices operating at the ISM 2.4GHz band. The devices support Bluetooth Low Energy 5.1, Bluetooth SIG Mesh, Zigbee, HomeKit, RF4CE, and 2.4GHz proprietary protocols. They are built on a 32-bit RISC-based microcontroller capable of running up to 48MHz and feature up to 32 general-purpose inputs/outputs (GPIOs), including a 14-bit ADC, I²C, SPI, I²S, and stereo audio output.

There is also the TLSR8278 audio RCU (remote control unit) starter kit features a button function and voice command function support and is therefore suitable for RF and IR remote control applications. The starter kit has 27 valid buttons and two-colour indicating LEDs. It also offers Google voice service.

Mouser also offer the TLSR825x series multi-protocol single-chip devices suitable for IoT and human interface device (HID) applications. The low power, concurrent devices support Bluetooth Low Energy 5.0 and up to eight antennae for indoor positioning in addition to standard Bluetooth 5.0 features. Designers can use the TLSR825X devices in a wide range of applications, including wearable devices, wireless toys, advanced remote controls, smart lighting, and smart home products.

Telink’s Kite Mesh Starter Kit is based on the TLSR8258 and features multiple PCBAs to implement Bluetooth Mesh applications. It is suitable for home automation and smart lighting, and includes multiple USB dongles for emulating gateways or mesh nodes, as well as a remote control PCBA to emulate remote controllers or wall switches. The mesh starter kit is supported by a range of PC tools and a software development kit to support rapid development of mesh applications.

https://www.mouser.com

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