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Dual-band Wi-Fi 5 and Bluetooth module extends battery life for the IoT

Tue, Mar 07, 2023

Extending the Infineon Airoc portfolio, the company has introduced the CYW43022 Wi-Fi 5 and Bluetooth module which extends battery life for IoT applications with up to 65 per cent power reduction.

The CYW43022 low power architecture results in up to a 65 per cent reduction in power usage during deep sleep mode, to extend the battery life for applications such as smart locks, smart wearables, IP cameras and thermostats.

Sivaram Trikutam, vice president of Wi-Fi product line at Infineon, said: “By optimising the sleep power for battery-operated IoT devices, consumers can now enjoy longer battery life compared to competing solutions. With the industry’s lowest power consumption for a Wi-Fi and Bluetooth combination, [the CYW43022] enables more devices to be smarter, connected, and more versatile in a wide range of environments,” he added.

The Aitoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth 5.3 device includes Wi-Fi network offloads and an embedded Bluetooth stack reducing power demands on host processors. To support designs with smaller antennas or designs that require longer reach, it includes a Class 1 Bluetooth power amplifier with +18dBm transmit power. To protect against hacker attacks, there is secure boot with firmware image authentication which requires signed Infineon firmware protects against hacker attacks.

Infineon’s Airoc wireless products, including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combinations with a broad portfolio of high-performing, reliable, low power products that deliver robust industry-leading performance.

Airoc products leverage a common software framework across Android, Linux, RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver differentiated products to market on time and on budget.

Infineon’s Airoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth is available now. IT will be exhibited by Infineon at Embedded World in Nuremberg, Germany (14 to 16 March) Hall 4A-138.

http://www.infineon.com

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Sensor uses motion and bone conduction to save space and power

Tue, Mar 07, 2023

Headsets and hearable devices can be reduced in size and power budget using the STMicroelectronics’ motion and bone-conduction sensor, said the company. The LSM6DV16BX can deliver a longer listening experience and superior hearing in TWS (true wireless stereo) headphones and AR / VR / MR headsets.
The integrated sensors can save space inside hearable devices including sports and general-purpose earbuds. It combines a six-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1kHz.

The LSM6DSV16BX contains ST’s Qvar charge-variation detection technology for user-interface controls such as touching and swiping.
The LSM6DSV16BX sensor embeds ST’s Sensor Fusion Low Power (SFLP) technology, specifically designed for head tracking and 3D sound, and the in-the-edge processing resources featured in ST’s third generation MEMS sensors, including finite state machine (FSM) for gesture recognition, the machine learning core (MLC) for activity recognition and voice detection, and adaptive self-configuration (ASC), which automatically optimises performance and efficiency. These help to reduce system latency while saving overall power and offloading the host processor.
The enhanced integration and edge processing save up to 70 per cent of system power consumption and 45 per cent of PCB area. In addition, the number of pin connections can be reduced by 50 per cent, saving external connections, and the package height is 14 per cent less than earlier MEMS inertial sensors from ST.
The LSM6DSV16BX comes with many software examples, available on ST MEMS GitHub FSM and MLC model zoo. These include pick-up gesture detection to automatically turn on some device’s services, in-ear and out-of-ear detection in TWS headsets and head gestures for 3D sound in headphones. To save developer time, without starting from scratch, pre-integrated application examples are available in X-Cube-MEMS1 package.
The LSM6DSV16BX is in production now, available in a 2.5 x 3.0 x 0.74mm VFLGA package.

http://www.st.com/

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Advantech bases MIC-733 AI computing on Nvidia’s Jetson AGX Orin

Tue, Mar 07, 2023

Industrial edge AI provider, Advantech, has released MIC-733, an Nvidia Jetson AGX Orin-based AI computing system.

It has sufficient computing power, flexible video input support and wireless communication for video + AI + 5G applications. Buttressed by 24/7 remote management support, the MIC-733 is claimed to be the best industrial edge AI computing system for AMR/AGV (automated mobile robot/autonomous guided vehicle) applications, with potential for use in smart agriculture and smart transportation.

The compact fanless system is capable of operating wide operating temperatures (-10 to around +60 degrees C) found in outdoor / harsh environments. The MIC-733 delivers a flexible array of expansion slots and multiple I/O including four USB 3.2, two Mini-PCIe and two M.2. Additionally, it offers iDoor and iModule expansion and support for diverse peripherals

There is also I/O module customisation available through the Mini-PCIe and full PCIe interfaces. This includes the use / modification of CANBus controllers, Cameralink frame grabbers, or PoE modules for IP cameras.

The Nvidia Jetson AGX Orin is a system on module designed for energy-efficient autonomous machines. It uses Nvidia AI software stacks with up to four CUDA cores and eight times the performance of the Nvidia Jetson AGX Xavier modules. They also support multiple sensors and the latest high-speed interfaces, said Advantech.

In order to integrate existing video with AI computing, MIC-733 provides support for multiple video inputs, for example GMSL, USB, and PoE. By inserting a GMSL card, MIC-733 can support two GMSL2 cameras. It is also equipped with four USB 3.2 Gen2 (10Gbits per second) for high data transmission USB cameras. With iModule expansion, the MIC-733 version can support eight USB 3.2 Gen2, four GbE PoE or eight GMSL2 cameras. To help implement AI video solutions at the edge, MIC-733 supplies up to 60W of power to cameras from four PoE ports (which can be upgraded from four LANs) to help customers integrate cameras. Customers can choose either four 15W per port or two 30W per port.

MIC-733 preserves Mini-PCIe expansion to support 4G / Wi-Fi modules for mobile communication. The growing demand for 5G communication means that the MIC-733 has a dedicated M.2 3052 for 5G applications.

Advantech has collaborated with Allxon to provide a 24/7 remote management service on the Nvidia Jetson edge AI and robotics platform, enabling large-scale deployment and device management through over-the-air (OTA) and out-of-band (OOB) service.

MIC-733 is also Azure IoT-certified with the Microsoft reference configuration.

http://www.advantech.com/en-eu

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Optical interconnect scales to AMD’s adaptive SoCs

Tue, Mar 07, 2023

At OFC, the optical communications and networking conference in San Diego, California (05 to 09 March), Ranovus has demonstrated a low power consumption, 800Gbits per second Ethernet interoperable link which is interoperable with AMD’s adaptive SoCs for AI / ML (artificial intelligence / machine learning) applications.

The Odin direct drive CPO 2.0 optical interconnect has 5pJ/bit energy efficiency and is claimed to be best-in-class for co-packaged, near-packaged optics and pluggable module form factors.

The company demonstrated interoperability of the AMD Versal adaptive SoCs with the co-packaged Odin 800G direct drive optical engine and third party 800G DR8+ retimed pluggable modules.

Ranovus’ Odin is a low latency, high density, protocol agnostic and standards-based optical engine that delivers massive optical interconnect bandwidth with industry-leading cost and power efficiency, claimed the company. Built on GlobalFoundries’ Fotonix monolithic RF / CMOS silicon photonics (SiPh) platform, Odin incorporates Ranovus’ proprietary RF CMOS, silicon photonics, laser and packaging technologies for volume manufacturing. Odin is well suited for next-generation data centre architectures built on co-packaged optics, near-packaged optics, and pluggable OSFP / QSFP-DD / OSFP XD optical modules.

Dr Christoph Schulien, head of Systems and high speed IC R&D of Ranovus, said that the inherent versatility enables hyperscale data centre providers to drastically reduce power consumption and optimise density and cost as they deploy novel hybrid data centre architectures in response to the insatiable growth in AI / ML workloads.

Yohan Frans, vice president, engineering at AMD, said: “We are proud of our collaboration with Ranovus in demonstrating the performance and versatility of monolithic silicon photonics interconnects as data centre and 5G customers deploy highly efficient and cost-effective systems for next generation workloads.”

The interoperability between CPO and pluggable modules is a key proof point that their interconnect technology supports the flexibility and scalability with the lowest power consumption sought by hyperscalers as they optimise their data centres for AI / ML workloads,” said Vladimir Kozlov the founder and CEO of Lightcounting.

Ranovus will demonstrate its Odin optical interconnect CPO, NPO and 800Gbits per second DR8+ pluggable module portfolio at the Ranovus booth 2019 and the GlobalFoundries booth 5216.

http://www.ranovus.com

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Dual-band Wi-Fi 5 and Bluetooth module extends battery life for the IoT

Sensor uses motion and bone conduction to save space and power

Advantech bases MIC-733 AI computing on Nvidia’s Jetson AGX Orin

Optical interconnect scales to AMD’s adaptive SoCs

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