Image sensor is based on Infineon’s pixel technology
Claimed to boost 3D camera system performance, the IRS2975C imager sensor uses pmdtechnologies’ indirect flight (i-ToF) technology and Infineon Technologies’
pixel technology. The sensor’s form factor and performance are engineered to deliver the highest possible operating range at an optimal power budget for i-ToF applications. The emerging i-ToF user cases are in smartphones, service robots, drones and IoT devices.
Infineon’s pixel technology includes 3D field engineering enabling best demodulation efficiency. A buried optical reflector elevates quantum efficiency (QE) to a level which has until now, only been reached by rear or back-side illumination (BSI) sensors, while maintaining the cost advantage of front-side illumination (FSI) sensors, said Infineon. Combined with the IRS9102C VCSEL driver, the IRS2975C reduces the bill of materials for camera modules and provides differentiating features for the high-volume smartphone segment.
The IRS2975C features a half-quarter video graphics array (HQVGA) resolution of 240 x 180 pixels with a chip size of 18mm2 for a 1/6 inch image circle. It offers high-sensitivity 10 micron pixels with SBI and enables highly integrated systems with low-power operation, continued Infineon. The imager is designed to support 2.8V supply rails. The device provides full laser safety functionality such as an eye protection mechanisms and can be customised in terms of output power.
The IRS2975C imager will enter mass production in early 2023.
