Latest News Archives - Page 155 of 577 - SmartCitiesElectronics.com

Low power LTE IoT modem includes terrestrial positioning support

Thu, Dec 15, 2022

The Qualcomm QCX216 LTE IoT modem is a Cat1.bis IoT-optimised LTE-modem which has integrated positioning support, claimed to enhance connectivity, location, and compute processing capabilities both on device and at the edge.

The Qualcomm QCX216 LTE IoT modem enables users to track assets and provide additional computing capabilities for IoT devices that need to process data.

The Qualcomm QCX216 LTE IoT modem is a cost-optimized Cat.1bis modem that can work globally and seamlessly on existing LTE cellular infrastructure. The modem supports multi technology scanning capability used in conjunction with features supported by the Qualcomm Terrestrial Positioning Service to enable customers to develop low-power applications for a variety of industries. It will also enable OEMs to build affordable IoT devices in smaller form factor.

It delivers IoT-optimised speeds without excessively impacting battery life, said Qualcomm. Battery life is critical for expanding IoT applications such as smart utility meters, trackers, e-mobility, parking meters, home automation and security, and other location-based applications.

“The Qualcomm QCX216 LTE IoT modem being a highly integrated and low-power LTE Cat1.bis chip is going to pave the way for massive IoT device deployments and will help device manufacturers to easily migrate from 2G to 4G network at a lower total cost of manufacture,” said John Mathew, chief executive officer, Cavli Wireless. “4G availability being worldwide and no roaming restrictions is also going to boost the penetration for use cases that require global cellular access,” he added.

Qualcomm has a technology roadmap which allows it to efficiently scale the technologies that launched the mobile revolution – including advanced connectivity, high-performance, low-power compute, on-device intelligence and more – to the next generation of connected smart devices across industries. The company says it, and its family of Snapdragon platforms, contribute to enabling cloud-edge convergence, transforming industries and accelerating the digital economy.

https://www.qualcomm.com

> Read More

Nvidia adds pre-trained models to TAO toolkit to boost AI development

Thu, Dec 15, 2022

The latest version of Nvidia’s TAO toolkit boosts developer productivity with the addition of AutoML capability, integration with third-party MLOPs (machine learning operations) services and new pre-trained vision AI models. The enterprise version now includes access to the full source code and model weights for pretrained models.

The toolkit is designed for efficient model training for vision and conversational AI. By simplifying complex AI models and deep learning frameworks, Nvidia said even developers without AI expertise can use the toolkit to produce AI models. Users can optimise model inference throughput with AI expertise or large training datasets using transfer learning to fine-tune Nvidia pre-trained models with developer’s own data. Models can be trained without the hassle of manually fine-tuning hundreds of parameters.

Other enhancements are access to virtual models from leading cloud providers and Kubernetes services like Amazon EKS or Azure AKS. It is also possible to simplify infrastructure management and scaling on cloud machine learning services such as Google Colab, Google Vertex AI, and Microsoft Azure Machine Learning.

Nvidia also announced new cloud integrations and third-party MLOps services, such as W&B and ClearML, to provide developers and enterprises with an optimised AI workflow. It is possible to build a new AI service or integrate into an existing one with REST APIs.

Developers can also create custom production-ready models optimised for specific environments and scenarios with TAO. Transformer-based pre-trained models (CitySemSegformer, Peoplenet Transformer) and retail-specific pre-trained models (RetailObjectDetection, RetailObjectRecognition, and ReIdentificationNet) can be accessed.

Nvidia highlighted a new feature which helps developers build object detection models without massive amounts of data. The use cases include detecting assembly line defects, translating particular phrases across languages, or managing city traffic.

http://www.nvidia.com

> Read More

Ventana launches RISC-V CPU for data centres at RISC-V Summit

Thu, Dec 15, 2022

At this week’s RISC-V Summit in San Jose, California, Ventana Micro Systems introduced Veyron V1. The data centre class RISC-V CPU runs at 3.6GHz and will be offered in the form of high performance chiplets and IP.

The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for data centre, automotive, 5G, AI and client applications, claimed Ventana Micro Systems. Its efficient microarchitecture also enables the highest single socket performance among competing architectures, said the company.

The efficient performance of the Veyron, combined with RISC-V’s open and extensible architecture optimises the workload for efficiency gains which are enhanced further through domain specific acceleration that will extend Moore’s Law to deal with the emerging energy and thermal constraints for data centres, the company said.

The standards-based Veyron V1 compute chiplet and reference platform are claimed to accelerate time to market by up to two years and reduce development costs by up to 75 per cent. Chiplet based solutions provide flexibility and are economical by right sizing compute, IO and memory while composable architectures leveraging chiplets allow companies to focus on innovation.

Ventana provides a software development kit (SDK) which includes an extensive set of software building blocks already proven on Ventana’s RISC-V platform.

The RISC-V CPU core is the centrepiece of the first compute chiplet solution with chiplets supplied by different companies. Ventana’s Veyron platform also enables integration of a flexible domain specific accelerator for hardware / software codesign.

Veyron V1 will be available in the second half of 2023 and is the first in a series of products from Ventana.

“Ventana has a world class team with an average of twenty plus years of experience bringing multiple new CPU architectures to market,” said Patrick Moorhead, founder and chief analyst at Moor Insights & Strategy. “Ventana is the first big core in RISC-V to show up, the only game in town, and has a jump on the market.”

Key features include a 5nm process technology, 16 cores per cluster and a high core count multi-cluster scalability up to 128 cores. There is 48Mbyte of shared L3 cache per cluster, advanced side channel attack mitigation for cybersecurity and I/O memory management and advanced interrupt architecture (AIA) system IP.

https://www.ventanamicro.com/

> Read More

Ventec introduces hydrocarbon laminate for RF and microwave applications

Wed, Dec 14, 2022

Expanding its hydrocarbon PCB laminate range, Ventec International introduces a new material for RF and microwave applications. The tec-speed 20.0 VTM1000i hydrocarbon laminate is the latest addition to the tec-speed 20.0 range of hydrocarbon-based PCB materials. It offers a level of thermal reliability and high Dk (9.8) and low Df (0.0023) that is typically seen only in PTFE materials, said the company. The new hydrocarbon laminate is a lower budget laminate for high-end RF applications, including satellite communications and 5G RF applications, said Ventec International.

Designed for antenna and communication systems, radar and aviation systems, tec-speed 20.0 VTM1000i is available in a range of dielectric thickness, from 0.38 to 3.81mm. It offers high decomposition temperature (Td) of 426 degrees C.

With regards to power integrity, the high Dk value (9.8 ± 0.0245 at 10Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, claimed Ventec.

Manufactured at Ventec’s state-of-the-art facilities based in Taiwan and China, tec-speed 20.0 VTM1000i is available worldwide via Ventec’s managed global supply chain, providing reliable, disruption-free delivery in Asia, Europe, and the Americas, said the company.

tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego, California, USA (24 to 26 January 2023) on booth 419.

Ventec International produces polyimide and high-reliability epoxy laminates and prepregs and is a specialist provider of thermal management and IMS solutions.

Ventec International Group supplies to the global PCB industry. It has volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specialises in advanced copper-clad glass reinforced and metal-backed substrates. Ventec materials, which include enhanced FR4, high-speed / low-loss- and high-performance IMS material technology, and a range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015.

http://www.venteclaminates.com

> Read More

Low power LTE IoT modem includes terrestrial positioning support

Nvidia adds pre-trained models to TAO toolkit to boost AI development

Ventana launches RISC-V CPU for data centres at RISC-V Summit

Ventec introduces hydrocarbon laminate for RF and microwave applications

About Smart Cities