Weartech-Sensors

Arrow Edge AI engineering services launches to boost support for advanced device development

Thu, May 09, 2024

Arrow Electronics is strengthening support for customers seeking to accelerate their embedded applications with artificial intelligence and machine learning by launching Arrow Edge AI engineering services. The resources include engineering consultancy, technical training, design services, ready-to-use software, and a curated selection of vendor-specific and independent tools.

“Analysts say AI will be one of the biggest technologies of the coming decade. In fact, AI algorithms are already embedded in many consumer and industrial applications and are an essential ingredient for reaching the latest performance and power efficiency targets,” said Morten Block, marketing director EMEA, Arrow Electronics. “Developing AI applications to run on edge computing platforms is no trivial task, so Arrow Edge AI engineering services is here to handle the challenges. With solutions for every stage of the development lifecycle, we help our customers keep their projects on track, from initial analysis and determining the right approach, to algorithm development, model training, optimisation, and deployment.”

Edge AI represents numerous opportunities for product developers to create innovative products, such as wearables, IoT gateways, smart sensors, autonomous machines, and others, to be deployed throughout factories, cities, homes, smart buildings, agriculture, utility networks, and retail. In addition to increasing performance and efficiency, edge AI can also enhance security and relieve dependence on continuous network connectivity.

The Arrow Edge AI engineering services portfolio covers the spectrum of edge AI applications, including object detection, facial recognition, industrial inspection, voice control, sound analysis, and touch sensing.

In addition to consulting and design assistance, Arrow Edge AI engineering services will offer extensive training, including AI theory, algorithm development, modelling, software tools, and applications such as predictive maintenance. Accessible through an online hub, the service will also provide learning resources, articles and videos to help users achieve their goals.

https://www.gotostage.com

> Read More

Rohm develops a new Op Amp that minimises current consumption

Thu, Apr 11, 2024

Rohm has developed a linear operational amplifier (op amp) – LMR1901YG-M – featuring the lowest* current consumption in the industry. This makes it ideal for amplifying sensor signals used to detect and measure temperature, flow rate, gas concentration, and other parameters in applications powered by internal sources (i.e. batteries).

In recent years, advanced control has been in increasing demand for various applications in consumer and industrial electronics. Therefore, there is an increasing need for accurate sensing of parameters relevant to the application – such as, temperature, humidity, vibration, pressure, and flow rate. Op amps whose main function is to amplify sensor signals for subsequent detection and/or analog-to-digital conversion, is a crucial component in the signal chain – greatly affecting both accuracy and power consumption. Rohm is developing op amps that satisfy the dual need for high accuracy and low current consumption. By further refining the circuit design based on original Nano Energy technology.

The LMR1901YG-M leverages original ultra-low power technology that thoroughly suppresses current increase caused by temperature and voltage changes to reduce current consumption to just 160nA (Typ.) – approximately 38% lower than that of general low power op amps. This not only extends the life of applications powered by internal batteries like electronic shelf labels, but also contributes to longer operating times for smartphones and other devices equipped with rechargeable batteries. At the same time, this low current consumption does not change over the temperature range of -40°C to +105°C – allowing stable low-power operation, even in environments where external temperatures fluctuate, including fire alarms and environmental sensors.

Other performance enhancements include 45% reduction of input offset voltage to just 0.55mV (Max. Ta=25°C) over general low-current op amps while a maximum input offset voltage temperature drift of 7V/°C is guaranteed. This enables high accuracy amplification of sensor signals. Capable of operating from 1.7V to 5.5V supply voltage and offering rail-to-rail input/output, LMR1901YG-M is suitable for a wide variety of applications in the industrial equipment and consumer markets. Rohm’s new op amp also complies with the automotive reliability standard AEC-Q100 – ensuring stable operation even under harsh conditions such as vehicle cabins without compromising functionality.

In addition to various technical documents necessary for circuit design and SPICE models for simulation (available free of charge on Rohm’s website), the LMR1901YG-M can be used with Rohm Solution Simulator to speed up time to market.

https://www.rohm.com

> Read More

ST boosts sensing creativity with new all-in-one MEMS Studio desktop software solution

Thu, Mar 28, 2024

ST’ MEMS Studio is a new all-in-one tool for MEMS sensor evaluation and development, connected closely with the STM32 microcontroller ecosystem and available for Windows, MacOS, and Linux operating systems.

By unifying the sensor-development workflow, from evaluation to configuration and programming, MEMS Studio accelerates development and simplifies bringing rich contextual awareness to users’ projects. Enhanced features help easily acquire and clearly visualise sensor data to explore the operating modes and optimise performance and accuracy. There are also tools for pre-built library testing, as well as convenient drag-and-drop algorithm creation for intuitive, no-code development of STM32 MCU firmware.

MEMS Studio supports the wide portfolio of ST MEMS sensors, including motion sensors, environmental sensors, and infrared sensors. It provides tools to explore and use all the sensors’ features including the finite state machine (FSM) and embedded edge AI in inertial modules for power-efficient inferencing directly in the sensor. These include creating and managing decision trees in sensors equipped with ST’s machine-learning core (MLC), monitoring interrupts status, and testing advanced features like FIFO, pedometer, and freefall detection embedded in the sensor.

MEMS Studio also offers a new experience for analysing sensor data in runtime and offline, where users can visualise, label, and edit the data for the best algorithm implementation. Spectrogram analysis and fast Fourier transform (FFT) are also available and help understand the sensor signal for the best detection of the sensing application target.

Users can choose from a wide variety of compatible development boards, including STM32 Nucleo expansion boards, sensor adapters, and ST’s multi-sensor evaluation kits. These comprise the SensorTile.box PRO, STWIN.box, and STEVAL-MKI109V3 professional MEMS adapter motherboard with adjustable power settings and a STM32F401VE MCU on-board.

As creative use of MEMS sensors continues to drive innovation in cutting-edge applications, MEMS Studio empowers designers to add new and more advanced functions in next-generation high-tech products. Its release promotes the development of smart appliances, medical wearables, and technology for digital healthcare, smart buildings and factories, robotics, asset tracking, and smart driving.

Consolidating and extending the features of established sensor-development tools including AlgoBuilder, Unico-GUI, and Unicleo-GUI, MEMS Studio is available now to download, free of charge, from https://www.st.com/mems-studio.

> Read More

ST expands into 3D depth sensing with latest time-of-flight sensors

Fri, Feb 23, 2024

ST has announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

The VL53L9 is a new direct ToF 3D LiDAR device with a resolution of up to 2.3k zones. Integrating a dual scan flood illumination, unique in the market, the LiDAR can detect small objects and edges and captures both 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low power module with its on-chip dToF processing, requiring no extra external components or calibration. Additionally, the device delivers state-of-the-art ranging performance from 5cm to 10 meters.

VL53L9’s suite of features elevates camera-assist performance, supporting macro up to telephoto photography. It enables features such as laser autofocus, bokeh, and cinematic effects for still and video at 60fps (frame per second). Virtual reality (VR) systems can leverage accurate depth and 2D images to enhance spatial mapping for more immersive gaming and other VR experiences like virtual visits or 3D avatars. In addition, the sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality or SLAM (simultaneous localisation and mapping).

ST is also announcing news of its VD55H1 ToF sensor, including the start of volume production and an early design win with Lanxin Technology, a China-based company focusing on mobile-robot deep-vision systems. MRDVS, a subsidiary company, has chosen the VD55H1 to add high-accuracy depth-sensing to its 3D cameras. The high-performance, ultra-compact cameras with ST’s sensor inside combine the power of 3D vision and edge AI, delivering intelligent obstacle avoidance and high-precision docking in mobile robots.

In addition to machine vision, the VD55H1 is ideal for 3D webcams and PC applications, 3D reconstruction for VR headsets, people counting and activity detection in smart homes and buildings. It packs 672 x 804 sensing pixels in a tiny chip size and can accurately map a three-dimensional surface by measuring distance to over half a million points. ST’s stacked-wafer manufacturing process with backside illumination enables unparalleled resolution with smaller die size and lower power consumption than alternative iToF sensors in the market. These characteristics give the sensors their excellent credentials in 3D content creation for webcams and VR applications including virtual avatars, hand modelling and gaming.

First samples of the VL53L9 are already available for lead customers and mass production is scheduled for early 2025. The VD55H1 is in full production now.

ST will showcase a range of ToF sensors including the VL53L9 and explain more about its technologies at Mobile World Congress 2024, in Barcelona, February 26-29, at booth 7A61.

https://www.st.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration