Infineon announces PSOC 4 Multi-Sense expanding capacitive sensing technology

Infineon has  expanded its capacitive sensing technology CAPSENSE with a new, proprietary inductive sensing technology, as well as a non-invasive and non-contact liquid sensing solution. With PSOC 4, developers now have endless possibilities to develop new HMI and sensing solutions. From sleek metallic product designs with touch on metal buttons, to waterproof touch buttons, and innovative ways of sensing liquids, PSOC 4 Multi-Sense unlocks new possibilities of sensing.

Infineon’s PSOC 4000T is the first device to feature the company’s fifth-generation CAPSENSE and Multi-Sense. The supported sensing technologies can be combined in a single PSOC 4 MCU to optimise performance (e.g., combination of capacitive and inductive sensing), enable new use cases (e.g., underwater inductive sensing buttons) or realize cost savings (e.g., system control plus liquid sensing). In addition, Infineon’s fifth generation CAPSENSE with “Always On” technology enables sensing at 10x lower power consumption and offers a 10x higher signal-to-noise ratio than previous devices.

Infineon’s new Multi-Sense capabilities in the PSOC 4 family include:

Inductive sensing – Based on a new and proprietary methodology which is less sensitive to noise and more robust than current state of the art approaches that suffer from external noise as well as manufacturability concerns. Infineon’s inductive sensing technology enables new HMI use cases, such as touch-over-metal, force touch surfaces and proximity sensing. It is highly complementary to capacitive sensing and enables modern, metal-based and waterproof designs with sleek form factors such as metal touch buttons on refrigerators or robust HMI for underwater devices such as cameras and wearables.

Liquid sensing – Non-invasive and non-contact liquid sensing capability with AI/ML based processing algorithm in PSOC 4 enables more cost-effective and accurate sensing than mechanical sensors and typical capacitive solutions. It is resistant to environmental factors such as temperature and humidity and can detect liquid levels with up to 10-bit resolution in various shapes of containers. The solution offers even more features that other liquid sensors cannot solve such as foam rejection, residue rejection and reliably work with varying air gaps between sensor and container. Liquid sensing on PSOC 4 brings more intelligence to applications managing liquids such as robot vacuum cleaner, soap dispensing in washing machine, coffee machines, humidifiers, etc.

CAPSENSE hover touch – Hover touch sensing supports new use cases where a direct touch of a button is not required. Hover touch can eliminate multiple components in certain applications such as springs and gaskets in cooktop touch panels. By bridging the airgap with hover touch, customers achieve significant bill-of-material (BOM) savings, while realising increased system performance, reduced design complexity, and faster time-to-market.

Infineon’s PSOC 4000T with fifth-generation CAPSENSE and new Multi-Sense capability is available now. A second device, the new PSOC 4100T Plus with higher memory and more I/Os, will be Multi-Sense-enabled in the second quarter of 2025, and all subsequent PSOC devices with CAPSENSE will incorporate this technology. The new PSOC 4000T series provides an upgrade path for PSOC 4000, PSOC 4000S and PSOC T 4700S based designs to fifth-generation HMI technology with software and package compatibility.

https://www.infineon.com/multi-sense

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Upgraded sensor board from ST accelerates plug-and-play evaluation

ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. is now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication , the new board lets users quickly evaluate sensors and handle demanding projects.

Engineers unveiled the STEVAL-MKI109D during a live tech lab, showing how to simply plug in a sensor module, connect a PC, and start analysing data in ST MEMS Studio. Using this all-in-one graphical environment, developers can visualise the sensor output, quickly fine-tune settings, configure features, and exercise the AI capabilities of ST sensors with a machine-learning core (MLC) and intelligent sensor processing unit (ISPU) inside. The tool provides advanced functions including power monitoring and supply voltage management that help optimise energy consumption and debugging.

ST’s MEMS portfolio contains inertial sensors, pressure sensors, biosensors, and digital and analog microphones offering many choices of speed, accuracy, full-scale range, and package style in industrial, consumer, and automotive grades. Extremely compact and robust, they are suited to diverse applications including consumer products, smartphones, wearables, smart-home devices, industrial sensing, safety equipment, healthcare, environmental monitoring, and many more. Automotive-grade devices target applications including navigation support, advanced driver assistance, and automated driving.

An evaluation module is available for each sensor type, mounted on a convenient DIL24 card with headers, ready to connect to the STEVAL-MKI109D board. Additional plug-and-play accessories are available, including biosensor electrodes and remote-sensing extension cables to quickly evaluate sensors when building proof-of-concept models and developing prototypes.

The STM32H5 MCU at the heart of the new board has the latest high-performing and efficient Arm® Cortex®-M33 core with extensive peripherals that enable faster, more convenient development. Customers’ sensor projects can target any of the over 1400 microcontrollers and microprocessors in the STM32 family. The MLC, finite-state machine (FSM), and ISPU embedded in select MEMS devices help optimise application performance and power consumption for superior functionality, responsiveness, and battery runtime.

https://www.st.com/mems-studio

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Omnivision launches newest generation of the World’s smallest shutter image sensor

Omnivision has announced the new OG0TC BSI global shutter (GS) image sensor for eye and face tracking in AR/VR/MR consumer headsets and glasses. For the first time ever, Omnivision is bringing its patented DCG high dynamic range (HDR) technology to the AR/VR/MR market in the 2.2-micron (µm) pixel OG0TC GS image sensor.

With a package size of just 1.64mm x 1.64mm, the OG0TC is an ultra-small and low-power image sensor for optimizing primarily inward-facing tracking cameras. This small form factor is key to industrial designs as multiple cameras are required for tracking all aspects of the face (eyes, brows, lips, etc.). The OG0TC is pin-to-pin compatible with Omnivision’s previous-generation BSI GS image sensor for easy upgrades.

“Ultra-low power consumption is critical for AR/VR battery-powered devices, and our OG0TC BSI GS image sensor reduces power by more than 40% over our previous-generation OG0TB sensor, which is already an extremely low-power device,” says Devang Patel, marketing director – IoT/Emerging, Omnivision. “Pin-to-pin compatibility makes the upgrade to the OG0TC easy for our customers, so they do not need to make any change to their design to save power and enjoy new features like DCG™ technology.”

Key features of the OG0TC image sensor include:
● The sensor is built on Omnivision’s PureCel Plus-S stacked-die technology.
● It features Omnivision’s patented DCG HDR technology and offers 400×400 resolution with a 2.2µm pixel in a 1/14.46-inch optical format.
● Nyxel technology enables the best quantum efficiency at the 940nm near-infrared (NIR) wavelength for sharp, accurate images of moving objects.
● It consumes less than 40% of the power at 30 frames per second (fps) compared with the previous-generation sensor.
● The sensor’s high modulation transfer function enables sharper images with greater contrast and more detail.
● It supports a flexible interface, including MIPI with multi-drop, CPHY, etc.

Patel adds, “We are excited to introduce our single-exposure DCG HDR technology for ghost-free image capture to the AR/VR market. It already has proven to be extremely successful in the security, mobile and automotive industries.”

https://www.ovt.com

 

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ST BrightSense image sensor ecosystem for advanced camera performance

ST has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and consumer applications ensure superior camera performance by designing-in ST BrightSense image sensors. By sampling all pixels simultaneously, unlike a conventional rolling shutter, global-shutter sensors can capture images of fast-moving objects without distortion and significantly reduce power when coupled to a lighting system.

ST BrightSense CMOS global-shutter sensors implement advanced backside-illuminated pixel technology. Their high sensitivity enhances low-light performance and permits fast image capture, enhancing responses such as obstacle avoidance in mobile robots and face recognition in personal electronics. The sensors’ advanced 3D-stacked construction allows an extremely small die area, easing integration anywhere space is limited especially in the final optical module, while enriching the products with advanced on-chip image processing for auto-exposure, correction, and calibration. Their MIPI-CSI-2 interface makes them ideal for embedded vision and edge AI devices.

ST’s cutting-edge sensor technologies are now available in a wide variety of markets through the ST BrightSense portfolio, highlighting industrial-grade products and 10-year longevity commitment. Widespread access to these sensors now lets developers bring high-performance machine vision to applications that face strict size and power constraints and challenging operating conditions. These include factory automation, scanning, domestic and industrial robots, VR/AR equipment, traffic monitoring, and medical devices.

ST’s new mass-market offering includes evaluation camera modules that integrate image sensor, lens holder, lens, and plug-and-play flex connector to enable instant integration of the image sensors. The modules offer a selection of tiny form factors down to 5mm2, various lens options to suit different application requirements, and a plug-and-play connector that allows easy swapping. A series of hardware kits helps developers integrate the sensors with various desktop and embedded computing platforms. Complementary software tools are available for free download on ST’s website, such as a PC-based GUI and Linux drivers that assist integration with popular processing platforms including STM32MP2 microprocessors.

The ST BrightSense global-shutter family currently comprises the VD55G0, VD55G1, and VD56G3 monochrome sensors with resolution from 0.38Mpixel to 1.5Mpixel, as well as the color VD66GY with 1.5Mpixel. The sensors, along with their evaluation camera modules, and development boards are in production now.

https://www.st.com/brightsense

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