PMICs halve current to boost efficiency, says Silicon Labs

Energy-friendly power management ICs (PMICs) from Silicon Labs, the EFP01 family are companion chips for EFR32 wireless devices and EFM32 microcontrollers. They enable developers to choose the optimal battery type and chemistries for their applications. Target applications include IoT sensors, asset tags, smart meters, home and building automation, security, and health and wellness products. The PMICs also enable developers to control a product’s power supply over multiple output rails and voltages.

Developers often use PMICs to meet the low-power requirements of IoT designs, but choosing the right one can be challenging. The EFP01 PMICs “provide a turnkey power management companion solution for our wireless SoC and MCU families, combined with Simplicity Studio tools, reference designs, sample applications and ‘PMIC-aware’ wireless stacks for easy development,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs.

“If you want the easiest to configure, lowest power wireless solution, Silicon Labs’ EFP01 PMIC with Wireless Gecko is the best choice,” he continued. “The EFP01 is optimised for our IoT connectivity platforms, eliminating the need to incorporate multiple vendor reference designs into a schematic or layout.”

EFP01 PMICs include low-voltage DC/DC converters and regulators and a flexible mechanism to manage the power rails in a system design.

The EFP01 PMIC family features include flexible I/O voltage, a wide input voltage range (0.8 to 5.5V) to support an array of batteries. They also have wide output voltages to support a variety of peripherals, microcontrollers and radios.

The PMICs enable buck and boost voltage conversion as well as combined boost and buck (boost bootstrap) supporting low-voltage, high-current rails for IoT products requiring coin cell batteries and higher transmit power (up to +20 dBm).

They also feature multiple output power rails which allows an IoT product to be powered by one low-cost PMIC. This uses less board real estate and simplifies software/hardware design, says Silicon Labs.

The EFP01 offers quiescent current as low as 150 nA to reduce sleep current and enhance battery life.  It also supports coulomb counting which offers vital information for battery life estimation and preventive maintenance.

Samples and production quantities of EFP01 PMICs in a 3.0 x 3.0mm QFN20 package are available now. Silicon Labs also provides three development boards – the SLWRB4179B radio board and two PMIC evaluation boards. Simplicity Studio offers energy profiler and network analyser tools, wireless stacks and reference designs. It is available free of charge.

http://www.silabs.com

> Read More

Digi-Key adds biometric systems with Fingerprint Cards signing

Digi-Key Electronics has signed a global distribution partnership with Fingerprint Cards to offer the Swedish company’s standalone, compact biometric fingerprint sensors.

Fingerprint Cards’ products are found in hundreds of millions of devices and applications, says the company, and are used billions of times every day, for identification and authentication of access or payment systems.

“We are excited about the new partnership with Fingerprint Cards,” said David Stein, vice president, global supplier management at Digi-Key. “Biometric authentication is growing as it continues to be implemented into new applications and devices. Digi-Key now offers customers an easy path to develop secure devices with integrated capacitive fingerprint sensor technology.”

Michel Roig, senior vice president, payments and access at Fingerprints. “Digi-Key will help us reach out and find new potential markets and application areas.”

Fingerprint Cards is a biometrics company, based in Sweden.

Digi-Key Electronics is headquartered in Thief River Falls, Minnesota, USA. It is an authorised global, full-service distributor of electronic components. It offers more than 10.2 million components, with over 2.2 million in stock and available for immediate shipment, from over 1,200 quality name-brand manufacturers.

Its Marketplace Product provides a singular shopping experience for all things related to technology innovation — IoT, industrial automation, test and measurement and more.

http://www.digikey.com

> Read More

NIR sensor saves power for mobile 3D optical sensing systems

3D optical sensing applications such as face recognition, payment authentication can operate at much lower power than alternative implementations, using the CGSS130, CMOS global shutter sensor (CGSS) near infra red (NIR) image sensor by ams.

The CGSS130 enables battery-powered devices to run for longer between charges while supporting sophisticated sensor functions.

According to ams, the CGSS130 sensor is four times more sensitive to NIR wavelengths than other image sensors on the market today, and detects reflections from very low power IR emitters in 3D sensing systems. It is the IR emitter that consumes most of the power in face recognition and other 3D sensing applications, says ams, which means using the CGSS130 sensor will enable manufacturers to extend battery runtime in mobile devices.

The 1.3Mpixel sensor also creates the opportunity to implement face recognition in wearable devices and in other products which are powered by a very small battery, or to enable a new range of applications beyond face recognition as the increased sensitivity extends the measurement range for the same power budget.

Following ams’ partnership with CMOS image sensor supplier, SmartSens Technology, the first 3D active stereo vision (ASV) reference design based on the CGSS130 was produced. The 1.3Mpixel stacked BSI sensor offers the highest quantum efficiency at 940nm, claims ams and, by supplying all main parts of the 3D system (illumination, receiver, software) it enables superior system performance with lower costs and a faster time to market.

The stacked BSI process used to fabricate the CGSS global shutter image sensors, results in a small footprint of 3.8 x 4.2mm. The sensor produces monochrome images with an effective pixel array of 1080 x 1280 at a maximum frame rate of 120 frames per second. The high frame rate and global shutter operation produce clean images free of blur or other motion artefacts, says ams.

The sensor also offers a high dynamic range (HDR) mode in which it achieves dynamic range of more than 100dB. It also implements advanced functions such as external triggering, windowing, and horizontal or vertical mirroring.

The CGSS130 is available for sampling.

ams is demonstrating the CGSS130 at CES, in the Venetian Tower, Suite 236 / 30th floor.

https://ams.com

> Read More

Integrated IP and software develop contextually-aware IoT devices

At CES this week, Ceva will demonstrate its SenslinQ integrated hardware IP and software platform, designed to streamline the development of contextually-aware IoT devices.

The platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings, explains the company by aggregating sensor fusion, sound and connectivity technologies.

Contextual awareness adds value and enhances the user experience of smartphones, laptops, augmented reality/virtual reality (AR/VR) headsets, robots, hearables and wearables. The SenslinQ platform centralises the workloads that require an intimate understanding of the physical behaviours and anomalies of sensors. It collects data from multiple sensors within a device, including microphones, radars, inertial measurement units (IMUs), environmental sensors, and time of flight (ToF) sensors, and conducts front-end signal processing such as noise suppression and filtering on this data. It applies algorithms to create “context enablers” such as activity classification, voice and sound detection, and presence and proximity detection. These context enablers can be fused on a device or sent wirelessly via Bluetooth, Wi-Fi or NB-IoT, to a local edge computer or the cloud to determine and adapt the device to its environment.

The customisable hardware reference design is composed of an Arm or RISC-V microcontroller, CEVA-BX DSPs and a wireless connectivity island, such as RivieraWaves Bluetooth, wi-fi or Dragonfly NB-IoT platforms, or other connectivity standards provided by the customer or third parties. Each components of these three components are connected using standard system interfaces.

The SenslinQ software is comprised of a portfolio of ready-to-use software libraries from CEVA and its ecosystem partners. Libraries include the Hillcrest Labs MotionEngine software packages for sensor fusion and activity classification in mobile, wearables and robots, the ClearVox front-end voice processing, WhisPro speech recognition and DSP and artificial intelligence (AI) libraries. There is also third party software components for active noise cancellation (ANC), sound sensing and 3D audio.

The accompanying SenslinQ framework is a Linux-based hardware abstraction layer (HAL) reference code and application programming interfaces (APIs) for data and control exchange between the multiple processors and sensors.

https://www.ceva-dsp.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration