STMicroelectronics integrates AI to MEMS sensors

Signal processing and AI algorithms have been combined in MEMS (micro electromechanical systems) sensors by STMicroelectronics. The Intelligent Sensor Processing Unit (ISPU) injects local decision-making while substantially saving space and power, says the company.

The ISPU combines a digital signal processor (DSP) able to run AI algorithms and a MEMS sensor on the same silicon. In addition to a reduction in size, compared to system-in-package devices, the ISPU is also claimed to cut power by up to 80 per cent. Merging sensor and AI puts electronic decision-making at the edge, said ST, where products enabled by smart sensors are able to sense, process, and take actions, in what has been called the Onlife Era, fusing technology and the physical world.

The Onlife Era acknowledges living with continuous assistance from connected technologies, enjoying natural, transparent interactions, and seamless transitions, with no discernible distinction between online and offline, ST explained. The ISPU allows the migration of intelligent processing into sensors that support the fabric of life, or as ST puts it: no longer at the edge but in the edge. 

The proprietary low power DSP can be programmed in C, a language familiar to many engineers. It also allows quantised AI sensors to support full- to single-bit-precision neural networks. This ensures superior accuracy and efficiency in tasks such as activity recognition and anomaly detection by analysing inertial data, said ST.

“While technically challenging, integrating ST’s sensors on the same piece of silicon with our ISPU does improve sensor-based systems from an online experience to an Onlife one,” said Andrea Onetti, executive vice president, MEMS Sub-Group, at STMicroelectronics.

“It advances the sensor’s features to speed decision-making by reducing data transfers, enhancing privacy by keeping data local, while reducing size and power consumption, which cuts costs,” he added.

“Moreover, the ISPU is easily programmable with commercial AI models and can ultimately operate with all of the leading AI tools.” 

ST’s proprietary, C-language-programmable DSP is an enhanced 32-bit RISC (reduced instruction set computing) machine. It is extensible (in the chip-design phase) for dedicated instructions and hardware components. The processor offers a full precision floating point unit, uses a fast four-stage pipeline, operates from 16-bit variable-length instructions, and includes a single-cycle 16-bit multiplier. Interrupt response is four cycles. 

ST’s sensors with ISPUs will be packaged in standard 3.0 x 2.5 x 0.83mm packages and will be pin compatible with earlier models available from the company, for ease of upgrades.

ST also claims that combining the sensor and ISPU save five to six time power saving compared with system-in-package approaches in sensor-fusion applications. They also show a two to three times saving in Run mode. 

http://www.st.com

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NFC IC provides security tamper detection for IoT applications

Certified security is combined with a tamper status detection mechanism and battery-free sensing in the NTAG 22x DNA StatusDetect IC family by NXP. The ICs measure a change in ambient conditions, such as moisture, liquid fill level or pressure and allow developers to combine secure authentication with opening status detection or condition monitoring of products to help maintain a secure supply chain and product integrity. 

Physical products can be authenticated by leveraging the NTAG 22x DNA IC’s secure unique NFC (SUN) authentication message feature. This allows manufacturers to cost-effectively combat counterfeits and supply chain fraud, said NXP. 

The electronic tamper status detection of the ICs enables manufacturers or product users to verify a product’s unauthorised opening. By measuring capacitive changes in an item’s environmental conditions such as moisture, pressure or fill level, upon a simple tag readout, it is also possible to ensure product quality remains intact or capture digital sensing data for healthcare, retail or industrial applications. 

According to NXP, the inclusion of security-certified NFC sensing turns a tag into a simple battery-less sensing device to detect a physical product’s first opening status, or a change in its specific ambient condition. It can help manufacturers protect product integrity, whilst enabling a new level of intelligence to assure product quality 

The NTAG 22x DNA family is Common Criteria EAL3+ -certified, and features a powerful, cryptographically secure authentication message that dynamically changes on every NFC phone tap, making the taps unclonable, without requiring a user application. 

The NTAG 22x DNA StatusDetect also includes configurable conductive or capacitive tamper detection, with once-open status irreversibly stored and protected in the IC memory without the need for a dedicated app. The conductive mode is suitable for tamper-evident labels and seals fixed on to a product or its package. The capacitive mode is suitable to integrate the tag into a physical product, and is also harder to reconstruct by a fraudster, said NXP.

The StatusDetect ICs can also be used as a passive sensing device to detect an environmental change influencing the capacitance value, interpreted with a mobile or cloud-based application. This facility allows new applications for medical IoT devices, such as a plaster that can detect moisture levels for wound care, fill level sensing for smart injectable dosage devices. It can also be used for consumer products as refill reminders based on package fill levels and leak detection. 

Security features include a 7byte identifier, a SUN message authentication using an AES-128 key and has user memory protected with 32-bit password or with mutual authentication with AES-128 key.

The StatusDetect devices have capacitive measurement with up to 64 granular steps and automated mirroring of UID, NFC counter and status value into IC’s user memory as part of NFC-NDEF message, secured with a SUN message code.

The ICs are available in sawn and bumped wafer format (120 and 75 micron) and with an internal tuning capacitance of 50pF.

http://www.nxp.com

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JEDEC-compliant multimedia card saves space

Two industrial-grade, embedded multimedia cards (eMMC) have been announced by Alliance Memory. The 4Gbyte ASFC4G31M-51BIN and 8Gbyte ASFC8G31M-51BIN are designed for solid-state storage in consumer, industrial, and networking applications. Each 11.5 mm by 13 mm 153-ball FBGA package integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software. 

The devices comply with the JEDEC eMMC v5.1 industry standard, supporting boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write levelling, high-priority interrupt (HPI), secure trim / erase, and high speed HS200 and HS400 modes. The ASFC4G31M-51BIN and ASFC8G31M-51BIN are also backwards-compatible with eMMC v4.5 and v5.0. 

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, infotainment, CCTV, surveillance, automation, point of sale (PoS) systems, and emerging embedded applications. 

According to Alliance Memory, the eMMCs simplify designs for fast and easy system integration, speeding up product development and time to market. They also save space by eliminating the need for an external controller. The FTL software provides high reliability and stable performance with wear levelling and bad block management. 

The ASFC4G31M-51BIN and ASFC8G31M-51BIN operate over an industrial temperature range of -40 to +85 degrees C and offer programmable bus widths of x1, x4, and x8. The devices’ NAND memory with internal LDO can be powered with a single 3.0V supply voltage, and the controller can be powered by 1.8V or 3.0V dual supply voltages. 

Samples and production quantities of the eMMCs will be available in Q1 2022, with lead times of 12 weeks. 

Alliance Memory provides critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64kbit to 8Gbit. 

http://www.alliancememory.com

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Battery charger IC is designed for low voltage charging for wearables

A battery charger IC has been designed by Rohm for low-voltage charging. The BD71631QWZ is suitable for wearables like wireless ear buds and thin, compact IoT devices such as smart displays powered by rechargeable batteries.

The need for safer, higher density rechargeable batteries has led to the development of new battery types, including all- or semi-solid types and using novel materials for the electrode part and batteries that adopt different terminal compositions. Many of the latest rechargeable batteries are small and thin, requiring low voltage charging in the 2.0 to 3.0V range. There are currently no battery charger ICs that can handle a wide voltage range, says Rohm.

The BD71631QWZ battery charger IC supports low voltage charging of Li-ion but also new types of rechargeable batteries such as all-solid and semi-solid state models. The IC achieves low voltage charging over a wide range from 2.0 to 4.7V by improving the stability of the internal circuit

Unlike general battery charger ICs that provide a fixed voltage, the BD71631QWZ battery charger IC allows the charge voltage to be easily set by simply changing the external resistor, reducing design load when changing batteries. The original package technology results in a compact package just 0.4mm thick, which is 60 per cent lower than conventional products in this market to make devices smaller and thinner. Each charging characteristic like charge/termination current can be set for CCCV charging, providing an optimal charging environment for thin, compact IoT and wearable devices usng the latest rechargeable batteries.

In addition to devices using low voltage and single-cell Li-ion rechargeable batteries, the battery charger IC can be used in wearable devices, such as wireless ear buds, electronic pens, e-cigarettes, smart displays or tags and other compact IoT devices.

An evaluation board, BD71631QWZ-EVK-001, is also available.

Rohm Semiconductor develops and manufactures a large product range from SiC diodes and MOSFETs, analogue ICs such as gate drivers and power management ICs to power transistors and diodes to passive components. 

http://www.rohm.com/eu

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