New Silicon Labs Wi-Fi 6 plus Bluetooth modules for embedded IoT applications

Mouser is now shipping the new SiWx917Y wireless modules from Silicon Labs. The SiWx917Y wireless modules provide ultra-low-power Wi-Fi 6, Bluetooth® Low Energy (LE) 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart homes, consumer, industrial, and healthcare applications.

The Silicon Labs SiWx917Y series are fully integrated, shielded modules with a dedicated wireless processing subsystem, an application processing subsystem (MCU), and an advanced security engine. They have a rich set of peripherals framed by an intelligent power management subsystem that includes an antenna (or RF-pin) and worldwide RF regulatory certifications, simplifying development and certification processes.

The SiWx917Y modules’ processing subsystem consists of a network wireless processor (160MHz), baseband digital signal processing, an analog front end, a 2.4 GHz RF transceiver, and a power amplifier. The application processing subsystem features an ARM Cortex-M4 with FPU at 180 MHz, a large, embedded SRAM, Flash, PSRAM, and an option for external Flash/PSRAM. The modules come with modular radio-type approvals for various countries, including the US (FCC), Canada (IC/ISED) and Japan (MIC), and follow the relevant EN standards (including EN 300 328 v2.2.2) for conformity with directives and regulations in EU and UK.

https://eu.mouser.com

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Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.

Launched in 2024, Veros encompasses Synaptics’ entire wireless portfolio of solutions characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the IoT.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” said Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.

“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”

The SYN461x family extends Synaptics’ Triple Combo series into ULP, highly optimised IoT applications where it delivers reliable connectivity of up to 50 Mbps while extending battery life and maximising range. Features include:

● Up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimised architecture
● Low-power Bluetooth/BLE—with Channel Sounding for precise distance measurement
● IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks
● Integrated Tx/Rx switch, LNAs, and PAs that reduce area BOM and system cost while simplifying design by only requiring a direct antenna connection
● Low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs (25% reduction in typical board cost)
● An integrated processor that offloads the host application processor to help minimise system power consumption
● Secure Boot to help ensure system integrity

https://www.synaptics.com

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ST’ new integrated wireless MCUs combine extra features and performance with power efficiency

ST has announced the next generation of its STM32 power-efficient short-range wireless microcontrollers (MCUs) that simplify connecting consumer and industrial devices to the IoT.

The new STM32WBA6 series is used in connected, smart devices like wearable healthcare and wellness monitors, animal collars, electronic locks, remote weather sensors, and more. Packing extra memory and digital system interfaces, while preserving energy efficiency the new MCUs can handle richer functionality in emerging new product designs.

The STM32WBA6 MCUs also embed SESIP3 and PSA Level3 certifiable security assets, such as cryptographic accelerators, TrustZone isolation, random generator, and product lifecycle that will contribute and enable ST customers to reach compliancy towards the upcoming RED and CRA regulations.

“Robust and standardised wireless connectivity is central to the IoT’s success. Our new STM32WBA6 MCUs bring richer features and larger memory to address high-end applications in smart home, health, factory, and agriculture,” said Patrick Aidoune, General-Purpose MCU Division General Manager, STMicroelectronics. “Our customers can now increase the pace of development to meet demands from consumer and industrial markets for new products that deliver more features and increased capabilities within reduced size and power constraints.”

The wireless subsystem in the new STM32WBA6 microcontrollers supports Bluetooth, Zigbee, Thread, Matter, and other protocols operating in the 2.4GHz frequency band, and allows communication using multiple protocols concurrently. It’s how a system like a smart-home bridge can communicate with the homeowner’s mobile app over Bluetooth and simultaneously manage lights or thermostats through mesh networking such as Zigbee. The STM32WBA6 series also contains single-protocol variants for simpler and more cost-conscious applications.

https://www.st.com

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Infineon announces PSOC 4 Multi-Sense expanding capacitive sensing technology

Infineon has  expanded its capacitive sensing technology CAPSENSE with a new, proprietary inductive sensing technology, as well as a non-invasive and non-contact liquid sensing solution. With PSOC 4, developers now have endless possibilities to develop new HMI and sensing solutions. From sleek metallic product designs with touch on metal buttons, to waterproof touch buttons, and innovative ways of sensing liquids, PSOC 4 Multi-Sense unlocks new possibilities of sensing.

Infineon’s PSOC 4000T is the first device to feature the company’s fifth-generation CAPSENSE and Multi-Sense. The supported sensing technologies can be combined in a single PSOC 4 MCU to optimise performance (e.g., combination of capacitive and inductive sensing), enable new use cases (e.g., underwater inductive sensing buttons) or realize cost savings (e.g., system control plus liquid sensing). In addition, Infineon’s fifth generation CAPSENSE with “Always On” technology enables sensing at 10x lower power consumption and offers a 10x higher signal-to-noise ratio than previous devices.

Infineon’s new Multi-Sense capabilities in the PSOC 4 family include:

Inductive sensing – Based on a new and proprietary methodology which is less sensitive to noise and more robust than current state of the art approaches that suffer from external noise as well as manufacturability concerns. Infineon’s inductive sensing technology enables new HMI use cases, such as touch-over-metal, force touch surfaces and proximity sensing. It is highly complementary to capacitive sensing and enables modern, metal-based and waterproof designs with sleek form factors such as metal touch buttons on refrigerators or robust HMI for underwater devices such as cameras and wearables.

Liquid sensing – Non-invasive and non-contact liquid sensing capability with AI/ML based processing algorithm in PSOC 4 enables more cost-effective and accurate sensing than mechanical sensors and typical capacitive solutions. It is resistant to environmental factors such as temperature and humidity and can detect liquid levels with up to 10-bit resolution in various shapes of containers. The solution offers even more features that other liquid sensors cannot solve such as foam rejection, residue rejection and reliably work with varying air gaps between sensor and container. Liquid sensing on PSOC 4 brings more intelligence to applications managing liquids such as robot vacuum cleaner, soap dispensing in washing machine, coffee machines, humidifiers, etc.

CAPSENSE hover touch – Hover touch sensing supports new use cases where a direct touch of a button is not required. Hover touch can eliminate multiple components in certain applications such as springs and gaskets in cooktop touch panels. By bridging the airgap with hover touch, customers achieve significant bill-of-material (BOM) savings, while realising increased system performance, reduced design complexity, and faster time-to-market.

Infineon’s PSOC 4000T with fifth-generation CAPSENSE and new Multi-Sense capability is available now. A second device, the new PSOC 4100T Plus with higher memory and more I/Os, will be Multi-Sense-enabled in the second quarter of 2025, and all subsequent PSOC devices with CAPSENSE will incorporate this technology. The new PSOC 4000T series provides an upgrade path for PSOC 4000, PSOC 4000S and PSOC T 4700S based designs to fifth-generation HMI technology with software and package compatibility.

https://www.infineon.com/multi-sense

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