ST reveals cable-free connectivity for eUSB accessories, devices and industrial applications

New short-range wireless point-to-point transceiver ICs from STMicroelectronics remove the need for cables and connectors in consumer-friendly accessories and personal electronics like digital cameras, wearables, portable hard drives, and small gaming terminals. They also address data-transfer challenges in industrial applications such as rotating machinery.

As a cost-effective cable replacement, ST60A3H0 and ST60A3H1 transceivers let designers create products with slim, aperture-free cases that can be stylish, water-resistant, and allow convenient wireless docking. Self-discovery with instant mating saves pairing, while low power consumption preserves battery runtime. They operate in the 60GHz V-band and provide eUSB2, I2C, SPI, UART, and GPIO tunnelling.

Consuming 130mW in eUSB rx/tx mode and just 90mW for UART, GPIO, and I2C modes, and with a 23µW shutdown mode, energy demand is minimal. As the devices can handle exchanges at up to 480Mbit/s, consistent with the USB 2.0 High Speed specification, wireless connections can deliver cable-like speed and low latency.

The ST60A3H1 has an integrated antenna that eases final system design. It comes in a compact 3mm x 4mm VFBGA package. The ST60A3H0 is designed for connecting an external antenna, giving flexibility to address diverse applications. It has a smaller, 2.2mm x 2.6mm footprint.

In industrial environments, wireless connections with these transceivers deliver benefits including safe galvanic isolation and immunity to environmental hazards such as dust and humidity. The devices are also ideal for rotating machinery and instruments such as radars and lidars, as well as mobile equipment like robotic arms. Being free from mechanical wear, their lifetime is not limited by the number of rotations. This ensures greater reliability than slip rings, particularly for high data rate signals, at a lower cost than fiber-optic rotating joints (FORJ).

The transceivers are easy to use without installing software drivers or protocol stack. In addition to enhancing end-user experiences, they enable fast, efficient contactless product testing and debugging, including loading firmware over the air (FOTA), during manufacture and after sales.

http://www.st.com/en/wireless-connectivity/60-ghz-contactless-products.html

> Read More

Infineon introduces lower cost Bluetooth long-range module for low power applications

Infineon has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.

According to a recent report by ABI Research future use cases will demand additional improvements across almost all metrics. These include industrial IoT applications such as sensing, robotics, beacons, smart home, and asset tracking. In response, Infineon’s CYW20822-P4TAI040 Bluetooth module delivers unparalleled connectivity and performance, enabling customers to create innovative products in the IoT and consumer electronics space.

With extensive experience in delivering certified Bluetooth and Bluetooth LE modules, Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimised for cost, size, power, and range.

“Infineon is thrilled to expand its Bluetooth portfolio with the introduction of the CYW20822-P4TAI040 Bluetooth module to help designers get to market faster,” said Anurag Chauhan, Director of Marketing for the Bluetooth product line at Infineon Technologies. “As a leader in the IoT area in delivering innovative new Bluetooth LE solutions, this new module is a testament to our customer commitment. This new module delivers low power, long range, and excellent RF performance to meet our customers evolving needs.”

Infineon’s CYW20822-P4TAI040 Bluetooth LE module is currently sampling. More information is available at https://www.infineon.com/CYW20822-P4TAI040

> Read More

u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity  

u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52. These modules, designed for industrial applications, are based on the u-blox UBX-R52 cellular chip and are tailored for integrated and concurrent positioning and wireless communication needs. Typical IoT use cases include fixed and mobile applications such as metering and utility, asset tracking and monitoring, as well as healthcare.

A set of new features embedded within the u-blox UBX-R52 chip will allow users to dispense with additional components to design their products. SpotNow is a new positioning feature unique to u-blox, which provides position data with a 10 m accuracy within a couple of seconds. It is meant for occasional tracking applications such as recycling waste dumpsters, elderly trackers, or cleaning machines. The uCPU feature allows users to run their own software within the chip without using an external MCU. The uSCM (Smart Connection Manager), on the other hand, is designed for automatic connectivity management to achieve either best performance or lowest power consumption, for example when a connection is lost and needs to be re-established.

The new u-blox R52 series also introduces a new combo module designed to offer simultaneous GNSS and cellular connectivity – an important attribute for applications requiring continuous or cyclic tracking. The u-blox SARA-R520M10 combo module comes equipped with an integrated u-blox M10 GNSS receiver and ensures concurrent tracking with low-power consumption, better TTFF, and improved RF sensitivity. It is tailored for users who seek the simplicity of a pre-integrated cellular and GNSS solution.

Many LTE-M modules only offer an RF output power of 20-21 dBm, whereas the new R52 series offers 23 dBm, ensuring stable connectivity in challenging coverage conditions. The LEXI-R52 provides the same features as the SARA-R52, but in a smaller form factor (16 x 16 x 2 mm), ideal for ultra-small applications like wearables.

Samples are available now, with volume production scheduled for Q3 2024.

https://www.u-blox.com

> Read More

HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip

HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.

Supporting an SPI interface, the chip brings seamless connectivity to a wide range of IoT devices, such as multi-channel temperature and humidity sensors. The joint partnership to develop the BSC2000 demonstrates the path to extreme-low power in IoT devices used in building, home and industrial automation; consumer electronics and wearables; smart transportation; agriculture; medical; and automotive markets.

“HaiLa is pleased to have collaborated with Presto Engineering on the silicon implementation of the BSC2000, and we’re excited to showcase our technology at CES 2024,” said Derek Kuhn, President and CEO, HaiLa Technologies, Inc. “This is another step forward in our mission to enable sustainable scaling of IoT over existing wireless infrastructures, helping end-users meet their net-zero goals through a massive reduction in battery waste. Presto’s long experience in ultra-low power RFID and NFC allowed HaiLa to complement its team with expert resources embedded into the development process, delivering the completed BSC2000 ASIC as one team.”

According to Cedric Mayor, CEO, Presto Engineering, “We are proud to support HaiLa on a key industry initiative to help reduce carbon footprint of connected objects. This project has shown that pushing the limit of IoT power efficiency is not only possible but a game changer for mitigating the cost and waste of battery usage.” Mayor adds, “With our deep expertise in RF mixed-signal chip design and ultra-low power architectures, we look forward to extending our partnership with HaiLa to jointly address new business opportunities leveraging their unique IP in future projects.”

HaiLa’s passive backscatter foundational technology is protocol-agnostic. As the most common wireless local area network (WLAN) technology in residential, enterprise and industrial environments globally, HaiLa has focused its first adaptation on Wi-Fi as a key infrastructure enabler for IoT deployments.

https://www.haila.io

https://www.presto-eng.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration