Nordic Semiconductor disrupts IoT with low power wireless SoCs

A fourth generation, low power wireless SoC has been introduced by Nordic Semiconductor. The first SoC in the nRF54 series is the nRF54H20 and suitable for disruptive IoT applications demanding high processing power, excellent energy efficiency and security, said Nordic Semiconductor.

The nRF54 series of Bluetooth Low Energy (Bluetooth LE) SoCs add to Nordic’s portfolio of the nRF51, nRF52, and nRF53 series. At the same time it introduces a new hardware architecture fabricated on the GlobalFoundries 22FDX process node. 

Capable of supporting Bluetooth 5.4 and future Bluetooth specifications, plus LE Audio, Bluetooth mesh and Thread, Matter, the nRF54H20 will be the foundation for a new wave of revolutionary IoT end products, promised Nordic Semiconductor. Its combination of advanced features will enable complex end products that have previously been unfeasible, claimed the company.

The nRF54H20 comprises multiple Arm Cortex-M33 processors and multiple RISC-V coprocessors. The processors are clocked at up to 320MHz and each processor is optimised for a specific type of workload.  

The dedicated application processor features double the processing power (2x CoreMark) of the application processor in the nRF5340 SoC. The nRF54H20’s computing resources are supported by integrated memory comprising 2Mbyte non-volatile memory and 1Mbyte of RAM. The SoC’s level of integration will enable developers to shrink designs by replacing multiple components, such as application microcontroller, external memory and wireless SoC, with a single, compact device. In addition to advanced wearables, smart home, medical and LE Audio applications, the nRF54H20 SoC can be used for applications demanding complex machine learning (ML) and support for sensor fusion at the edge.

The nRF54H20 features several new digital and analogue interfaces, including a high performance external memory interface (400Mbytes per second), high speed USB (480bits per second), two I3C peripherals, a CAN FD controller and a 14-bit ADC. These interfaces are in addition to analogue and digital interfaces integrated on the nRF54H20.

The multi-protocol 2.4GHz radio ensures the nRF54H20 SoC is the first in the world to offer -100dBm RX sensitivity when receiving a 1Mbit per second Bluetooth LE signal, according to Nordic Semiconductor. Combined with up to 10dBm TX power, the nRF54H20 offers an ample link budget for enhanced robustness and longer range. The radio RX current consumption is just half that of the nRF5340, said Nordic. For applications that are mainly receivers, such as earbuds and wearables, the low energy consumption allows for more compact batteries or extended battery life, explained Nordic Semiconductor.

The nRF54H20 is a secure low power, multi-protocol SoC and is designed for PSA Certified Level 3, the highest level in the Platform Security Architecture (PSA) Certified IoT security standard. The SoC supports security services such as secure boot, secure firmware update and secure storage. It has cryptographic accelerators that are hardened against side-channel attacks and tamper sensors that detect an attack in progress and take appropriate action.

The nRF54H20 SoC is available for sampling now to selected customers.

http://www.nordicsemic.com

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Multi-protocol wireless module opens up less congested RF spectrum

Using a CYW55573 SoC by Infineon Technologies, Murata’s LBEE5XV2EA supports 2.4GHz and 5GHz operation and can also transmit and receive data in the 6GHz frequency band. As a result, users will not be limited to overcrowded areas of the RF spectrum but will be able to access to frequencies that are much less congested.

The LBEE5XV2EA also has Bluetooth 5.3 functionality built in, which includes LE (low energy) Audio, for enhanced audio quality with a low power budget.

 The module incorporates 20 / 40 / 80MHz channels, with 1024-QAM modulation and a 2×2 MIMO antenna arrangement. This combination allows increased levels of data throughput, up to 1.2Gbits per second, said Murata. 

The module is suitable for audio / video streaming, video conference systems as well as virtual reality (VR) and augmented reality (AR) equipment.

The module uses Murata’s own high performance components which result in a “significantly smaller” form factor, said the company. Dimensions are just 12.5 x 9.4 x 1.2mm.

It is certified to FCC / IC and TELEC and has passed conductive tests for CE, make the standards compliance process straightforward, confirmed the company. 

Murata manufactures electronic components, modules and devices. Its range includes ceramic capacitors, resistors / thermistors, inductors / chokes, timing devices, buzzers, sensors and EMI suppression filters. The company is a ceramic capacitor manufacturer and also manufactures Bluetooth and Wi-Fi modules, board-mount DC/DC converters and both standard and custom AC/DC power supplies.

Established in 1944, Murata is headquartered in Japan and has European offices in Finland, France, Germany, Hungary, Italy, the Netherlands, Spain, Switzerland and the UK.   

http://www.murata.com

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Infineon makes Secora Pay available in 28nm

Payment cards will have the capability to be offered in new, innovative designs, said Infineon, as it introduces its Secora Pay card payment technology is available on 28nm chip technology.

The Secora Pay platform allows manufacturers to efficiently produce robust dual interface cards for payment and multi-application use cases, explained Infineon Technologies.

The introduction of 28nm chip technology is believed to be the first 28nm technology card payment technology with embedded non-volatile memory. It is intended to side step the semiconductor shortages experienced in mature technology nodes.

The product family uses a security controller with certified software integrated into coil on module (CoM) chip modules. The devices use standardised inlays for easy and fast card production which are compatible with Secora Pay products on 65nm, 40nm and 28nm technology. One inlay sheet fits the existing and new Secora Pay products. 

The CoM system offers maximum flexibility in card design, said Infineon. It uses inductive coupling technology with copper wired card antennas. It is therefore perfectly suited for future market trends such as environmentally friendly cards made of recycled and ocean-bound plastic or wood, as well as high-performance dual-interface metal or LED cards.

Secora Pay products support the highest throughput in card production with minimal resources for manufacturing highly robust dual-interface cards, said Infineon. New services based on Secora Pay’s NFC tag enable further use cases such as initial card activation as well as authentication for online banking and for loyalty programmes.

“In recent years, touchless payment experience with dual-interface payment cards has become a global standard, among others also driven by the Covid-19 pandemic,” said Tolgahan Yildiz, head of payment solutions at Infineon’s connected secure systems division.

The Secora Pay portfolio us engineered to enable manufacturing and issuance of high quality dual-interface payment cards for high transaction performance with reliable security for trusted seamless payments, he added.

The global dual-interface payment card market is expected to grow at a compound annual growth rate of six percent from 2022 to 2027, starting from an estimated 2.6 billion units in 2022.

The 28nm technology products offer a simple onboarding process or migration path for card manufacturers, claimed Infineon. They are backwards-compatible with existing Secora Pay products in terms of card production, antenna design, personalisation and product certification for contactless and personalised performance, enabling contactless transactions within 155 milliseconds.

Product versions supporting the latest Visa and Mastercard applications are available now with extremely long approval life time. Certified applets for American Express, Discover and others will follow later this year, confirmed Infineon.

http://www.infineon.com

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Infineon includes Bluetooth 5.5 in Airoc SoCs

The newly release Bluetooth 5.4 specification is integrated in Infineon’s Airoc CYW20829 Bluetooth LE SoC. According to Infineon, with the right combination of low power and high performance, Airoc CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation and automotive designs.

CYW20829 is a dual-core Arm M33 device where one M33 core is reserved as the Bluetooth controller, and the second Arm Cortex-M33 is available for customer applications. The CPU subsystem provides 256k RAM, XIP interface for external flash, and a rich set of peripherals including CAN. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys and cryptography acceleration.

The recently released Bluetooth Core Specification 5.4 adds several significant capabilities to the existing specification, including PAwR (periodic advertising with response), encrypted advertisement data (EAD) and Le GATT security levels characteristic. PAwR enables energy-efficient, bi-directional communication in a large scale one-to-many or star topology. EAD provides a standardised approach to the secure broadcasting of data in advertising packets, advised Infineon.

With PAwR, thousands of Bluetooth 5.4-enabled electronic shelf labels (ESL) and sensors will have bidirectional communication with a single access point. Messages can contain commands, sensor data values or other data, as defined by the application layer. EAD enables the encrypted data over-the-star network to be authenticated and decrypted only by devices that have shared the session key previously. Additionally, LeGATT security levels characteristic enables devices to identify the security mode and level for GATT functionality. The combination of these features enable low power, efficient radio usage and secure star networks that can be deployed in large scale ESL and sensor applications.

“With Infineon’s AIROC CYW20829 Bluetooth LE SoC, our customers can achieve great RF performance, the latest Bluetooth features, built-in security, rich set of peripherals, and low power, all in one device,” said Shantanu Bhalerao, Vice President of the Bluetooth product line at Infineon. 

Airoc CYW20829 has best-in-class RF link budget, claimed Infineon, with an integrated power amplifier providing 10dBm of transmit output power and receive sensitivity of -98dBm for LE 1Mbits per second and -106dBm for LE Long Range 125kbits per second. 

The Airoc CYW20829 is supported by the ModusToolbox development environment which enables developers to accelerate time-to-market for Bluetooth-enabled IoT solutions.

The SoC is currently sampling to select customers.

http://www.infineon.com

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