Infineon introduces lower cost Bluetooth long-range module for low power applications

Infineon has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.

According to a recent report by ABI Research future use cases will demand additional improvements across almost all metrics. These include industrial IoT applications such as sensing, robotics, beacons, smart home, and asset tracking. In response, Infineon’s CYW20822-P4TAI040 Bluetooth module delivers unparalleled connectivity and performance, enabling customers to create innovative products in the IoT and consumer electronics space.

With extensive experience in delivering certified Bluetooth and Bluetooth LE modules, Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimised for cost, size, power, and range.

“Infineon is thrilled to expand its Bluetooth portfolio with the introduction of the CYW20822-P4TAI040 Bluetooth module to help designers get to market faster,” said Anurag Chauhan, Director of Marketing for the Bluetooth product line at Infineon Technologies. “As a leader in the IoT area in delivering innovative new Bluetooth LE solutions, this new module is a testament to our customer commitment. This new module delivers low power, long range, and excellent RF performance to meet our customers evolving needs.”

Infineon’s CYW20822-P4TAI040 Bluetooth LE module is currently sampling. More information is available at https://www.infineon.com/CYW20822-P4TAI040

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Nordic-powered module provides Bluetooth LE audio connectivity

Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The SoC is designed for advanced Bluetooth LE audio applications, as well as sophisticated metering, wearable, smart home, industrial, and medical use cases. Measuring just 16.5 by 13.0 by 2.5 mm, the ‘BTM-N340X’ module supports LE Audio and its Low Complexity Communication Codec (LC3), which together enable higher quality, lower power wireless audio streaming compared with existing Classic Bluetooth audio solutions.

The module employs the nRF5340 SoC’s dual Arm Cortex-M33 processors – providing a high performance application processor capable of DSP and Floating Point (FP) alongside a fully programmable, ultra low power network processor. The application core manages the LC3 codec, while the Bluetooth LE protocol is supervised by the network processor.

“The BTM-N340X module has been designed for a wide range of applications, aiming in particular to provide enhanced audio experiences via Bluetooth LE Audio,” says Bob Wu, CTO at Rayson Technology. “It enables one device to stream audio to multiple pairs of wireless headphones, and can facilitate audio broadcasts through public address systems, such as in airports and museums. This module is also compatible with smart speakers and home audio systems.”

The module’s ultra-low power consumption is made possible due to the nRF5340’s power-optimised multiprotocol radio, which offers a TX current of 3.4 mA (0 dBm TX power, 3 V, DC/DC) and RX current of 2.7 mA (3 V, DC/DC). The sleep current is as low as 0.9 µA. Additionally, because the cores can operate independently, developers have the flexibility to optimise performance for power consumption, throughput, and low latency response.

Two flexible antenna options are available for the module—a pre-certified U.F.L Connector and a PCB pin out—depending on the product application. The module is designed to operate within a temperature range of -40 to +85°C.

“The dual processors made the nRF5340 SoC an excellent choice for this module’s LE Audio applications,” says Wu. “The large memory capacity, radio sensitivity, and low power consumption were also major drawcards. In addition to the excellent technical capabilities of the chip, the high level of support from Nordic was a key factor when making our selection.”

https://www.nordicsemi.com

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Infineon goes beyond standard Wi-Fi with lates AIROC device

The latest addition to Infineon Technologies’ AIROC portfolio is the Airoc CYW5551x. This single device combines Wi-Fi 6 / 6E performance and advanced Bluetooth connectivity, making it suitable for a host of IoT applications.

The AIROC CYW5551x Wi-Fi 6/6E and Bluetooth 5.4 family delivers secured, reliable 1×1 Wi-Fi 6 / 6E (802.11ax) connectivity that goes beyond the standard, said Infineon. This is combined with advanced low power Bluetooth connectivity. The optimised CYW55512 is a dual-band Wi-Fi 6 solution and the CYW55513 is a tri-band Wi-Fi 6 / 6E device. Both feature power-efficient designs that are suitable for use in smart homes, industrial applications, wearable devices and equipment and other small factor IoT applications, said the company.

“Infineon’s new CYW5551x family brings the range, reliability, and network robustness from our 2×2 Wi-Fi 6/6E CYW5557x family of devices to an IoT optimised family,” said Sivaram Trikutam, vice president of Wi-Fi Products of Infineon. “As part of the company’s digitalisation and decarbonisation strategy, this family is optimised for very low power consumption, making it ideal for battery-operated devices like wearables and IP cameras,” he said. They are also tuned for best performance across a wide temperature range, enabling them to serve industrial and infrastructure applications such as electric vehicle charging and solar panel controls, logistics.

The AIROC CYW551x family offers support for the 6GHz band for Wi-Fi 6E, delivering lower latency and reduced interference. Bluetooth 5.4 low energy (LE) with Audio is range and power optimised with up to 20dBm transmit power. 

Other features include improved multi-layer security (PSA Level 1-certifiable) and design versatility supported by a wide ecosystem of module and platform partners. 

The devices feature Linux, RTOS and Android support, and have a fully validated Bluetooth stack and sample code to accelerate development time.

Infineon’s AIROC CYW55512 and CYW55513 are sampling now. The CYW5512 will be commercially available in March 2024, and the CYW55513 will be commercially available in June 2024. 

http://www.infineon.com

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Nordic Semiconductor PMIC for embedded BLE is available from Rutronik

The nPM1300 power management IC (PMIC) from Nordic Semiconductor is now available at Rutronik. The IC integrates essential functions required for embedded Bluetooth Low Energy designs with hard reset functions for one or two buttons, accurate battery indication, a system level watchdog, power failure warning, and recovery from a failed startup in a single device. The level of integration and compact package reduces the number of components required and simplifies system design, said Rutronik.

It is designed to provide efficient power control for Nordic’s nRF52 and nRF53 series SoCs and ensures support for wireless networks such as Bluetooth LE, Thread, Zigbee or Low Energy Audio. 

The nPM1300 is also power efficient and includes accurate measurement functions for monitoring charge level and estimating battery life. It can be used with USB-C compatible chargers for lithium-ion, lithium polymer, and lithium iron phosphate batteries up to 1000mAh. The nPM1300 has four individually controllable power rails including two high performance buck regulators with a 200mA current limit and two 100mA load switches or 50mA LDOs. The PMIC has an operating temperature range of -40 degrees C to +85 degrees C.

The battery charger complies with JEITA and has a termination range of 3.5 to 4.45V and charge current from 32 to 800mA. The input regulator has an input range of 4.0 to 5.5V and output from 4.0 to 5.5V unregulated. USB current limit is 1500mA and the design includes overvoltage protection at 22V transient. 

Other features include an input regulator with USB support, an 800mA charger, ship- and hibernate modes and five general purpose I/Os and three LED drivers.

The nPM1300 PMIC can be used in a choice of applications for wearable devices, handheld entertainment devices, personal health and medical devices and rechargeable smart home sensors.

Rutronik Elektronische Bauelemente was founded in 1973 and is an independent family-owned company based in Ispringen, Germany. It has over 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, for comprehensive customer support in Europe, Asia and North America. 

The company focuses on high-growth future markets, identified as advanced materials, advanced measurement, processing and analytics, advanced robotics, automation, biotechnology, energy and power, future mobility, IIoT and internet of everything, industry 4.0, medical and healthcare, and transportation, logistics and supply chain.

To serve customers in these future markets, the Rutronik Automotive, Embedded, Power, Smart and System Solutions groups bundle expertise, specific product portfolios, and consultancy support. The services range from competent technical support in product development and design-ins, through the diverse product portfolio of leading manufacturers, to the company’s software and hardware solutions with partly patented Rutronik IP.

http://www.rutronik.com

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