u-blox announces new ultra-compact LTE Cat 1bis cellular modules

u-blox has announced an expansion to its range of R10 products for the fast-growing LTE Cat 1bis cellular connectivity market. Predicted by analyst firm Techno Systems Research Co., Ltd to account for 43.6% of all non-handset cellular devices by 2029, LTE Cat 1bis is expected to be the best-selling cellular technology for the Internet of Things (IoT) for the next four to five years.

The new u-blox LEXI-R10 Global provides an ultra-compact 16 x16mm LTE Cat 1bis solution that can be used worldwide in size-constrained IoT applications such as people or pet trackers and wearables. The LEXI-R10 Global is the world’s smallest single-mode LTE Cat 1bis module with indoor location and a US MNO certified core.

Meanwhile, the new SARA-R10 series brings the same capabilities as the LEXI-R10 Global to u-blox’s popular SARA form factor. With 2G and 3G sunsets continuing globally, the SARA-R10 offers product designers using 2G and 3G u-blox SARA modules a straightforward upgrade path to 4G LTE – the most widely available global cellular standard today and for many years to come.

The LEXI-R10 and SARA-R10 offer the option to embed an eSIM, and both modules also include an integrated Wi-Fi Sniffer, providing Indoor localisation via the u-blox CellLocate service based on both a Wi-Fi and cellular networks.

One of the variants is the SARA-R10M10, the world’s smallest LTE Cat 1bis module with embedded Global Navigation Satellite System (GNSS) capable of concurrent communication and tracking. It is the ideal solution for asset tracking and telematics applications that demand continuous connectivity as well as indoor and outdoor positioning anywhere in the world, thanks to the blend of GNSS, Wi-Fi scan and global LTE coverage. This module is also 50% smaller than u-blox’s previous LTE Cat 1bis combo, the LENA-R8M10.

The new u-blox R10 modules give product designers a 4G cellular connectivity solution for IoT applications that require medium data rates, worldwide portability, ultra-low power consumption and compact sizes.

https://www.u-blox.com

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TI’s SimpleLink wireless microcontroller enables reliable long-range communication

Mouser Electronics, is now stocking the CC1354P10 SimpleLink wireless microcontroller (MCU) from Texas Instruments. The CC1354P10 device, optimised for low-power wireless communications, features on-chip over-the-air update capabilities and advanced security features. The CC1354P10 SimpleLink wireless microcontroller enables long-range and reliable communication in a range of applications, including building security systems, smart meters, HVAC, medical, wired networking, portable electronics, home theatre and entertainment, and connected peripherals.

The Texas Instruments CC1354P10 is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller. The CC1354P10 device includes wireless protocol support for Thread, Zigbee, Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects, and proprietary systems. The CC1354P10 also supports Matter, an industry-unifying, IP-based connectivity protocol that streamlines the development of IoT applications while allowing seamless integration into a variety of ecosystems for smart homes, industrial automation, consumer electronics, smart agriculture, healthcare, and more.

The CC1354P10 device is part of the SimpleLink platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that share a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform allows users to add any combination of the portfolio’s devices into a design, allowing 100 percent code reuse when design requirements change. The multi-band wireless MCUs offer pin-to-pin compatibility from 352KBytes of Flash up to 1MByte of Flash in the 7 mm2 QFN package for maximum design scalability.

https://www.mouser.com

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Ceva launches multi-protocol wireless platform IP family to accelerate enhanced connectivity

Ceva has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.

The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications, with the following key features:
• Wi-Fi 6 optimised for cost-sensitive IoT applications,
• Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
• IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
• Optimised co-existence scheme for efficient concurrent communications
• Pre-integrated with a low power multi-protocol radio at TSMC 22nm process

With its modular architecture, the Ceva-Waves Links family is highly versatile to meet customers’ needs, leveraging the latest Ceva-Waves wireless IPs. Upcoming Links platforms may include:
• Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
• Next generation Bluetooth for Channel Sounding and High Data Throughout
• UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
• Optimised co-existence schemes for each specific configuration
• Pre-integrated radio solutions, including partner and customer’s own technology, to address a wide range of configurations and foundry process nodes

For more information, visit https://www.ceva-ip.com

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u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor. They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.

ALMA-B1 and NORA-B2 are designed for a wide range of IoT applications, including industrial automation, healthcare, and smart home. ALMA-B1 is a high-end wireless MCU, while NORA-B2 brings ultra-low power to less complex applications. In the indoor positioning example, ALMA-B1 could act as an anchor point due to its vast processing capabilities, while the power efficiency of NORA-B2 makes it suitable for asset tracking tags.

According to ABI Research, Bluetooth LE device shipments are expected to roughly double by 2028. At the same time, new applications unleashed by AI / EdgeML and sensor fusion trigger the need for additional and stronger requirements, including higher security, more processing power, and efficient battery consumption.

Powered by the nRF54H20 and the nRF54L15 Nordic low-power multiprotocol SoCs, ALMA-B1 and NORA-B2 provide IoT devices with the processing power for edge computing and machine learning without additional components. With more than twice the processing power of previous Bluetooth LE modules, ALMA-B1 can even replace general-purpose MCUs in a compact solution.

Both modules also offer a significant reduction in power consumption. NORA-B2 consumes up to 50% less current compared to previous generations of Bluetooth LE modules. This translates into smaller batteries or longer battery life in end products.

Designed for PSA Certified Level 3, ALMA-B1 and NORA-B2 provide the highest levels of IoT security. In addition to features like secure boot, secure storage, secure debug interfaces, and hardware crypto accelerators, both modules include next-generation security features like physical tamper detection and protection against side-channel attacks.

The sizes of the modules (10 x 11 mm or 10 x 14 mm) save considerable space and facilitate migration from other u-blox’s modules. Both modules come with global certifications.

ALMA-B1 and NORA-B2 are available as wireless MCUs. Both modules offer two antenna options: an antenna pin or an embedded PCB antenna.

https://www.u-blox.com

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