Weartech-Comms / Bluetooth / Wireless Archives - Page 6 of 19

Ceva launches multi-protocol wireless platform IP family to accelerate enhanced connectivity

Thu, Apr 11, 2024

Ceva has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.

The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications, with the following key features:
• Wi-Fi 6 optimised for cost-sensitive IoT applications,
• Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
• IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
• Optimised co-existence scheme for efficient concurrent communications
• Pre-integrated with a low power multi-protocol radio at TSMC 22nm process

With its modular architecture, the Ceva-Waves Links family is highly versatile to meet customers’ needs, leveraging the latest Ceva-Waves wireless IPs. Upcoming Links platforms may include:
• Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
• Next generation Bluetooth for Channel Sounding and High Data Throughout
• UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
• Optimised co-existence schemes for each specific configuration
• Pre-integrated radio solutions, including partner and customer’s own technology, to address a wide range of configurations and foundry process nodes

For more information, visit https://www.ceva-ip.com

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u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

Thu, Apr 04, 2024

u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor. They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.

ALMA-B1 and NORA-B2 are designed for a wide range of IoT applications, including industrial automation, healthcare, and smart home. ALMA-B1 is a high-end wireless MCU, while NORA-B2 brings ultra-low power to less complex applications. In the indoor positioning example, ALMA-B1 could act as an anchor point due to its vast processing capabilities, while the power efficiency of NORA-B2 makes it suitable for asset tracking tags.

According to ABI Research, Bluetooth LE device shipments are expected to roughly double by 2028. At the same time, new applications unleashed by AI / EdgeML and sensor fusion trigger the need for additional and stronger requirements, including higher security, more processing power, and efficient battery consumption.

Powered by the nRF54H20 and the nRF54L15 Nordic low-power multiprotocol SoCs, ALMA-B1 and NORA-B2 provide IoT devices with the processing power for edge computing and machine learning without additional components. With more than twice the processing power of previous Bluetooth LE modules, ALMA-B1 can even replace general-purpose MCUs in a compact solution.

Both modules also offer a significant reduction in power consumption. NORA-B2 consumes up to 50% less current compared to previous generations of Bluetooth LE modules. This translates into smaller batteries or longer battery life in end products.

Designed for PSA Certified Level 3, ALMA-B1 and NORA-B2 provide the highest levels of IoT security. In addition to features like secure boot, secure storage, secure debug interfaces, and hardware crypto accelerators, both modules include next-generation security features like physical tamper detection and protection against side-channel attacks.

The sizes of the modules (10 x 11 mm or 10 x 14 mm) save considerable space and facilitate migration from other u-blox’s modules. Both modules come with global certifications.

ALMA-B1 and NORA-B2 are available as wireless MCUs. Both modules offer two antenna options: an antenna pin or an embedded PCB antenna.

https://www.u-blox.com

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ST reveals high-performance wireless microcontrollers

Wed, Mar 06, 2024

ST has revealed the next generation of its short-range wireless microcontrollers. These all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturised, easy to use, secure and affordable.

Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart buildings) are the fabric connecting smart devices to home bridges, gateways, and controllers including smartphones. As we all seek solutions for making life more economical, sustainable, and comfortable, vendors are looking to bring creative and high-performing new solutions to market more quickly, within tight cost constraints. They need to be stylish, too: tiny, low-profile, or even embedded out of sight in other equipment, such as in smart bulbs. Going wireless is a part of this trend, for freedom, flexibility, and fashion.

Wireless microcontrollers like ST’s new STM32WBA5 product line allow a one-chip solution that’s extremely compact, reduces the bill of materials, and shortens the time to market by relieving wireless design challenges. Also, being compatible with the development tools and software packs of the STM32 microcontroller development ecosystem, the new line simplifies migrating existing products designed for wired connections.

The new series’ flagship STM32WBA55 microcontroller can communicate using multiple wireless standards concurrently, including low-energy Bluetooth LE 5.4, Zigbee, Thread, and Matter (Thread RCP). Matter border router is a perfect match with the STM32WBA5 for this new open-source connectivity standard for smart-home and IoT (Internet of Things) devices. In this way, the STM32WBA55 supports a great user experience while simplifying hardware and software engineers’ development journey, aiding affordability and time to market for the new product.

With this new generation, ST has also introduced support for the recently completed Bluetooth LE Audio specifications that enable exciting and innovative new products for richer listening and hearing experiences. These include the new Bluetooth Auracast feature, which opens the door to a new world of audio broadcasting applications.

The STM32WBA series is the first wireless MCU in the market to achieve the important SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification. With this, smart devices containing STM32WBA microcontrollers are ready to satisfy the US Cyber Trust Mark and EU Radio Equipment Directive (RED) regulations due to become mandatory in 2025.

The new STM32WBA5 product line will be available on st.com on March 12. Sample requests and pricing information are available from local ST sales offices. ST will introduce a ready-to-use module containing the STM32WBA, integrated with necessary external components including power-supply and antenna-balancing circuitry, in June 2024.

https://www.st.com/stm32wba

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u-blox releases versatile Wi-Fi 6 module for the mass market

Fri, Feb 23, 2024

u-blox has announced its new NORA-W4 module. With a range of wireless technologies (Wi-Fi 6, Bluetooth LE 5.3, Thread, and Zigbee), compact form factor (10.4 x 14.3 x 1.9 mm), and affordability, NORA-W4 is ideal for IoT applications such as smart home, asset tracking, healthcare, and industrial automation.

NORA-W4 is a single-band tri-radio Wi-Fi 6 module built on the Espressif ESP32-C6 System-on-Chip. It enables battery-powered IoT nodes to operate directly over Wi-Fi. This simplifies implementation and reduces system-level costs by limiting the need for a Bluetooth gateway, making it a perfect match for applications like wireless battery-operated sensors.

NORA-W4 uses Wi-Fi 6 technology that is optimized for IoT and significantly reduces network congestion in environments such as factories, workplaces, or warehouses, thereby improving throughput and reducing latency. Fully backward compatible with Wi-Fi 4, the module can also be used in cases where the Wi-Fi infrastructure has not been upgraded.

The u-blox NORA-W4 module supports Matter protocol, Thread, and Zigbee technologies that are designed for new applications in the smart home environment. Consequently, it allows interoperability with other Matter smart home devices.

NORA-W4’s small form factor permits designers to adapt to device size constraints. Its compatibility with other u-blox NORA modules is key to effortless technology migration, such as transitioning from Wi-Fi 4 to Wi-Fi 6. In addition, the module is packed with enhanced security features, including secure boot, trusted execution environment, and flash encryption, to name a few.

NORA-W4 is available in 6 different variants: open CPU or u-connectXpress, antenna pin or PCB antenna, and with either 4MB or 8MB flash memory. Early samples are available now, with volume production scheduled for H2 2024.

https://www.u-blox.com

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Ceva launches multi-protocol wireless platform IP family to accelerate enhanced connectivity

u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules

ST reveals high-performance wireless microcontrollers

u-blox releases versatile Wi-Fi 6 module for the mass market

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