Infineon expands its Bluetooth portfolio with eight new parts

Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.

The latest automotive part in the product family, the AIROC CYW89829 Bluetooth Low-Energy MCU, is ideal for car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.

https://www.infineon.com

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Ceva Bluetooth low energy IPs bring ultra-low power wireless connectivity

Ceva has announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers.
The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity and machine learning in a single chip. The Balletto family delivers up to 50x boost in machine learning performance and inference efficiency versus traditional MCUs that lack neural co-processors. The Ceva-Waves Bluetooth Low Energy IP provides Balletto MCUs with the robust connectivity at ultra-low power consumption, and supports Bluetooth LE Audio and Auracast broadcast audio, for customers who wish to leverage Balletto to create highly differentiated wireless audio products. The Balletto family also relies on Ceva-Waves 802.15.4 IP for Thread, Zigbee and Matter support in smart home applications.

“Our Balletto family of connected, intelligent MCUs are tailored to meet the growing demand for AI/ML workloads in battery-powered devices,” said Mark Rootz, VP Marketing at Alif Semiconductor. “Ceva’s Bluetooth Low Energy and 802.15.4 IPs provide us with a highly-proven and robust connectivity solution for our chip design, allowing us to focus our R&D resources on differentiating our MCU to deliver outstanding performance for the most demanding wireless audio and smart home AI/ML use cases.”

“Wireless connectivity is a fundamental requirement of every intelligent device, and we’re proud to be the trusted supplier of embedded wireless IP to industry leaders and innovators alike, including Alif Semiconductor,” said Tal Shalev, Vice President and General Manager, Wireless IoT Business Unit at Ceva. “Our Bluetooth Low Energy IP has powered billions of devices to date, and we’re excited to partner with Alif to enable their Balletto family of intelligent MCUs with robust connectivity and high-bit rate audio.”

The Ceva-Waves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity, spanning RF, Modem, Baseband Controller, and complete Host and Profile software stacks. All the latest features of Bluetooth are supported, including AoA / AoD / Direction Finding, LE Audio / Auracast, Periodic Advertising with Response, and other enhancements such as Channel Sounding. It also comprises an IEEE 802.15.4 addon for Thread, Zigbee and Matter support. With more than 4.5 billion devices shipped to date and dozens of licensees, the Ceva-Waves Bluetooth IP is widely deployed in consumer, automotive, industrial, medical and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, beacons, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.
The Ceva-Waves Bluetooth IP is part of the Ceva-Waves unique and broad family of wireless connectivity IP platforms that also includes the Ceva-Waves Wi-Fi, UWB, NB-IoT and Links multi-protocol platforms.

https://www.ceva-ip.com/app/connectivity/

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Farnell now stocks Murata’s UWB and LoRa modules

Farnell is now offering Murata’s latest UWB and LoRa connectivity modules for convenient wireless integration. These modules are designed to simplify wireless development and certification, making it easier to incorporate wireless capabilities into a wide range of applications.

Murata’s UWB modules provide high-accuracy location functionality with UWB tag and anchor functions in compact packages. These modules feature integrated RF front ends, simplifying the implementation process and reducing the need for extensive RF expertise. This allows developers to seamlessly incorporate advanced location capabilities into their applications..

Additionally, Murata’s LoRa modules offer a compact, integrated solution with an embedded MCU. Developers have the flexibility to utilise the MCU as the Host for an End Node, providing customisation possibilities for various projects.

The technology enables location accuracy in the order of 0.1m for indoor or outdoor applications. The UWB Modules available at Farnell include:

• FiRa certified UWB module, Type 2BP is the ultra small UWB module which includes NXP’s SR150 UWB chipset, clock, filters and peripheral components. Ideally suited for general IoT devices including battery operated devices.
• UWB module with integrated BLE wireless MCU, Type 2AB is designed as ultra-small, high quality and lower power consumption module. It can be operated on the wireless MCU making this a suitable part for wearables and applications where size is critical
• UWB tag module with integrated BLE wireless MCU. Type 2DK is an all-in-one UWB + Bluetooth LE combo module which integrates NXP Trimension SR040 UWB Chipset, NXP QN9090 Bluetooth LE + MCU chipset, on board antenna and peripheral components. Ideally suited for UWB Tag/Tracker which operates by coin-cell battery, and general IoT devices.

The Murata Type 1SJ LoRa Modules are some of the smallest LoRa Modules in the line-up and include the Semtech SX1262 LoRa Connect Transceiver IC and ST Microelectronics STM32L0 MCU to provide customers with a Regulatory Certified Module that can be used as the core of a LoRa End Node product design. The LoRa modules available at Farnell include:

• LoRa OpenMCU Module, Type 1SJ-295 supplied as an OpenMCU configuration to allow custom Application to be flashed to integrated MCU, together with LoRa Stack.
• LoRaWAN Modem Module, Type 1SJ-6868 pre-flashed with modem Firmware and EUI to support LoRaWAN operation by AT Commands.
• LoRa Module Evaluation Kit to support development and verification for both OpenMCU and Modem configurations of Module.

https://uk.farnell.com

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Infineon extends its AIROC Wi-Fi 6/6E portfolio

Infineon has announced the company’s new AIROC CYW5591x connected microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimised, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network.

This flexible device family can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications. The product family is available in three versions: CYW55913 for tri-band (2.4/5/6 GHz), CYW55912 for dual-band (2.4/5 GHz), and CYW55911 for single-band (2.4GHz) support.
Key features
• An Arm Cortex M33 192MHz MCU with TrustZone CC312 with 768 KB SRAM
• Quad-SPI with XIP with on-the-fly encryption/decryption for FLASH and PSRAM
• 1×1 Tri-Band (2.4/5/6 GHz) 20MHz Wi-Fi 6/6E (802.11ax)
• Up to +24 dBm transmit power for Wi-Fi for best-in-class range
• Supports 6 GHz (Wi-Fi 6E) greenfield spectrum for lower congestion and reduced latency
• Matter-over-Wi-Fi support
• Bluetooth Low Energy 5.4 supports Bluetooth low energy 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for LE Long Range
• Bluetooth Low Energy range and power are also optizized with up to +19 dBm transmit power
• Best-in-class LE Longe Range sensitivity of -111.5 dBm
• Extensive peripherals and GPIO support: 3xSCB(I2C/SPI/UART), TCPWM, 7 channel 12-bit ADC, Digital Microphone support, TCM (I2S/PCM), and up to 47 GPIOs
• Hardware support for AES, RSA, ECC, ECDHA, ECDSA, Root-of-Trust
• Multi-layer security supporting lifecycle management, secured boot with firmware authentication and encryption, anti-rollback, crypto key establishment, and management
• PSA Level 2 Certifiable

https://infineon.com

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