New Bluetooth module from Panasonic Industry

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.

https://industry.panasonic.eu

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u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

The wireless modules combine ultra-lower power consumption and high processing efficiency, consuming up to 50% less current than previous-generation devices while doubling process capacity. They also security features, which makes them ideal for a wide range of IoT applications, such as smart home devices, industrial automation, or healthcare.

The entire NORA-B2 series comprises four variants that differ in memory sizes, design architectures and price levels to match almost any device manufacturer’s requirements.

• NORA-B20 features an ultra-low power nRF54L15 SoC with a 128 MHz Arm Cortex-M33, RISC-V co-processor, and 2.4 GHz multiprotocol radio. It includes 1.5 MB NVM and 256 KB RAM.
• NORA-B21, built on the nRF54L10 SoC, supports multiple wireless protocols (Bluetooth LE, Mesh, Thread, Matter, Zigbee, Amazon Sidewalk) with 1.0 MB NVM and 192 KB RAM.
• NORA-B22 is a cost-effective option with up to 31 GPIOs, 0.5 MB NVM, and 96 KB RAM.
• NORA-B26 is pre-flashed with u-blox u-connectXpress, enabling easy Bluetooth integration without prior expertise.

All NORA-B2 modules are designed for PSA Certified Level 3 security. They incorporate features such as secure boot and updates, tamper detection, and secure firmware over-the-air (FOTA) updates. These security measures ensure that IoT devices remain protected against any potential threats, safeguarding both data and functionality. NORA-B2 modules are also qualified against Bluetooth Core 6.0 that includes Channel Sounding, enabling endless cost-effective possibilities in tracking and locating use cases.

NORA-B2 variants either come with an antenna pin for connecting an external antenna of choice or are designed with a patented PCB antenna providing best-in-class RF performance. All module versions come with global certification allowing device manufacturers to launch their products worldwide with minimal effort.
Samples of NORA-B20 are now available. Early samples of NORA-B21 and NORA-B22 are available for evaluation in limited quantities. The pre-release version of u-connectXpress software for NORA-B26 is also available for early adopters.

https://www.u-blox.com

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ST introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm

ST has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST’s powerful STM32 ecosystem and Qualcomm Technologies’ leading wireless connectivity solutions.

The first of these modules, the ST67W611M1, contains a Qualcomm® QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo, made easy to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU). The module will support Matter protocol over Wi-Fi for future-proof connectivity, making the STM32 portfolio seamlessly accessible to the Matter ecosystem. Aiding the system integration, the module also contains 4Mbyte Flash for code and data storage, and a 40MHz crystal. There is also an integrated PCB antenna or micro RF (uFL) connector for an external antenna.

“Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group (MDRF) at STMicroelectronics. “Qualcomm’s expertise in highly influential and widely used wireless connectivity technologies is now at product developers’ fingertips and combines with the powerful software, tools, features and project acceleration offered by the STM32 development ecosystem.”

“This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications,” said Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit, Qualcomm Technologies, Inc. “We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G and more.”

Advanced hardware security is built in, with hardware cryptographic accelerators, as well as services including secure boot and secure debug, reaching PSA Certified Level 1 protection. The module is self-contained and pre-certified according to mandatory specifications, requiring no RF design expertise from the user to create a working solution. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. AI enhancements include the recently introduced STM32N6 MCUs, which contain ST’s Neural-ART Accelerator, and the ST Edge AI Suite that provides an AI Model Zoo and STM32Cube.AI and NanoEdge AI optimisation tools.

The modules are designed to be quickly and seamlessly integrated with any STM32 microcontroller or STM32 microprocessor, which offer flexible options for performance, price, and power across a broad spectrum. The MCUs available range from cost- and power-sensitive devices containing the Arm® Cortex®-M0+ core to devices containing high performing cores such as Cortex-M4 and Cortex-A7 in the STM32MP1/2 MPUs.

Samples of the ST67W611M1 are available, with OEM availability in Q1 2025, with broader availability in Q2 2025.

https://www.st.com/st67w

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Rutronik introduces the new SoCs from Nordic Semi for next-generation (I)IoT applications

With three SoCs from the new nRF54L series, the nRF54L15, nRF54L10 as well as nRF54L05, Rutronik is expanding its portfolio of Bluetooth Low Energy Systems-on-Chip (SoCs) from Nordic Semiconductor. Higher performance, efficiency and security make this recently launched product the optimal and future-proof choice for realising the next generation of wireless IoT products.

All SoCs in the nRF54L series offer MCU functionality with a 128 MHz Arm Cortex-M33 processor, doubling the processing power and tripling the processing efficiency – compared to the nRF52840. This enables enhanced functionality in end products while consuming up to three times less power.

Security is one of the key challenges in the (I)IoT environment, which is why Nordic Semiconductor relies on advanced security features with physical protection for the nRF54L series: secure booting, secure firmware updates, secure storage, as well as a TrustZone-enabled trusted execution environment, a cryptographic accelerator with side-channel leakage protection and tamper detectors, already allow the development of applications that will meet future security regulations.

The hardware and software highlights of the nRF54L series compared to the predecessor flagship nRF52 (nRF52840):
• Significantly better specifications in terms of:
o Arm Cortex-M33 (128 MHz), instead of Arm Cortex-M4 (64 MHz)
o 1.5 MB NVM / 256 KB RAM, instead of 1 MB Flash / 256 KB RAM
o Bluetooth LE version 6.0 and higher, instead of Bluetooth LE version 5.4

Further benefits:
• Non-volatile memory: 1.5 MB (nRF54L15) // 1.0 MB (nRF54L10) // 0.5 MB (nRF54L05)
• 256 KB RAM (nRF54L15) // 192 KB RAM (nRF54L10) // 96 KB RAM (nRF54L05)
• Ultra-low power multiprotocol 2.4 GHz radio: Bluetooth Low Energy, Bluetooth Mesh, Bluetooth Channel Sounding, Zigbee, Thread, Matter, proprietary 2.4 GHz protocols and support for ecosystems such as Amazon Sidewalk, Google Find My Device and Apple Find My
• RISC-V co-processor and integrated peripherals: new real-time global clock, also available when the system is switched off, 14-bit analogue-to-digital converter and high-speed serial interfaces
• PSA Level 3 certified
• Design flexibility & pin-to-pin compatibility

Application examples:
• Smart Home & Matter, Smart Wearables, VR/AR,
• PC peripherals, HID, remote control
• (Industrial) IoT, building automation, access control
• Medical / healthcare, fitness

https://www.rutronik24.com

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