SoC is optimised for cost-conscious, two-layer PCB wireless products

Available in a wafer level chip scale package (WLCSP), optimised for compact, two-layer PCB wireless products, the nRF52805 SoC adds Bluetooth 5.2 to Nordic Semiconductor’s nRF52 series.

The nRF52805 SoC offers Bluetooth low energy (LE), high-throughput device can be used for cost-constrained applications such as disposable medical products, styluses, sensors, and beacons

The nRF52805 Bluetooth 5.2 SoC in a WLCSP measures just 2.48 x 2.46mm. The WLCSP SoC is optimised for two-layer PCB designs, avoiding the need for more expensive four-layer PCBs in compact, budget-constrained designs, says Nordic. The SoC is capable of Bluetooth LE high-throughput 2Mbits per second and enhanced Channel Selection Algorithm #2 (CSA #2) for improved co-existence.

Based on a 64MHz, 32bit Arm Cortex-M4 processor (144 CoreMark) with 65 CoreMark/mA efficiency, the SoC also includes 192kbyte flash memory and 24kbyte RAM. The multiprotocol (Bluetooth LE/2.4GHz) radio offers up to +4dBm power output and -97dBm sensitivity (1Mbits per second Bluetooth LE) for a link budget of 101dBm. The radio’s peak power draw is only 4.6mA (TX 0dBM, RX 1Mbits per second) and the SoC’s current draw is as low as 0.3 microA in system off and 1.1 microA in system on with 24kbyte RAM retained and real time clock (RTC) running. The SoC features a range of analogue and digital interfaces such as SPI, UART and two wire interface (TWI), a two-channel 12-bit ADC, and ten general purpose I/Os.

Nordic offers a 9.5 x 8.8mm reference layout with all ten general purpose I/Os available, which requires only 10 external passive components (including two crystal load capacitors).

The SoC can be powered from a 1.7 to 3.6V supply and integrates LDO and DC/DC voltage regulators.

The nRF52805 is currently supported by the S112 SoftDevice and Nordic confirms that support for the S113 SoftDevice follows soon. The S112 and S113 SoftDevices (Bluetooth 5.1-qualified protocol software) are memory-optimised peripheral stacks which support high-throughput 2Mbits per second and CSA #2 features. The stacks support up to four connections as a peripheral concurrently with a broadcaster.

The number of connections and bandwidth per connection is configurable, enabling memory and performance optimisation.

Both the S112 and S113 also support LE Secure Connections, improving security compared to LE Legacy Pairing. S113 also supports LE Data Packet Length Extension, resulting in higher throughput and less overhead per packet.

There is a guide explaining how to use the nRF52805 with Nordic’s nRF5 software development kit (SDK). Nordic recommends the nRF52 development kit can be used to emulate the nRF52805 and is a good hardware basis to start designs before moving over to a custom development board.

 The nRF52805 is now in volume production.

http://www.nordicsemi.com/nRF52805

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Skyworks to support Wi-Fi 6E

Working with the Wi-Fi Alliance, Skyworks Solutions is developing future-proof connectivity and supporting the Alliance’s next-generation wireless technologies.

Skyworks addresses all existing Wi-Fi standards and is working within the Wi-Fi Alliance to develop its Wi-Fi 6E products that operate in the 5.925 to 7.125GHz frequency range.

Demand for high data applications such as streaming media/TV/audio, social media and smart home devices, has led to calls to open up additional frequency bands to complement the existing 2.4 and 5GHz bands. This new spectrum is expected to be made available by regulators around the world and it represents an opportunity to deliver the benefits of Wi-Fi 6 coupled with increased bandwidth available in the new 6GHz band.

“The 6GHz band addresses the growing need for Wi-Fi spectrum capacity to ensure users continue to experience reliable and seamless connectivity,” said Kevin Robinson, senior vice president of Marketing, at the Wi-Fi Alliance. “We are glad to see Wi-Fi Alliance members working closely in Wi-Fi Alliance to ensure that new products meet high standards for interoperability and security.”

Dave Stasey, vice president and general manager of diversified analogue solutions for Skyworks, added: “We look forward to . . .  providing the highest performance solutions for our OEM customers which deliver maximum Wi-Fi range and speeds.”

Skyworks’ powerful modules facilitate Wi-Fi functionality with best-in-class linearity and performance in the smallest footprint available, explains the company. By incorporating the required functionality to deliver maximum performance, products reduce time to market in this sensitive arena. They contain a logarithmic power detector to support wide dynamic ranges, low power consumption and improved thermal management.

Skyworks Solutions specialises in analogue semiconductors for a wireless networking revolution. Its semiconductors connect people, places and things within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Skyworks has engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

http://www.skyworksinc.com

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Rutronik UK adds Minew’s MS88SF2 multi-protocol module

Based on Nordic Semiconductor’s nRF52840 SoC, the MS88SF2 multi-protocol module can be operated with Bluetooth 5.0, ZigBee 3.0, Thread and ANT wireless protocols, as well as with proprietary 2.4GHz stacks. The module is the latest module from Minew and is available at Rutronik UK.

The integrated module measures just 23.2 x 17.4 x 2.0mm and contains all necessary components from radio to different antennae (PCB and ceramic) and the antenna-matching network, or a U.FL/IPEX antenna plug, for external antenna connection, says Rutronik UK. The metal cover protects against unwanted radiation and electromagnetic waves.

It has an Arm Cortex-M4F processor with a core speed of 64MHz, delivering sufficient computing power for highly complex algorithms and also for floating-point calculations, confirms Rutronik UK. The 1Mbyte flash memory can hold several radio stacks and also larger customer applications and offers enough space for data logger tasks. Power management includes an on-chip DC/DC converter and low-dropout (LDO) controller as well as automated power-saving mode.

The MS88SF2 is CE, FCC, IC, TELEC and BQB-certified. It is intended for cost-effective building of network nodes in applications such as cycling computers, heart rate and blood pressure monitoring, blood glucose meters, scales, thermometers, mobile accessories, sports and fitness sensors, remote controls and toys, key fobs and wrist bands, 3D glasses and gaming controllers.

Rutronik UK operates as an independent company. Its parent company, Rutronik Elektronische Bauelemente, is the third largest distributor in Europe and ranked number 11 worldwide. The broadline distributor supplies semiconductors, passive and electromechanical components as well as boards, storage, displays & wireless products. The company‘s primary target markets are the automotive, medical, industrial, home appliance, energy and lighting industries. Rutronik’s brands for product lines are Rutronik Embedded, Rutronik Smart, Rutronik Power and Rutronik Automotive, providing specific products and services in groups tailored to the applications. Rutronik also offers technical support for product development and design-in, individual logistics and supply chain management.

http://www.rutronik.com

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Bluetooth LE Audio codec is first for power-sensitive audio says Synopsys

Optimised for Synopsys’ ARC processor IP, a low complexity communication codec (LC3) has been developed by Synopsys with the Fraunhofer Institute for Integrated Circuits (IIS).

The new codec is designed to comply with the forthcoming Bluetooth LC3 audio codec specification and is optimised to deliver high-quality audio and voice playback in battery-powered devices incorporating ARC EM and HS DSP processors, says Synopsys.

It has been added to Synopsys’ portfolio of DesignWare ARC audio codecs and post-processing software supporting popular audio standards. It also extends Synopsys’ DesignWare Bluetooth Low Energy IP offering.

The 32-bit DesignWare ARC EM and HS DSP processors are based on the scalable ARCv2DSP Instruction Set Architecture (ISA) and integrate RISC and DSP capabilities for a flexible processing architecture. The ARC EM DSP processors offer low power and what is claimed to be industry-leading performance efficiency while the multi-core-capable ARC HS DSP processors combine high-performance control and high-efficiency digital signal processing. All ARC processors are supported by the ARC MetaWare Development Toolkit, which includes a library of DSP functions to allow software engineers to rapidly implement algorithms from standard DSP building blocks. ARC processors and the LC3 codec can be combined with Synopsys’ Bluetooth 5.1-compliant DesignWare Bluetooth Low Energy IP to deliver power-efficient, high-quality wireless audio capability for smart IoT and other Bluetooth-enabled devices.

The LC3 codec is an important feature of the Bluetooth LE Audio specification to be released by the Bluetooth Special Interest Group (SIG) that enables system on chip (SoC) designers to efficiently implement high-quality voice and audio streaming in a wide range of applications, including mobile, wearables, and home automation.

The LC3 codec for ARC processors is based on an implementation by Fraunhofer IIS that is designed to meet Bluetooth SIG requirements. The LC3 codec, running on ARC EM and HS DSP processors, allows designers to rapidly integrate a complete, pre-verified hardware and software solution for voice and speech processing into Bluetooth-enabled devices requiring minimal energy consumption, explains Synopsys.

“The rapid growth of wearable devices requiring high-quality Bluetooth audio streaming is driving the need for power-efficient processor IP with DSP capabilities that can meet intensive computation requirements of voice and audio applications. Those applications require an optimised codec providing state-of-the art voice and audio quality at minimum computational complexity,” said Manfred Lutzky, head of Audio for Communications at Fraunhofer IIS. “By porting the LC3 codec to the DSP-enhanced ARC processors, Synopsys is enabling customers to quickly implement LC3 codec functionality in their low-power SoCs. We look forward to continuing our collaboration with Synopsys so that the LC3 codec for ARC processors continues to incorporate the latest updates,” he added.

“The fact that the LC3 codec can provide very high-quality audio even at low bit rates makes it a key feature of the upcoming LE Audio standard,” said Mark Powell, chief executive officer of the Bluetooth SIG. “

John Koeter, senior vice president of marketing for IP at Synopsys, said: “Designed to process high-quality audio streams and deliver superior sound, the LC3 codec for ARC processors provides designers with a certified codec that reduces the integration time and testing required to deliver superior quality audio for Bluetooth streaming applications.”

The Bluetooth LC3 codec is available now from Synopsys with DSP-enhanced ARC EMxD and HS4xD processors.

http://www.synopsys.com

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