Weartech-Comms / Bluetooth / Wireless Archives - Page 12 of 19

Murata’s Type 2AB UWB Bluetooth modules are available from Rutronik

Mon, Oct 10, 2022

Small, wideband modules by Murata combine low power consumption and accurate results for compact, battery powered IoT devices.

The Type 2AB UWB + Bluetooth Low Energy wideband modules measure 10.5 x 8.3 x 1.44mm. They use short range radio frequency technology to enable a wide range of applications including healthcare, wearables, smart lighting, smart factory, real time locations systems (RTLS), asset tracking and digital payments.

The modules integrate a Nordic IC nRF52840 which is claimed to improve design flexibility and reduce product development time by eliminating external MCUs. There is a 256kbyte RAM and 1Mbyte flash memory, a 250nA deep sleep mode with Bluetooth Low Energy function and a three-axis sensor for motion detection. It also integrates a reference clock for UWB (ultra wideband) and MCU.

The module’s PCB mounting area is significantly reduced compared to the layout of separate UWB and BLE ICs, said Rutronik. The design also supports additional component integration. The regulatory-certified module is also claimed to minimise development time for adding UWB functionality into end products.

The multi-antenna design consists of three antenna ports available on the component, one for Bluetooth Low Energy and two for UWB for the phase difference of arrival (PDoA) function.

The connectivity module has an operating temperature of -40 to +85 degrees C and a voltage of 2.5 to 3.6V. It also supports channels five and nine for global deployment. Transmit power, antenna delays and frequencies are calibrated for each device.

Rutronik Elektronische Bauelemente was founded in 1973 and is an independent family-owned company and is a broadline distributor. Rutronik is represented worldwide with 80 offices and provides customer support in Europe, Asia and the USA.

The company’s product portfolio includes semiconductors, passive and electromechanical components as well as embedded boards, storage and displays and wireless products.

Rutronik offers specific products and services tailored to automotive, embedded, power and smart applications and the company provides technical support for product development and design-in, research area, individual logistics and supply chain management as well as comprehensive services.

http://www.rutronik.com

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eFuse ICs protect and control circuits in datacomms and industry

Thu, Oct 06, 2022

Four ICs have been developed by Littelfuse to protect, sense and control consumer, datacomms and industrial electronics. There are four eFuse Protection ICs available from Littelfuse.

The ICs are designed to provide a wide range of power input (3.3V to 28V) and integrated protection in the form of over-voltage, over-current, short circuit, inrush current, reverse current, and over-temperature protection with real-time diagnostics – all in a single chip.

The LS0504EVT233 is a 5V, 4A IC with over-voltage, over-current protection in an SOT23-3 package. The LS0505EVD22 is a 5V, 5A model with over-voltage and over-current protection in a DFN 2.0 x 2.0mm package. The LS1205ExD33 is an 18V, 5A IC with programmable current limit and output voltage clamp in a DFN 3.0 x 3.0mm package. The fourth model, the LS2406ERQ23 is a 28V, 6A true reverse block, fast role swap IC in a QFN 2.5 x 3.2mm package.

The ICs can be used in Bluetooth headsets, wearable devices, PCs as well as tablets and notebooks, charging cables, battery-powered and adapter powered devices, networking and datacomms power systems, fan control HDD and SDD storage drives and industrial equipment with 12/24V power I/O.

The ICs provide an accurate current limiter, with faster response time and more integrated protection features than traditional fuses and PTCs, claimed Littelfuse. They also have design flexibility with adjustable over-voltage threshold, current limiting, and inrush current protection, with true reverse current blocking. The integrated ICs save PCB space and reduce the bill of material cost, while reducing design-in phase and time to market compared to typical discrete solutions, such as a hot-swap controller and MOSFET combination, said the company.

They are also claimed to increase battery life, lower repair costs and extend overall product lifetime.

“Providing a low power consumption, high accuracy current limiting circuit with quick response time makes them a win-win-win for many portable electronics and datacom applications,” said Bernie Hsieh, assistant product manager of the Protection Semiconductor business team at Littelfuse.

The eFuse Protection ICs are available in tape and reel format in quantities through authorised Littelfuse distributors worldwide.

http://www.Littelfuse.com

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Bluetooth LE module goes where radios aren’t welcome

Thu, Jul 28, 2022

A Bluetooth 5 Low Energy module for applications deemed “radio-unfavourable” has been introduced by Panasonic.

The PAN1770 Bluetooth 5 Low Energy (LE) module includes a uFL connector which enables the use of an external antenna for use where difficult housing conditions shield radio waves.

“We have seen that in many devices or applications, radio waves emitted by the chip antenna can be blocked or reflected by the metallic housing, making it difficult to receive the radio signal from the outside”, commented Tomislav Tipura from Panasonic Industry Europe. Using the PAN1770 module, an external antenna can easily be attached via the uFL connector and thus redirect the radio waves outside the housing, he explained.

The module is based on Nordic Semiconductor’s nRF52840 single chip controller. It joins the PAN1780 Bluetooth 5 module from Panasonic.

Output power is up to 8dBm. The module is suitable for use in applications where a long range is required, due to the sensitivity of 95dBm at 1.0Mbits per second and -103dBm at 125kbits per second via the nRF52840 chip controller combined with the LE coded PHY, said Panasonic. Current consumption is just 4.8mA in Tx (at 0dBm), 4.8mA in Rx mode, 0.4 microA in system off mode and around 0.7 microA with RTC wake-up. These parameters make the module suitable for used in a battery-powered device.

It also includes a Cortex M4F processor, 256kbyte RAM and built-in 1.0Mbyte flash memory. The device can be used in standalone mode, eliminating the need for an external processor, while reducing complexity, lowering costs and saving space, said the company. The PAN1770 module also supports Type 2 near field communication (NFC A) for use in simplified pairing and payment systems, although an external antenna is required.

The module has a small footprint of 15.6 x 8.7 x 1.8mm. Maximum output power is 8dBm, configurable from -20dBm in 4.0dB steps and -40dBm in whisper mode. For 802.15.4 support, it has Matter, Zigbee and Thread, as well as up to 48 programmable general purpose I/Os and SPI, I2C, UART, PWM, ADC, NFC, USB2.0 interfaces.

http://industry.panasonic.eu

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Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity

Wed, Jun 22, 2022

Renesas Electronics has announced the SmartBond DA1470x family of Bluetooth low energy (LE) integrated SoCs for wireless connectivity.

Renesas claimed the DA1470x family to be the only device in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a graphics processing unit (GPU) and Bluetooth LE connectivity all into a single chip.

This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and seamless, low power, always-on audio processing. The SoCs are suitable for wearables, such as smart watches and fitness trackers, glucose monitor readers and other consumer medical and healthcare devices, home appliances with displays, industrial automation and security systems, and Bluetooth consoles such as e-bikes and gaming equipment.

“The DA1470x family … enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimising their bill of materials,” commented Sean McGrath, vice president of the connectivity and audio business division in Renesas’ IoT, Industrial and Infrastructure business unit.

The high level of integration results in “significant cost savings” on the bill of materials (BoM), enabling cost-effective system solutions, according to the company. It also reduces component count on the PCB, enabling smaller form factor designs and freeing up space for additional components or larger batteries. With fewer components on the PCB, the reliability of the system improves, it claimed, delivering a further reduction in the total cost of goods sold (COGS) of the end product.

The wireless SoCs feature a multi core system – with an Arm Cortex-M33 processor as the main application core and Cortex -M0+ as the sensor node controller.

An integrated 2D GPU and display controller supports DPI, JDI parallel, DBI and single / dual / quad serial peripheral interfaces (SPIs) and there is a configurable Mac supporting Bluetooth LE 5.2 and proprietary 2.4GHz protocols.

An integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion / Li-Po batteries, while an integrated low quiescent current SIMO DC/DC converter of the PMU supplies internal system and external components.

Low power hardware VAD enables seamless and always-on audio processing.

The DA1470x family consists of four new devices, all of which are in mass production and available now.

The DA14706 has already been used in the Xiaomi Mi band 7 wearable activity tracker with a 1.62-inch, 192×490 Amoled display, 120 sports modes and a 15-day battery life for typical use.

The DA1470x family will be demonstrated at Embedded World (21-23 June) in Nuremberg, Germany, at Booth Hall 1-234.

A provider of microcontrollers, Renesas combines its expertise in embedded processing, analogue, power and connectivity to deliver complete semiconductor solutions. These combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications.

http://www.renesas.com

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Murata’s Type 2AB UWB Bluetooth modules are available from Rutronik

eFuse ICs protect and control circuits in datacomms and industry

Bluetooth LE module goes where radios aren’t welcome

Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity

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