Selecting the Right Supplies for Powering 5G Base Stations Components

Cellular communications have come a long way since the introduction of analog cellular networks in the early ’80s. Today, as the market migrates from 4G to 5G network solutions, the cellular communications industry is laying the groundwork for a giant leap forward in data transfer speed, lower latency, capacity, user density, and reliability. For example, along with a 100× improvement in data rates and network capacity (10×), 5G also drastically cuts latency to under 1 ms,1 while enabling near ubiquitous connectivity for the billions of connected devices that are part of the growing Internet of Things (IoT). A typical 5G beamforming transmitter comprising digital MIMO, data converters, signal processing components, amplifiers, and antennas is shown in Figure 1.2

Powering FPGAs
In order to fully realize the benefits of 5G, designers require higher frequency radios to tap into the new spectrum needed to meet the future data capacity demand by incorporating more integrated microwave/millimeter wave transceivers, field programmable gate arrays (FPGAs), faster data converters, and high power, low noise power amplifiers (PAs) for smaller cells. Additionally, these 5G cells will also include more integrated antennas to apply the massive multiple input, multiple output (MIMO) techniques for reliable connections. As a result, a variety of state-of-the-art power supplies are required to power 5G base station components.
Modern FPGAs and processors are built using advanced nanometer processes because they often perform calculations at fast speeds using low voltages (<0.9 V) at high current from compact packages. Additionally, new generation FPGAs need lower core voltages to vastly improve computational speeds while requiring higher voltage for I/O interfaces, and they need an additional rail for DDR memory.3,4,5 So, in essence, a single FPGA requires multiple voltages with tight tolerances and different current ratings for optimal operation. What’s more, in order to avoid damage, these voltage rails must be sequenced in the correct order. Such stringent requirements can be met by power supplies built using the latest semiconductor technologies combined with leading-edge circuit topologies and advanced packaging techniques. However, should a designer not properly utilize the right power management solution, the risks range from inefficiencies to thermal complications and other undesired performance-related problems.

Quietly Powering High Speed Data Converters
Likewise, faster running, precision data converters, like analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), also require multiple power rails, such as 1.3 V, 2.5 V, and 3.3 V, with very low noise and dc ripple.6 Normally, these high speed ADCs and DACs are placed on crowded printed circuit boards (PCBs) with limited space. Consequently, power supply sensitivity of the ADC and DAC must be a top consideration when designing the power supply system for these high speed data converters.


Figure 1. A high level block diagram of a beamforming transmitter for 5G systems.

 

By combining the benefits of advanced semiconductor and packaging technologies, ADI’s µModule® Silent Switcher® regulators can easily solve this problem, meeting the efficiency, density, and noise performance needs of high speed data converters. A good example is Silent Switcher LTM8065, which can deliver a solution that is quiet, more compact, and more efficient for powering these devices. Unlike a traditional discrete solution, LTM8065 can significantly cut the component count and power supply board real estate without compromising the dynamic performance of the data converter. A single RoHS compliant BGA package integrates a switching controller, power switches, an inductor, and all the supporting components.
In some cases, to maximize power supply rejection ratio (PSRR) performance, linear regulators are used in the power supply path, following a switching regulator. ADP7118 is one such low dropout (LDO), low noise linear regulator that can handle a wide input voltage range with high output accuracy, low noise plus high PSRR, and an excellent line and load transient response. However, there are many more in this product line and they can be correctly selected using ADI’s software tools like LTpowerCAD and LTspice.®

Managing Power for PAs and Transceivers
These next-generation radios that incorporate integrated transceivers and low noise, high power microwave/millimeter wave PAs with wider bandwidths come with digital control and management systems, which requires the use of multiple specialized power-supply technologies. For example, gallium nitride (GaN)-based low noise, high power PAs will require voltages as high as 28 V to 50 V, while FPGA based control and high speed ADCs and DACs will need multiple lower voltages with proper sequencing, monitoring, and protection.7,8 State-of-the-art dc-to-dc converters can deliver the efficiency (>90%), power density, low noise performance, and control demanded by these 5G PAs.

With enormous pressure to deliver next-generation (5G) products that outperform the previous generation (4G), there is little room for compromise. Consequently, a company like ADI, which specializes in all aspects of the base station RF chain and has thorough knowledge of power management tools required for powering these applications, is able to provide the right power resources for today’s 5G based PAs and transceivers. Offering the industry’s broadest portfolio of high performance Power by Linear™ products ranging from high efficiency, high density dc-to-dc converter modules to power management ICs (PMICs) and ultralow noise linear regulators, including power sequencing, monitoring, and protection, ADI can provide a more holistic approach to powering the 5G signal chain.

ADI’s µModule regulators and Silent Switcher services are complete power system-in-package solutions that can deliver precise voltage with the highest efficiency (>95%) and power density from a miniature package with high reliability and the lowest EMI and noise. These solutions are specially designed to power high performance RF systems with the highest power conversion efficiency and density without adding noise or interference to the radio signal of interest, thus ensuring the best performance out of these RF PAs and other such RF circuits.

Likewise, to address the challenges of power supply sequencing in circuits where multiple rails are needed, ADI has built a family of sequencers ranging from sequencing of two supplies (ADM6819/ADM6820) to 17 channels (ADM1266). To ensure that a system is operating correctly, efficiently, and safely, monitoring device voltage, current, or temperature is crucial. For that, ADI offers parts like LTC2990.

In summary, ADI’s Power by Linear product portfolio comprises low noise LDO regulators, low EMI, highly integrated multirail dc-to-dc converter µModule devices, Silent Switcher technology, and other power management ICs, including supply sequencers, monitors, and protection circuits – all of which position ADI to offer the broadest line of power products in the industry. It includes everything needed to power 5G base station components, including software design and simulation tools like LTpowerCAD and LTspice. These tools simplify the task of selecting the right power management solutions for these devices and, thereby, provide an optimal power solution for 5G base stations components.

By James Wong and Tony Armstrong, Analog Devices Inc.

References
1 Kyungmin Park. “How 5G Reduces Data Transmission Latency.” EDN Network, May 14, 2018.
2 Thomas Cameron. “5G—The Microwave Perspective.” Analog Devices, Inc., December 2015.
3 Nathan Enger. “Care and Feeding of FPGA Power Supplies: A How And Why Guide To Success.” Analog Dialogue, November 2018.
4 Frederik Dostal. “Power Management for FPGAs.” Analog Dialogue, March 2018.
5 Afshin Odabaee. “Powering Altera Arria 10 FPGA and Arria 10 SoC: Tested and Verified Power Management Solutions.” Analog Devices, Inc.
6 Aldrick Limjoco, Patrick Pasaquian, and Jefferson Eco. “Silent Switcher µModule Regulators Quietly Power GSPS Sampling ADC in Half the Space.” Analog Devices, Inc., October 2018.
7 David Bennett and Richard DiAngelo. “Power Supply Management of GaN MMIC Power Amplifiers for Pulsed Radar.” Analog Devices, Inc., October 2017.
8 Keith Benson. “GaN Breaks Barriers—RF Power Amplifiers Go Wide and High.” Analog Dialogue, September 2017

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Smoke Alarm System 2.0

Underwriters Laboratories (UL), the author of the U.S. and Canada smoke detection standards, has released a revised specification (8th edition). These new standards are significantly more technically challenging to meet than the current regulations.

New Smoke Detector Tests
One major change to the standards is the introduction of the hamburger nuisance test. In this test, hamburgers are placed in an oven set at a high enough level to eventually burn, and the detectors must not issue an alarm before a certain amount of smoke has been generated. This requirement to not alarm will bound the maximum sensitivity of a detection system. This test is designed to reduce the number of false alarms generated due to cooking events, as residents disconnecting alarms due to high false alarm rates is one of the leading cases of death in fire-related events.

Another addition to the standard is the flaming polyurethane (PU) test, also known as the burning couch cushion test. Due to the optical scattering cross-sections and physics of different smoke types, sensor response from flaming PU is lower than the response from other smokes at a similar obscuration. As such, the ability to detect flaming PU smoke at specified levels will bound the minimum sensitivity of most, if not all, optical detection systems. In practice, the sensor response to the flaming polyurethane smoke can be difficult to separate from the hamburger nuisance test. In the past, setting the pass/fail criteria for a detector was straightforward, at least to minimally meet agency requirements. For the upcoming requirements, the manufacturing and calibration margins are much tighter and may require an increase in algorithmic complexity. The flaming polyurethane and hamburger nuisance tests occur on different time scales and it is straightforward to create a simple algorithm that looks at the slope or rate of change of the smoke to distinguish between the two fires to pass the UL requirements. However, there is a question of how effective this algorithm is in real-world applications.
In fire room tests, the pass criteria are specified in either time passed since the test was initiated or at a defined obscuration level. A typical obscuration sensor is shown in Figure 1, with a light on one end and the photodetector on the other end. For UL tests, the beam is a sodium vapor lamp 4″ diameter and 5′ long. Particles in the path of the beam absorb or scatter light out of the beam path, reducing the amount of light that reaches the detector. For different types of smoke, the relationships between an optical scattering system and an obscuration are different. In the case of the hamburger nuisance test and flaming polyurethane test, a 3× difference in obscuration can be nearly impossible to differentiate in an optical scattering system.

A Typical Smoke Detector
A typical smoke detector is made up of a detector, a microcontroller with an algorithm, and additional components such as loudspeakers, LED indicators, and CO sensors. Photoelectric smoke alarms often use a discrete LED (typically near-infrared, 850 nm or 880 nm) and a discrete photodiode with a typical 135° angle between them and a separation of several cm.

Figure 1. Reference measurement.
LED light of a specific wavelength is scattered by particles onto a photodiode. As shown in Figure 2, the distance between the LED and the photodiode is usually a few centimeters.

Figure 2. Forward scatter system with an infrared LED.
However, both the discrete design of the smoke alarm and the measurement method result in a few disadvantages. The main one is that monochromatic LEDs lead to a higher false alarm rate because they make it harder for different particles to be distinguished from one another. In addition, a discrete implementation is large and associated with a higher power consumption. Laborious calibrations are also necessary. The technology for the optical components has advanced to the point that the LEDs and the photodiodes, along with the optical front end, can be integrated into a small housing.

Addressing the New Challenge
ADI has created a technology to help address these issues: the ADPD188BI. It directly integrates two LEDs (blue and infrared), a photodiode, and an analog front end. Digital output over I²C or SPI enables a connection to a microcontroller. A block diagram of the ADPD188BI is shown in Figure 3. As can be seen in the figure, the complete signal chain is realized in a single 5 mm × 3.8 mm chip.

Figure 3. Block diagram of the ADPD188BI.
The ADPD188BI works by emitting a short LED pulse of a few microseconds. Some of this light is scattered by the smoke particles back onto the photodiodes (see the cross-section of the ADPD188BI in Figure 4). The analog front end (AFE) includes the transimpedance amplifier, band-pass filter, integrator, ADC, LED drivers, and digital control (see the middle of Figure 3). There are many options inside the AFE to enable optimization for different applications and use cases. The AFE also provides the ability to reject ambient light, such as from lamps or solar radiation at levels up to 80 dB.

Figure 4. Cross-section of the ADPD188BI.
This principle provides many significant advantages. The short distance between the LED and PD results in much more efficient use of light, which reduces the power dissipation of the system for a required sensitivity and results in a longer battery lifetime. Two different LED colors are included in the device. The amount of light scattered by the particles is a function of wavelength. This provides limited use for separating the hamburger and flaming polyurethane smokes, but can be used to distinguish between relatively small smoke particles (100 nm to 300 nm diameter) and much larger smoldering plastic or steam particles (10 μm diameter). The highly configurable AFE inside the ADPD188BI provides for a very high dynamic range that is software configurable and can be adjusted on the fly. The SNR of the system can also be easily adjusted to optimize for power or performance on the fly. One example would be to dynamically increase the sample rate or SNR when smoke has been detected to more accurately differentiate between a nuisance source or a real fire. The integration of the system also enables Analog Devices to calibrate the loop response (LED driver  LED  PD  AFE) of the parts and burn calibration coefficients into the AFE to limit the part-to-part variation to better than ±10%, which reduces or eliminates the need for expensive and time-consuming sensitivity calibrations in smoke tunnels. The ADPD188BI provides the features and capabilities to increase the performance of smoke detectors to more accurately separate nuisance sources from fire events. As well as performance, there are further advantages: the integration of LEDs means separate LED sourcing and stocking is eliminated, and the small form factor allows for integrated smoke detection across intelligent building components.
About the Author
Christoph Kämmerer has worked at Analog Devices in Germany since February 2015. He graduated in 2014 from the Friedrich Alexander University in Erlangen with a master’s in physics. He then worked as an intern in process development at Analog Devices in Limerick. Having completed the trainee program in December 2016, he now works as a field applications engineer at Analog Devices and specializes in emerging applications. He can be reached at christoph.kaemmerer@analog.com.

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Making cities smarter and safer with innovation from the Edge to the Cloud

Smart cities bring together technology and infrastructure to improve the lives of citizens through greater safety and efficiency. However, rising populations in large urban areas intensifies the challenges that cities face in terms of managing infrastructures and actively protecting citizens. Combine this with increased mobility of urbanising populations, with more people travelling in greater distances than ever before, and it’s clear that additional technology solutions will need to be utilised and existing ones improved. Highways agencies and police forces already use video extensively to monitor traffic congestion, respond to accidents, and spot threatening behaviour in town centres. But could these systems be optimised to make roads safer?

With greater camera resolution, they could. Enhancing the ability to recognise vehicle number plates could help tighten up enforcement of traffic rules, ultimately reducing contraventions – particularly disobeying traffic lights or junction restrictions – that cause congestion as drivers come to understand they are highly likely to be prosecuted. Enhanced traffic-flow cameras and speed cameras can also help reduce congestion and encourage safer driving. Other opportunities to improve the quality of information provided by cameras include extending the typical field of view and improving night-vision performance, both of which could be achieved by combining multiple image sensors.

In addition, combined with greater intelligence in decoding human body language, high-resolution smart cameras can become better at pre-empting disturbances so that help can be dispatched.

To achieve this, improvements are needed at both the front-end and back-end of the system. Simply upgrading to high-resolution image sensors, such as 4K sensors, greatly increases the data associated with each frame that must be captured and conditioned by edge devices and transmitted to the cloud to be stored and analysed.

Field Programmable Gate Arrays (FPGAs) are known for their ability to perform massively parallel signal processing on multiple streams of high-speed data in real-time. Xilinx’s Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) devices, which are fabricated using today’s leading 16nm process technology, enable a single-chip solution containing a 4K video encoder implemented as hard IP that eliminates the typical signal latencies associated with chip-to-chip communications. Moreover, this year Xilinx has delivered new MIPI IP with 2.5Gbps/lane, creating the fastest peripheral interface in the market today.

Xilinx is also involved in a number of projects to develop systems such as night-vision cameras, stereo traffic snap cameras, panoramic cameras, and AI boxes for smart-city use cases.

In addition, AI technology is becoming deeply integrated into front-end and back-end video equipment, enhancing the accuracy and efficiency of the whole system. A typical back-end system that connects with smart cameras comprises a smart network video recorder, smart server and video management software (VMS). AI-powered intelligent video analysis technology is the essence of these products and smart NVR/server offers real-time video analysis with metadata. In addition, smart NVR supports intelligent index by event, achieves precision recording and saves storage space.

To improve performance here, Xilinx innovations include the Alveo™ U50 adaptable accelerator card that integrates 16nm UltraScale+™ FPGAs and high-bandwidth memory (HBM2) chips with 460GB/s bandwidth for cloud acceleration. Moreover, the latest Versal™ Adaptive Compute Acceleration Platform (ACAP) – with its multi-terabit-per-second Network on Chip (NoC) interconnect and advanced AI Engine that contains hundreds of tightly integrated VLIW SIMD processors – now moves computing capacity beyond 100 tera operations per second (TOPS @ INT8). This could dramatically improve the AI capability of intelligent video systems and significantly accelerate AI applications at the edge and in the cloud.

Smart Surveillance image figure 2
 Smart Video Surveillance System – Edge – Cloud 

Xilinx is also building the innovative ecosystem developers need to apply these advanced devices in their projects, including tools such as Vitis™ for application development and Vitis AI™ for optimising and deploying accelerated machine-learning inference.

Figure 3 Smart City

Vitis Unified Software Platform Overview

AI technology inspires cities as they pursue their journeys towards smart safety, smart infrastructure, and smart transportation. Various advanced technologies, including innovative FPGA, MPSoC and ACAP devices, as well as AI accelerator cards that integrate these devices to accelerate their deployment in edge and cloud applications, to enable autonomous AI platforms that are capable of handling, in real-time, the enormous quantities of data that these smart cities will generate.

Future generations of AI could move our understanding of the smart city forwards from a basically reactive concept to instead embrace predictive resource management, introducing data from potentially thousands or millions of pervasively distributed sensors such as traffic sensors, parking sensors, air-quality sensors, weather sensors, ambient-light sensors, and maybe many other types, too. The smart city of today is an embryonic version of what is to come .

 

Trevor Weng

Industrial, Vision, Healthcare & Sciences Marketing Manager at Xilinx

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Get started with smart home audio design

Smart home technology has expanded rapidly in recent years. A growing number of households are adopting smart speakers like Amazon Echo and Google Home. Companies that once made simple home appliances now have a demand for high-fidelity audio output. This audio goes beyond the typical beep or tone announcing that the laundry is done; this type of audio technology enables a fridge to read a grocery list aloud, or have a light switch remind someone to turn off the lights before leaving the room.

Adding advanced audio features can be daunting, adding complexities to an engineering team’s already constrained design timeline. In this post, I’ll discuss four challenges related to smart home audio design and how to simplify the process.

1. Project requirements are difficult to define.

The project you’re working on sounds simple enough: make this appliance talk. But many design choices and challenges accompany audio output, and it can be difficult to choose the right amplifier among a sea of options that at first glance all seem very similar.

To simplify the amplifier selection process, TI’s interactive block diagrams provide component recommendations for specific smart home applications. For example, the smart speaker block diagram shown in Figure 1 highlights the audio subsystem and various speaker amplifiers with features that address a variety of smart home design requirements. Audio reference designs on the same page provide schematics and companion parts that you can use as a template for your project, increasing system-level knowledge and reducing component selection woes.

Figure 1: Smart speaker block diagram

ti art 2

TI block diagrams are a great first step for starting a design, but the selection of a speaker amplifier will ultimately come down to your project requirements. Two of the most common requirements in smart home products are high efficiency and sleek device profiles.

2. Audio output and advanced features decrease energy efficiency.

Adding extra functionality to a smart home device increases power consumption, and audio is no exception. As tech companies strive to go green and governments add regulations on standby power, it’s become more important to optimize the next generation of products for low power consumption. Inefficient audio systems contribute heavily to wasted power and decrease user satisfaction by raising electricity bills, depleting batteries faster and even making devices hot to the touch.

Audio amplifiers are not always playing, but they must be responsive when users need feedback or a notification; think of a security camera or a smart display in idle mode. On the other hand, a Bluetooth® speaker blasting a summer playlist needs to play music efficiently so that its battery (and the pool party) can last all day.

There are two main aspects of power consumption in audio: efficiency during play and idle mode. A  Bluetooth® speaker blasting a summer playlist needs to play music efficiently so that its battery (and the pool party) can last all day. Whereas, a smart display waiting for a voice-command should not consume an excessive amount of power if it’s not playing audio.

To address diverse applications around the smart home, TI’s latest speaker amplifiers have advanced power-management features built in. A proprietary Hybrid Modulation scheme minimizes idle current losses in >12-V systems. An integrated Class-H control of the supply rail can extend runtime by 50% in battery-powered systems. Figure 2 shows how a Class-H solution dynamically changes the supply rail to reduce power losses.

Figure 2: A dynamic supply rail saves significant power over a fixed rail

tI art 3

Using a device with an integrated boost and Class-H control can save space, overall bill-of-material cost, and power consumption while supporting look-ahead to prevent audio clipping. For applications above 12V, an amplifier with integrated Class-H control and an external boost can still provide significant power savings and look-ahead to prevent clipping. Both solutions save demand on the host processor and reduce software development through integration.

3. Physical constraints limit audio performance.

Electronics are shrinking into sleek, minimalistic designs. The limited form factor in home appliances that were never designed for audio makes it difficult to add extra components such as amplifiers, digital signal processors (DSPs), boost converters and speakers without compromising the overall solution size.

With these constraints in mind, TI’s audio teams have focused on creating amplifiers that integrate more features to reduce external components and optimize the audio subsystem’s footprint.

In a smart speaker that is the center of the smart home ecosystem, high-quality music and virtual assistant feedback are crucial to user satisfaction. Adding an audio DSP to produce high-quality output typically adds cost and increases the printed circuit board (PCB) footprint. TI offers audio amplifiers with integrated processing, enabling speaker tuning to output the clearest virtual assistant response and richest music experience. An external echo-cancellation algorithm can even use the post-processed signal to help a smart speaker more accurately distinguish between audio output and user voice commands.

Electromagnetic interference (EMI) is caused by the high switching frequency of Class-D speaker amplifiers, which adds distortion to an audio signal. This is usually suppressed by several large inductors, but features like spread spectrum and phase optimization suppress EMI without the need for large external inductors, and save both space and cost while producing audio output with ultra-low distortion.

Typically, a speaker’s output power is closely related to its size; if you want louder sound, you’ll need a bigger transducer, which isn’t always an option when designing a space-constrained product. A video doorbell needs to output a homeowner’s voice loud and clear, even in noisy environments, while maintaining a slim profile. Small speakers that fit in these designs tend to output lower power and are more easily damaged by overheating or over excursion. Thanks to TI speaker protection algorithms, smaller speakers can safely output higher volume and better quality than ever before. Hear the difference in this Smart Amp A/B experiment.

As pictured in Figure 3, TI Smart Amps allow engineers to take full advantage of a speaker’s capabilities and output higher average power without compromising the integrity of the transducer. Therefore, in a noisy environment, the increased output means a user can more easily hear from a video doorbell or a smart display. Clear communication is critical in these applications and the two-way audio reference design utilizing TI Smart Amplifiers can help lay the foundation for a successful project.

Figure 3: Speaker protection amplifiers enable speakers to output twice the loudness as traditional amplifiers without damaging them

ti4

In addition to loudness, thermal dissipation is an important design consideration. Heat dissipates poorly in small form factors, posing a problem for ever-shrinking smart home products. Heat damages internal components and creates a poor user experience. Designing with thermal energy in mind means considering PCB layout and copper thickness or implementing features like thermal foldback, which enables speaker amplifiers to reduce heat by adjusting the gain on audio signals on the fly in the event of overheating. Keeping thermal management in mind from the beginning leads to safe and reliable products.

4. Advanced audio amplifier technologies/features require deep expertise and are difficult to implement.

Advanced features solve many problems and sound great on paper, but often are too difficult to implement. To simplify the design of next-generation products, TI has not only integrated advanced features into our amplifiers, but made them easily controllable through a free software tool.

The PurePath™ Console 3 software suite is an easy-to-use graphical user interface that simplifies working with these devices. Using the software, engineers can quickly tune audio output, calibrate settings and characterize speakers. Step-by-step tuning and characterization wizards as well as a library of training resources lower the learning curve associated with using new tools.

Power management, speaker protection and audio equalization are integrated in some TI Audio devices and are easily configurable through PurePath™ Console 3, requiring little to no extra software development effort. This makes it possible to create a power-efficient, high-fidelity audio subsystem that improves user satisfaction with low risk to your overall project timeline.

Additional resources

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