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Würth Elektronik is a partner in the EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty in electronic components and systems, with a particular focus on drones and robotics for civilian applications.

At the core of the project is the development of state-of-the-art, secure, and environmentally friendly unmanned vehicle systems (UxV) designed to protect critical infrastructure and create new opportunities for emergency response operations. Key priorities include interoperability, autonomy, and rapid deployability.

Würth Elektronik contributes its expertise in printed circuit board (PCB) technology and collaborates with project partners to develop intelligent drone systems for rescue and disaster scenarios. Equipped with advanced sensors and radar technologies, these autonomous aerial vehicles can detect temperature changes, hotspots, or people in danger in real time—even in inaccessible terrain. This generates precise situational awareness to support emergency responders in the rapid and targeted coordination of firefighting and rescue operations.

A central contribution from Würth Elektronik lies in the development of miniaturised, high-frequency PCBs with integrated components, capable of delivering peak performance under extreme conditions. Through innovative materials, flexible designs, and precise signal routing, these solutions set new benchmarks in reliability and efficiency.

Through PROACTIF, the deployment of intelligent, connected technologies contributes significantly to civil security and disaster management across Europe.

PROACTIF is a visionary European research project focused on the development of unmanned vehicle systems for civilian applications. The three-year project commenced in June 2025, with a total budget of €41.8 million, including EU and Member State funding of €27.2 million.
PROACTIF brings together 42 leading European technology companies from 13 countries to manage emergency situations more efficiently and secure critical infrastructure.

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Tobii and ST have announced the beginning of mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide field-of-view camera able to see in daylight and at night with next-level driver and occupant monitoring, pushing the boundaries of user experience and safety.

“We’re very proud to bring this groundbreaking system to life. This is more than just technology; it’s a vision,” said Adrian Capata, senior vice president of Tobii Autosense. “Image quality is critical, and thanks to our strong collaboration with ST, we’ve achieved a unique balance that allows a single-camera solution to meet rigorous safety standards, while also unlocking enhanced user experiences. By combining visible and IR sensing, we’re enabling intelligent in-cabin environments that truly understand human presence, behaviour, and context.”

“As a result of close collaboration on development and integration with Tobii, we have created a new generation of interior sensing technology that is reliable, user-friendly, and ready for widespread adoption across the automotive industry,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “We are now rapidly expanding our production capacity to meet the anticipated demand and ensure a seamless transition to mass manufacturing.”

Tobii’s and ST’s integrated approach allows automotive OEMs to install just one camera inside the cabin, providing the most mature, efficient, and cost-effective solution available on the market.

The system combines Tobii’s attention-computing technology with STMicroelectronics’ VD1940, an advanced image sensor designed primarily for automotive applications. This sensor features a single 5.1MP hybrid pixel design, sensitive to both RGB (colour in daytime) and infrared (IR at nighttime) light. Its wide-angle field of view covers the entire cabin, delivering exceptional image quality. Tobii’s algorithms process dual video streams to support both the Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS).

The VD1940 image sensor is part of the SafeSense by ST, an advanced sensing technology platform designed by STMicroelectronics for DMS and OMS. which embeds functional safety and cyber security features and is dedicated to automotive safety applications.

www.tobii.com

www.st.com

Infineon Technologies and Goldwind Science & Technology have expanded their collaboration, enabling a stable and reliable flow of electricity in wind power generation. Infineon will supply Goldwind with its XHP 2 1700 V IGBT5 power modules with .XT technology that will enhance energy efficiency in Goldwind’s grid-forming GW 155 – 4.5 MW wind turbines.

Grid-forming wind turbines act as stabilisers within the energy grid. Unlike conventional turbines that passively follow the grid, the grid-forming technology allows wind farms to mimic the stabilising properties of traditional rotating generators. By using power electronics, grid-forming wind turbines can generate a stable frequency and maintain grid voltage, even when the load in the power grid changes.

“The emergence of grid-forming wind turbines enables wind farms to evolve from simple power suppliers into stabilising pillars of the energy grid.” said Ye Jiqiang, Vice President of the Wind Power Industry Group and General Manager of the Supply Chain Centre at Goldwind. “We look forward to further deepening our long-term collaboration with Infineon, leveraging efficient and reliable cutting-edge technology to advance renewable energy systems.”

“Collaborating with Goldwind to support their grid-forming wind turbines underscores Infineon’s commitment to strengthening global energy systems and further advancing renewable energy integration,” said Dominik Bilo, Executive Vice President and Chief Sales Officer Industrial & Infrastructure at Infineon. “Together, Infineon and Goldwind are driving decarbonisation by enhancing the reliability and efficiency of wind power generation.”

Infineon’s XHP 2 1700 V IGBT5 power modules use the .XT interconnection technology. This technology is characterised by improved wire bonding, reliable chip attachment, and high-reliability system-soldering, enabling power modules to support increased cycling loads at higher temperatures compared to standard joining technology. The power modules feature low stray inductance and a design well-suited for paralleling, simplifying development for customers and enabling greater flexibility for platform upgrades. They provide exceptional lifetime even under challenging operating conditions such as those in wind turbines. As a result, they minimise unplanned downtimes and maximize wind energy harvested.

https://www.infineon.com/