Infineon at TRUSTECH 2025: Future-proof payment and ID solutions for a digital, connected world

At TRUSTECH Infineon will showcase its latest solutions that are shaping the future of secured digital interactions. From December 2 to December 4, at booth F025 in Pavilion 5.2, Infineon will present a range of future-ready products designed to power a connected, digital world. Highlights include:

Post-Quantum Cryptography (PQC) is essential today to safeguard data against tomorrow’s quantum threats. Infineon has reached a key milestone with its TEGRION SLC27 security controller: its Common Criteria EAL6+ certification now includes a fully approved cryptographic library featuring the PQC algorithms ML-KEM and ML-DSA. This milestone has been recognised with the nomination of TEGRION SLC27 for the TRUSTECH Innovation Award, which will be presented on December 2. At the trade show, Infineon will demonstrate the TEGRION SLC27’s advanced capabilities, including PQC implementation. Additional highlights include Thales’ newly certified MultiApp 5.2 Premium PQC smartcard and Eviden’s proven GreenShield end-to-end encryption software.

Infineon ID Key S USB enables easy and secured access and identity management, fully aligned with industry standards such as FIDO (Fast Identity Online). Paired with Infineon’s SECORA ID Key platform, it combines hardware and software to deliver a comprehensive, flexible security solution. Its integrated USB interface, in addition to NFC support, adds an extra layer of convenience and versatility. The platform’s open architecture empowers customers to develop customised solutions, accelerating time-to-market.

SECORA ID demonstrates how traditional electronic ID (eID) documents can complement mobile ID solutions. Acting as a secured root of trust, the platform enables reliable and scalable deployment of digital identities in real-world environments. Visitors can explore how mobile and physical ID credentials work together to enhance user convenience and security. In collaboration with PAV Card GmbH, a live demo of the Multi-Trust Smartcard based on SECORA ID will showcase how secured access to healthcare systems can be maintained even during network outages, allowing patient safety and operational continuity in critical environments.

SECORA Pay M is the latest addition to Infineon’s SECORA Pay solution family, enabling fast, efficient payments and secured authentication. The pioneering platform offers a one-stop solution that supports multiple use cases, including EMV (MasterCard and VISA) payment, Tap-to-X use cases and FIDO authentication – allowing users to access a wide range of services from a single device. By integrating FIDO, SECORA Pay M enhances the security and user experience of e-commerce and online banking, staying ahead in payment and authentication technologies.

SECORA Pay Green is paving the way for a more sustainable future in the payment industry. The innovative eCoM module integrates a contactless antenna directly into the module to reduce CO₂ emissions by over 60% related to the sourcing and logistics of the raw materials (security chip and module) for card production, as reported by Climate Partner. SECORA Pay Green has been recognised with the TRUSTECH innovation award 2024 and was added to Mastercard’s Card Eco Certification program recently. The solution enables fully recyclable card bodies, setting a new benchmark for environmentally responsible payment technologies.

SECORA Pay Bio enhances convenience and trust in biometric contactless payments. This all-in-one solution extends Infineon’s proven SECORA Pay turnkey family to meet the user demand for fast and secured payment experiences. It enables scalable, high-volume production of robust and reliable biometric payment cards, delivering a seamless user experience. SECORA Pay Bio supports a variety of enrolment methods, including sleeves, smartphone apps, and in-field enrollment.

The pop-up nail salon returns to TRUSTECH in collaboration with Smart Chip and Digiseq. A nail care professional will apply a smart chip with integrated payment functionality directly to the fingernail, enabling seamless contactless payments. The Smart Chip is a multifunctional inlay that is permanently attached to the fingernail powered by Infineon’s SECORA Pay solution family.

infineon.com

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CargoBeacon partners with Panasonic for AI-powered asset tracking

Panasonic Industry Europe has recently been partnering with CargoBeacon to support their design engineers with the development of their EverTag product line, a range of rugged and compact tags designed for tracking and monitoring assets in challenging or harsh industrial environments. EverTag allows customers in industries like healthcare, manufacturing, logistics, construction, and warehousing to track the exact position of assets and to manage their inventory efficiently.

Using Panasonic’s PAN1780 Bluetooth 5.3 Low Energy module, the team at Panasonic Industry Europe assisted CargoBeacon to achieve the required tag reach, reliability and worldwide certification for EverTag tags and enables real-time and historical data streams vital for AI analytics of asset locations. The PAN1780 Bluetooth module was chosen for its radio performance (8dBm output power), long-range capabilities, and global certification coverage (the module is pre-certified in major global markets, enabling quick time-to-market). It enables wide mesh coverage with fewer anchors, simplifying infrastructure, and reducing deployment costs.

Working together with Panasonic Industry allows CargoBeacon to focus on their key strengths: Building smart and scalable solutions that are easily installed to help businesses track and manage their assets. At the same time, they can rely on Panasonic’s reliable wireless performance, and historically strong European supply network.

Daniel Lindberg, COO at CargoBeacon: “Working together with Panasonic helped us move faster and stay aligned during our product development phase. Having a local partner with a global relevance also made it easier for us to source required components quickly and with lower transport impact.” Lindberg adds:” Panasonic’s PAN1780’spre-certification in major global markets, including the US, EU, China, Japan, and Korea, allowed us to accelerate time-to-market by bypassing lengthy certification processes. This gives us the confidence to scale globally without having to compromise in quality and performance.”

“As the demand for AI-ready asset data grows, we see Panasonic as a long-term partner. Together, we will explore deeper integrations including sensor-rich tags, edge AI, and energy efficient communication,” adds Olov Hisved, CEO at CargoBeacon.

“Supporting our customers in achieving the best performance from our products is at the heart of our mission. CargoBeacon’s EverTag was a perfect match for our PAN1780 module. We’ve demonstrated that we are the right partner to deliver reliable wireless connectivity, enabling future-proof technology and collaborating with visionary founders like Olov and Daniel to create impactful, real-world applications.” comments Pascal Meier, Head of IoT Devices at Panasonic Industry.

cargobeacon.com

industry.panasonic.eu

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Farnell launches The DevKit HQ for embedded evaluation boards, kits, and tools

Farnell, an Avnet company, has launched The DevKit HQ, a new online resource that brings together evaluation boards, development kits, single board computers (SBCs), tools and technical documents in one place.

A recent survey of engineering professionals found that finding the right development kit is a big challenge, with many engineers relying on kits to explore new technologies before starting projects. The survey also revealed that engineers value standard interfaces and extensibility, often combining or modifying multiple kits to build prototypes and proof-of-concept designs.

The DevKit HQ addresses these needs by providing a single destination to discover, compare and select solutions from leading semiconductor and hardware suppliers.

The site enables engineers to quickly find the latest development kits and modular solutions by application, along with available demo and application software. Engineers can also easily locate evaluation boards that match a supplier’s product family or series.

Additionally, the site features each kit’s datasheets, application notes, training videos, reference designs and more. Together, these resources help engineers accelerate design decisions and drive innovation across various applications, including AI, IoT, sensors, wireless, motor control and power management.

“Our mission is to make life easier for design engineers,” said Daniel Ford, Vice President of Sales at Farnell Global. “With The DevKit HQ, we’ve created the leading destination where they can search development kits by application as well as explore new technologies, experiment with the latest kits, and move from idea to prototype faster, freeing up more time to focus on innovation.

uk.farnell.com

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dSPACE integrates OMNIVISION camera models into AURELION sensor simulation

dSPACE and OMNIVISION, a developer of CMOS image sensor technologies, are collaborating. The aim of the partnership is to advance the development of ADAS and AD systems. As part of the collaboration, the realistic simulation of OMNIVISION image sensors will be integrated into AURELION, the physics-based simulation platform from dSPACE.

Cameras are an essential component of ADAS and AD systems, as they enable precise detection of the surroundings. They provide important data for object detection, lane tracking, and obstacle avoidance, which are essential for the safety and efficiency of these systems.

The realistic sensor simulations in AURELION make it possible to reproduce various driving scenarios and conditions as they occur in the real world. Simulations enable developers to ensure that ADAS or AD systems are reliable and robust long before they hit the road.

“Models for OMNIVISION cameras are now part of our sensor simulation solution AURELION. By expanding our technology partnerships with one of the world’s leading developers of semiconductor technology, we are extending the testing options for our customers, shortening development cycles, and reducing costs from the development phase to validation,” explains Caius Seiger, Product Manager Sensor Simulation at dSPACE.

“Through our collaboration with dSPACE, we are able to bring OMNIVISION’s high-performance image sensors into a highly realistic virtual testing environment. With AURELION’s physics-based simulation capabilities, developers can validate their ADAS and autonomous driving systems earlier and more efficiently, accelerate innovation, and ensure safer, more reliable perception solutions for the automotive industry,” says Steve Wang, Director of Imaging Technologies, OMNIVISION.

https://www.ovt.com

https://www.dspace.de

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