New eBook from Mouser provides a guide to RF design and applications

Mouser has announces a new eBook, The RF Design Handbook: Theory, Components, and Applications. The eBook delves into key radio frequency (RF) design topics ranging from signal chain fundamentals and antenna selection to testing, certification, and digital integration.

Many of the devices and systems that people rely on for wireless communication, power transfer, navigation, and sensing operate within the RF spectrum. With such a diverse range of applications and markets, designing RF circuits can be a complex and nuanced process. The RF Design Handbook explains key concepts and provides engineers with the knowledge they need to get started. The eBook also explores the tools and components that will help engineers bring their ideas to life. Among the new products featured in the eBook are the following:

The WFI32E04UE Wi-Fi® microcontroller (MCU) module from Microchip Technology is a high-performance solution for industrial applications. The fully certified module supports 2.4 GHz 802.11 b/g/n radio modes and offers comprehensive WLAN functions for industry-leading connectivity. To ensure reliable and versatile wireless communication, the WFI32E04UE module supports AP, STA, SoftAP, TLS, and WPA/WPA2 modes. A U.FL antenna connector allows for connection to an external antenna.

The GNSS L1 passive ceramic patch and chip antennas from TE Connectivity/Linx Technologies deliver high performance, reliability, and efficiency. The antennas operate within a frequency range of 1561 MHz to 1602 MHz and feature a 50-ohm impedance. Surface-mount and through-hole mount options are available. The GNSS L1 antennas are suitable for applications including asset tracking, precision surveying, and Global Navigation Satellite Systems (GNSS).

The High-Speed FAKRA-Mini (HFM) interconnect system by Molex provides a compact, high-performance solution for modern vehicle architectures. The HFM connectors support data rates of up to 28 Gbps at frequencies of up to 20 GHz. Featuring a compact form factor, the HFM connectors reduce weight, save installation space, and maximize limited PCB real estate. The High-Speed FAKRA-Mini HFM interconnect system is ideal for applications including internet connections, infotainment systems, 5G, Bluetooth®, and Wi-Fi.

The EFR32BG29 series 2 Bluetooth wireless SoCs from Silicon Labs are an advanced, ultra-low-power solution designed for high-performance wireless applications. The EFR32BG29 SoCs feature a powerful 76.8 MHz Arm Cortex-M33 core, providing sufficient processing power for complex applications while maintaining energy efficiency. Featuring a 2.4 GHz radio with excellent sensitivity, the EFR32BG29 Series 2 SoCs are an ideal choice for reliable, long-range connectivity.

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element14 community launches annual holiday competition

element14 Community has launched its annual holiday competition, inviting members to create electronics projects inspired by the holidays and what they mean to them. Participants can compete for prizes by submitting a write-up detailing how they built their project and demonstrating how it works.

This holiday season, element14 Community is highlighting its curated winter wish-lists for engineers and students. The STEM-inspired gift guide includes practical tools, kits and resources to support learning and hands-on projects.

Examples from last year’s competition include an electronic elf, an interactive mini Zen garden and a musical, motion-activated wreath.

Andreea Teodorescu, Global Director of Product Marketing & element14 Community, stated, “To us, the holidays are about creativity and connection. This competition gives our members the chance to share what the season means to them while showcasing their engineering skills in fun and innovative ways.”

To enter, participants must submit their project write-up on the element14 Community by 11 January 2026. Projects can be gifts, decorations or party accessories, as long as they include electronic components and reflect what the holidays mean to them.

 

To explore holiday wishlists, visit – community.element14.com

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Infineon and Lenovo collaborate to accelerate next level ADAS

Infineon and Lenovo are intensifying their collaboration to accelerate the next level of autonomous driving. Lenovo’s flagship autonomous driving domain controller units AD1 and AH1 will take advantage of Infineon’s AURIX family of microcontrollers to support advanced driving assistance systems (ADAS), energy efficiency and high-speed data exchange across in-vehicle networks. The collaboration aims at enabling intelligent, high-performance automotive computing platforms that power AI integration in software-defined vehicles (SDVs). The joint solution builds a scalable foundation for OEMs to develop connected, safe, and smart vehicles, supporting autonomy levels from L2 Partial automation, L3 Conditional automation to L4 High automation.

The joint solution is designed to accelerate the transition towards software-defined vehicle architectures by enabling faster development cycles, greater flexibility, and enhanced dependability. Infineon and Lenovo will work closely with more partners across the automotive value chain – reinforcing ecosystem partnerships in areas such as system integration, services, software and tools. Both companies are committed to expand their collaboration in the future, by combining advanced hardware platforms with intelligent software integration to enable a new era of connected, automated and sustainable mobility.

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Advantech and Axelera AI partnership to accelerate Edge AI innovation

Advantech has announced a new strategic collaboration with Axelera AI, a pioneering AIPU solution provider, to jointly develop a new generation of Edge AI acceleration modules powered by the Europa AIPU.

These joint solutions will complement Advantech’s existing suite of products that support Metis and target low-power, high-performance edge use cases. The partnership furthers Advantech’s commitment to integrating advanced AI acceleration technology, delivering high-performance solutions to market ahead of the industry curve and supporting customers across industrial automation, robotics, smart cities, and medical imaging to accelerate the adoption of edge AI applications.

“This collaboration with Axelera AI marks an important milestone in Advantech’s AI acceleration roadmap,” said Joey Hsu, Director of Advantech’s Embedded Sector. “By combining Axelera AI’s cutting-edge neural processing technology with Advantech’s system design expertise and global deployment capabilities, we are enabling customers to deploy cutting-edge AI solutions with greater speed and scalability.”

At the core of the partnership is Advantech’s new Edge AI Acceleration Module (EAI-3841 series), featuring the Europa AIPU, which delivers up to 629 TOPS of performance and supports up to 164GB of LPDDR5 memory. With eight AI cores, integrated RAM per compute unit, and a built-in video decoder, the module enables real-time, complex model analysis, including VLM, and VITs. Additionally, it is designed for companies seeking multi-camera analysis—ideal for robotic vision, intelligent surveillance, in-vehicle systems, and precision medical diagnostics.

“We are excited to further our collaboration with Advantech, a recognised leader in industrial edge computing,” said Nicolas Silvestre, Director of Sales, APAC – Axelera AI. “The integration of our Europa AIPU into Advantech’s platforms will empower customers with unprecedented AI performance and efficiency, enabling smarter, faster, and more sustainable edge applications.”

www.advantech.com

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