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Maxim Works With Qualcomm Automotive Solutions on Infotainment Applications for the Smart, Connected Car

Sat, Feb 16, 2019

Maxim’s power management, USB charging, next-generation GMSL SerDes, remote tuner, and SDR technologies are featured within the Qualcomm Snapdragon 820 Automotive Platform

Maxim Integrated Products, today announced that select products from its portfolio work with solutions by Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to help carmakers and tier-1 suppliers integrate Maxim’s Automotive Safety Integrity Level (ASIL) solutions using the Qualcomm® Snapdragon™ 820 Automotive Platform for infotainment applications. Maxim’s high-performance solutions are designed to provide the necessary building blocks for next-generation vehicles.

Maxim’s advanced ASIL-rated power management, USB charging, next-generation gigabit multimedia serial link (GMSL) serializer and deserializer (SerDes), remote tuner, and software-defined radio (SDR) technologies are optimized to work with the Snapdragon 820 Automotive Platform. As a result, automakers can now achieve a scalable, comprehensive development platform while also addressing needs of high-performance automotive infotainment systems.

The Snapdragon 820 Automotive Platform is an advanced automotive-grade solution that is custom-built with highly optimized cores designed for heterogeneous computing. It runs on Qualcomm Technologies’ custom-built 64-bit Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. The Snapdragon 820 Automotive Platform is also designed to allow the infotainment system to receive software updates, allowing vehicles to be upgraded with the latest features and differentiation.

Key advantages provided by Maxim’s technology

•Power Management: Provides voltage and power monitoring needed to manage the power at the point of load in each device, which becomes necessary as increasing numbers of control modules, sensors, and actuators are distributed throughout the vehicle

•USB Ports Support: Fast-charge detection supports both hi-speed (480Mbps) and full-speed (12Mbps) USB operation, allowing consumers to recharge their USB devices while driving; Includes short-to-battery and short-to-ground protection

•Next-Generation GMSL SerDes: Supports the high data rate, complex interconnect, and data integrity requirements of future automotive infotainment applications

•Remote Tuner and SDR: Architecture simplifies head unit design while improving radio signal quality and reducing cost, weight, and power consumption

“The Snapdragon 820 Automotive Platform was designed to offer automakers a solution that supports a superior and fast connected experience that consumers expect today,” said Nakul Duggal, vice president of product management, Qualcomm Technologies, Inc. “To have our solutions optimized to work with Maxim’s products is a testament to our commitment to continue offering leading solutions for our customers—both in feature-rich technologies and safety advances.”

“As the automotive industry continues to see unparalleled growth, it is more important than ever to provide a breadth of tools that can support advanced infotainment functions,” said Randall Wollschlager, vice president of the Automotive Business Unit at Maxim Integrated. “By including our leading-edge technologies in Qualcomm Technologies’ powerful automotive development platform, we are well-positioned to deliver cutting-edge features to drive the industry forward.”

All trademarks are the property of their respective owners.

Qualcomm, Snapdragon, Adreno, Kryo and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon, Qualcomm Adreno, Qualcomm Hexagon and Qualcomm Kryo are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

About Maxim Integrated

Maxim Integrated develops innovative analog and mixed-signal products and technologies to make systems smaller and smarter, with enhanced security and increased energy efficiency. We are empowering design innovation for our automotive, industrial, healthcare, mobile consumer, and cloud data center customers to deliver industry-leading solutions that help change the world. Learn more at http://www.maximintegrated.com.

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Silicon Labs to Highlight Smart Home and Industrial IoT Connectivity at electronica 2018

Sat, Feb 16, 2019

Learn How to Add Bluetooth®, Wi-Fi® and Zigbee® to Your Product Designs through Hands-on Demos and Conference Sessions

Join Silicon Labs at electronica, Hall C4, Booth 112, to explore the latest silicon, software and solutions for a smarter, more connected world. Discover what’s next for the Internet of Things, discuss the latest IoT innovations with wireless experts, and see live demonstrations of Bluetooth®, Wi-Fi® and Zigbee® connectivity for the smart home and industrial IoT.

Hands-on Demos at electronica

Bluetooth Xpress Solutions: Discover how to add Bluetooth 5 connectivity to end node designs with zero programming and no Bluetooth expertise. Pre-certified BGX13 Bluetooth Xpress PCB and SiP modules provide the easiest wireless development path.

Bluetooth Mesh Networking: Connect with the experts in implementing secure, reliable, large-scale Bluetooth mesh networks. Check out our demo highlighting the capabilities of Bluetooth mesh for smart lighting.

Low-power Wi-Fi: Add energy-friendly Wi-Fi to your IoT designs. Silicon Labs’ WFx200 Wi-Fi devices – including the world’s smallest Wi-Fi SiP module with built-in antenna/crystal – deliver best-in-class power savings for longer battery life.

Home Automation and Control: Seamlessly control Zigbee-enabled, interoperable smart home devices from multiple name brand vendors. See how Zigbee/Bluetooth Low Energy multiprotocol connectivity can enhance the user experience.

Silicon Labs’ IoT experts will present the following conference sessions:

Electronica Embedded Computing Design Industrial IoT Sessions – Hall 3

  • • “Bridging Wireless Worlds: Multiprotocol, Multiband Connectivity for the Industrial IoT,” Tuesday, Nov. 13, 14:00 – 14:30

Wireless Congress Sessions

  • • “Making the Right Choice: Wireless Technologies for the IoT,” Session 1: IoT/Networks, Wednesday, Nov. 14, 11:30 – 12:00
  • • “Comparing Zigbee, Thread and Bluetooth Mesh Performance – Who Wins?” Session 1: IoT/Networks, Wednesday, Nov. 14, 12:30 – 13:00
  • • “Security Tradeoffs and Commissioning Methods for Wireless IoT Protocols,” Session 2: Security, Wednesday, Nov. 14, 12:00 – 12:30
  • • “Trending Near You: Advanced BLE Beacons Using Bluetooth 5;” Session 7: Bluetooth, Wednesday, Nov. 14, 15:30 – 16:00
  • • “Driving Wi-Fi Based Connectivity for Low-Power IoT Applications,” Session 8: Wi-Fi, Thursday, Nov. 15, 12:30 – 13:00
  • • “Radio Scheduling in Dynamic Multiprotocol IoT Applications,” Session 11: Technology, Thursday, Nov. 15, 12:30 – 13:00

Connect with Silicon Labs

Silicon Labs PR Contact: Dale Weisman +1-512-532-5871, dale.weisman@silabs.com

Follow Silicon Labs at http://news.silabs.com/, at http://blog.silabs.com/, on Twitter at http://twitter.com/siliconlabs, on LinkedIn at http://www.linkedin.com/company/siliconlabs and on Facebook at http://www.facebook.com/siliconlabs.

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Silicon Labs Showcases Smart Home and Building Automation Connectivity Solutions at Embedded World

Fri, Feb 01, 2019

Silicon Labs will showcase its latest Wireless Gecko connectivity solutions for smart home, lighting and building automation applications at Embedded World 2019. Hands-on demonstrations at Silicon Labs’ Booth 4A-128 highlight easy-to-deploy Bluetooth® mesh and Bluetooth 5 solutions, device-to-cloud connectivity with low-power Wi-Fi®, Zigbee® home automation and control, and next-generation Z-Wave® 700 smart home solutions.

“Silicon Labs offers IoT developers the essential hardware and software building blocks and tools they need to add wireless connectivity to their smart home and building automation products,” said Raoul Wijgergangs, Vice President and General Manager of Smart Home and Consumer Products at Silicon Labs. “From Bluetooth mesh to Wi-Fi to Zigbee and Z-Wave, we offer the full range of low-power connectivity options, and our Embedded World demos and expert engineers will show how easy it is to get started with wireless design.”

Silicon Labs Demos at Booth 4A-128

Bluetooth Xpress Solutions: Discover how to add Bluetooth 5 connectivity to end node designs with zero programming and no Bluetooth expertise. Pre-certified BGX13 Bluetooth Xpress PCB and SiP modules provide the easiest wireless development path.

Bluetooth Mesh Networking: Create secure, reliable, large-scale Bluetooth mesh networks based on Silicon Labs’ Wireless Gecko devices, Bluetooth mesh software, SDKs and tools. See how easy it is to implement a Bluetooth mesh for smart lighting.

Low-Power Wi-Fi: Add low-power, cloud-connected Wi-Fi to your IoT designs with little to no programming. Silicon Labs’ Wi-Fi devices – including the world’s smallest Wi-Fi SiP module with a built-in antenna – deliver best-in-class energy savings for longer battery life by slashing power consumption in half.

Zigbee Smart Home Control: Seamlessly control Zigbee-enabled, interoperable smart home devices from multiple name brand vendors. See how multiprotocol connectivity with Zigbee and Bluetooth Low energy can enhance the home consumer experience.

Z-Wave 700: Unlock the potential of the smart home with Z-Wave 700 based on the Wireless Gecko platform. Z-Wave 700 builds on industry-leading S2 security and interoperability and adds major improvements in energy efficiency, battery life and wireless range, enabling developers to create new classes of smaller, more intelligent smart home products.

Conference Sessions

Silicon Labs’ connectivity, security and embedded experts will deliver the following conference presentations at Embedded World (NCC Ost):

February 26

  • • “Context-Aware Smart Home – Opening the Eyes of AI in the Home through Sensors?” 10:00 – 10:30 a.m., Session 8.1: Intelligent Systems I Applications
  • • “Techniques for Securing Low-Cost Embedded Devices,” 10:00 – 10:30, Session 4.1 I: HW-based Security I
  • • “Making Products Safer and More Secure with an MPU,” 11:30 – 12:00, Session 4.1 I: HW-based Security I
  • • “Supercharging BLE Beacons with Bluetooth 5,” 12:00 – 12:30, Session 2.2: Communication II Bluetooth

February 27

  • • “The Benefits and Challenges of a Common Software Platform for IoT Development,” 14:30 – 15:00, Session 2.5: Communication V Wireless Multiprotocol
  • • “Extending the Abilities of Battery-Powered End Nodes through Better Power Supply Design,” 15:00 – 15:30, Session 5.4: Power Supply
  • • “Radio Scheduling in Dynamic Multiprotocol Applications,” 15:00 – 15:30, Session 2.5: Communication V Wireless Multiprotocol
  • • “Simplifying Product Returns Through Device Security,” 17:00 – 17:30, Session 4.3 II: Security Architectures & Hacking II

February 28

  • • “Common Pitfalls in IoT Security Implementations and How to Avoid Them,” 9:30 – 10:00, Session 4.4 I: Securing IoT I
  • • “Finding the Right Security Level for Your IoT Application,” 10:30 – 11:00, Session 4.4 I: Securing IoT I
  • • “Uncovering Real-Time Bugs with specialized RTOS Tools,” 14:30-15:00, Session 6.6: Software Engineering V Software Quality II

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Silicon Labs

Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and solutions for a smarter, more connected world. Our award-winning technologies are shaping the future of the Internet of Things, Internet infrastructure, industrial automation, consumer and automotive markets. Our world-class engineering team creates products focused on performance, energy savings, connectivity and simplicity. silabs.com

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MEMS accelerometer can change operating mode on-the-fly

Thu, Nov 08, 2018

For industrial applications, STMicroelectronics has combined high measurement resolution and low power in the IIS2DLPC3, three-axis MEMS accelerometer for industrial applications.

The accelerometer can change operating mode on-the-fly, from low power to high resolution, enabling high-accuracy measurements within a limited energy budget. The sensor can provide continuous contextual awareness to wake the host system when action is required and take highly accurate measurements before returning to low power operation.

Users can build longer-lasting battery-powered industrial sensor nodes or medical devices, tamper-proof smart meters, and smart power-saving or motion-activated functions. Low power consumption enables smart accessories for industrial machinery or robotics to be created as convenient battery-powered add-on modules that require minimal integration effort, says STMicroelectronics.

There is a choice of four reduced-power modes which lets users optimise power consumption in different application scenarios. Very low noise, down to 90μg/√Hz in high-resolution mode, permits what the company describes as “outstanding measurement accuracy”. Additional features of the IIS2DLPC give users extra control over power consumption, including easy-to-use one-shot data conversion and a 32-level FIFO for storing batched data to reduce CPU intervention. An integrated temperature sensor and built-in self-test capability are also provided.

For industrial applications, the IIS2DLPC is specified over an extended temperature range from -40 to +85 degrees C and covered by ST’s 10-year product-longevity scheme ensuring long-term availability.

The IIS2DLPC is in production now, packaged as a 2.0 x 2.0 x 0.7mm plastic land grid array (LGA) device.

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