Filtronic’s mmWave tech contributing to Viasat’s direct-to-device (D2D) project.

Filtronic will play an important role in the European Space Agency (ESA) and Viasat’s Direct-to-Device (D2D) initiative, contributing feeder link technology to enable seamless connectivity between Earth and the low Earth orbit (LEO) constellation. Filtronic will work closely with Viasat to define the optimal feeder link requirements and develop high-power RF solutions essential for the success of this proposed, partner funded next-generation satellite network.

This initiative follows a landmark agreement between ESA Director of Connectivity and Secure Communications, Laurent Jaffart, and Viasat Chairman and CEO, Mark Dankberg, who met in Brussels in January 2025 to accelerate the deployment of Non-Terrestrial Network (NTN) LEO D2D systems across Europe and beyond.

Under ESA’s Advanced Research in Telecommunications Systems (ARTES 4.0), a programme that stimulates research and development within ESA’s Connectivity and Secure Communications directorate, Viasat and its European partners, including Filtronic, are working towards the design and procurement of an Open Architecture LEO network capable of delivering 5G non-terrestrial services directly to handheld devices.

Filtronic’s contribution includes advanced feeder link technology for both satellite payloads and ground stations. These feeder links enable high-throughput satellite communications, support both uplink (Earth-to-satellite) and downlink (satellite-to-Earth) transmissions. Filtronics expertise in high- solid state power amplifiers will also be instrumental in enabling high data rate feeder links.

This work builds on Filtronic’s involvement in the ESA ARTES-funded project initiated in 2023, with additional support from the UK Space Agency, a sponsor of both the ARTES programme and Filtronic’s participation in the D2D framework.

https://filtronic.com/

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Melexis’ robotics e-Guide on mastering the integration of sensing solutions

Melexis has launched a new e-Guide, “Engineering the Future of Robotics: Mastering the Integration of Enhanced Sensory Capabilities”, exploring the robotics landscape as well as Melexis’ latest technologies. The document examines how Melexis’s sensor solutions enable engineers to satisfy the industry demand by addressing integration and cost challenges while optimising designs for performance and scalability.

This engaging e-Guide, available on the Melexis website, details key innovations in robotic perception technologies such as 3D tactile sensing as well as internal sensing systems such as high-precision magnetic encoders, inductive, current, and temperature sensors.

In this piece, Melexis analyses the challenges that modern robotics face — from the complexity of integrating high-performance sensing systems into unpredictable environments to the pressures of reducing development time and overall costs. The guide then explores how traditional sensor systems often fall short when addressing the intricate requirements of tactile, positional, and torque feedback in robotic applications, especially in high-volume production.

Engineers will discover how Melexis’ sensor technologies – including Tactaxis and Arcminaxis – not only deliver robust performance but are also specifically designed to ease the transition from prototype to mass production. For instance, Tactaxis offers precise three-dimensional force measurement that emulates human touch, thereby enabling robots to interact safely and naturally with their environment. This is particularly valuable in collaborative and service robotics, where subtle tactile feedback is critical.

The e-Guide further explores the technical drivers behind Arcminaxis – Melexis’ high-resolution magnetic angular sensing solution that simplifies the mechanical complexities of encoder integration without compromising precision. Also discussed are other robotic-specific solutions such Magnetic, inductive, temperature and current sensors.

Beyond technical discovery, the guide dives into wider market trends and the future of robotics, providing engineers with practical, real-world examples and applications.

https://www.melexis.com

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Mouser explores smart tech in farming with agriculture resource hub

Mouser offers insights into the latest innovations in farming through its agriculture resource centre. Through the integration of sensors, drones, and AI, farmers have the capability to collect and analyse vast amounts of data. Technological advancements, like satellites, have enabled farmers to track changes in land use, such as crop growth and vegetation health, which helps feed the growing global population while maintaining sustainable practices. By gaining insights into the field, like pH and CO2 levels in the moisture content, they can better understand their soil quality, leading to enhanced crop yields.

IoT devices are added to optimise agricultural practices like RFID tagging livestock to track their movements and analyse the herd’s feeding behaviours, stress levels, and potential health issues. This new level of data analytics ensures that livestock and plants are receiving proper nourishment in various climates, as well as in greenhouse and indoor agriculture. Connected devices allow engineers to take environmental control and adjust growing conditions through sensors, microcontrollers, and LEDs. Through a range of innovations, traditional farming is evolving into a data-driven and sustainable industry.

The library of resources offers engineers the tools to make informed decisions from irrigation to fertilisation. With eBooks, articles, blogs, and products from Mouser’s technical team and manufacturing partners, readers will gain valuable knowledge on the cutting-edge technology that is transforming agriculture.

https://resources.mouser.com/agriculture/

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Farnell provides the brains behind the bricks shaping the future of smart infrastructure

As design engineers push the boundaries of innovation in automation, surveillance, fire safety, and sustainability, the demand for advanced technologies such as IoT, AI, and data analytics continues to grow.

Customers will now have access to Farnell’s expanded range of innovative products and solutions from leading suppliers, including Amphenol, ams OSRAM, Analog Devices, Arduino, Emerson, NI, Murata, Panasonic, Power Integrations, Renesas, Raspberry Pi, and TE Connectivity—all available under one roof, enabling the development of smarter and more responsive buildings.

Farnell, Andreea Teodorescu, Global Director of Product Marketing and element14 Community, said, “Our focus is on empowering smart building solutions with a wide range of components tailored to optimise logistics, HVAC systems, environmental controls, and security. We are excited to provide engineers with the tools they need to turn innovative concepts into tangible outcomes.”

Some of the key components to support smart infrastructures include:

Analog Devices
• The ADPD188BI integrated optical module for smoke detection; the ADIN2111 low complexity, 2-port Ethernet switch offers low-complexity networking; and the ADuCM4050 ultra-low power ARM Cortex-M4F MCU ensures long-lasting performance in energy-sensitive applications
Raspberry Pi
• AI-Powered RPi 5 Computer is optimised for AI applications, enabling smarter systems. The Compute Module 4 offers a low-cost, production-ready IoT platform, while the Pico 2 delivers powerful edge processing for flexible automation.
Arduino
• The Portenta; Opta and Nicla, are poised to deliver industrial grade sensors for control, edge processing, flexible automation and AI machine learning into existing infrastructures.

Emerson NI
• mioDAQ offers more accurate measurements and simplified user experience. For flexible installation, the DIN Rail Mounting Kit ensures easy horizontal mounting, while the Rack Mount Kit lets securely fit up to two mioDAQ devices in a 19” rack, complete with USB-C cables for effortless connectivity.

TE Connectivity
• The Industrial Mini I/O ensures dependable serial, bus, and Ethernet connections, M8/M12 connectors provide a fast, hybrid solution for future-ready designs, and ERNI SMC connectors offer flexible, high-density connectivity for board-to-board and wire-to-board applications.

http://www.farnell.com

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