u-blox has announced an expansion to its popular range of R10 products for the fast-growing LTE Cat 1bis cellular connectivity market. Predicted by analyst firm Techno Systems Research Co., Ltd to account for 43.6% of all non-handset cellular devices by 2029, LTE Cat 1bis is expected to be the best-selling cellular technology for the Internet of Things (IoT) for the next four to five years. The new modules strengthen u-blox’s LTE Cat 1bis portfolio, serving both the IoT and users migrating from legacy 2G/3G cellular connectivity.
The new u-blox LEXI-R10 Global provides an ultra-compact 16 x16mm LTE Cat 1bis solution that can be used worldwide in size-constrained IoT applications such as people or pet trackers and wearables. The LEXI-R10 Global is the world’s smallest single-mode LTE Cat 1bis module with indoor location and a US MNO certified core.
Meanwhile, the new SARA-R10 series brings the same capabilities as the LEXI-R10 Global to u-blox’s popular SARA form factor. With 2G and 3G sunsets continuing globally, the SARA-R10 offers product designers using 2G and 3G u-blox SARA modules a straightforward upgrade path to 4G LTE – the most widely available global cellular standard today and for many years to come.
The LEXI-R10 and SARA-R10 offer the option to embed an eSIM, and both modules also include an integrated Wi-Fi Sniffer, providing Indoor localisation via the u-blox CellLocate service based on both a Wi-Fi and cellular networks.
One of the variants is the SARA-R10M10, the world’s smallest LTE Cat 1bis module with embedded Global Navigation Satellite System (GNSS) capable of concurrent communication and tracking. It is the ideal solution for asset tracking and telematics applications that demand continuous connectivity as well as indoor and outdoor positioning anywhere in the world, thanks to the blend of GNSS, Wi-Fi scan and global LTE coverage. This module is also 50% smaller than u-blox’s previous LTE Cat 1bis combo, the LENA-R8M10.
The new u-blox R10 modules give product designers a 4G cellular connectivity solution for IoT applications that require medium data rates, worldwide portability, ultra-low power consumption and compact sizes.
Wearable
Taiwan Semi’s new ESD protection devices are optimised for high-density electronics
Taiwan Semiconductor has introduced a new series of new ultra-small ESD protection devices optimised for wearables and other high-density electronic products. All DFN0603-packaged models in the 3.3V and 5.0V TESDx Series exceed the 8kV IEC61000-4-2 20kV contact discharge standard as well as IEC6100-4-5 4A peak pulse current, with margin. TESDx Series devices utilise Taiwan Semiconductor’s proprietary clamping cells to prevent overvoltage damage from ESD and lightning on control, power and data lines. Additionally, their industry’s lowest capacitance allows for full USB 3.0 data rates without compromise.
Applications for the new 3.3V/5.0V ESD protection series include wearable products, portable medical and test and measurement instrumentation and IoT and IIOT devices. Other applications include consumer electronics, computing, networking, peripherals, USB3.X ports and any application where ESD protection is needed — and where size is a top-of-mind concern.
The TESDx Series offers three models to choose from:
• TESDH3V3B03P1Q0 3.3V/40W 0.2pF
• TESDL3V3B23P1Q0 3.3V/70W 17pF
• TESDH5V0B03P1Q0 5.0/100W 0.2pF
“For wearables and other high-density electronic products, the devices used for ESD protection should be as small and thin as possible, so our new DFN0603-packaged devices are an ideal choice,” said Sam Wang, vice president, TSC Products. “The 3.3- and 5.0-volt models in the series provide full-compliance electrostatic discharge and electronic fast-transient protection, with margin. When protecting high-speed data signals, they also offer extremely low capacitance to ensure that the signal integrity in the application remains within spec and uncompromised.”
https://www.taiwansemi.com/en/
Ceva Bluetooth low energy IPs bring ultra-low power wireless connectivity
Ceva has announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers.
The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity and machine learning in a single chip. The Balletto family delivers up to 50x boost in machine learning performance and inference efficiency versus traditional MCUs that lack neural co-processors. The Ceva-Waves Bluetooth Low Energy IP provides Balletto MCUs with the robust connectivity at ultra-low power consumption, and supports Bluetooth LE Audio and Auracast broadcast audio, for customers who wish to leverage Balletto to create highly differentiated wireless audio products. The Balletto family also relies on Ceva-Waves 802.15.4 IP for Thread, Zigbee and Matter support in smart home applications.
“Our Balletto family of connected, intelligent MCUs are tailored to meet the growing demand for AI/ML workloads in battery-powered devices,” said Mark Rootz, VP Marketing at Alif Semiconductor. “Ceva’s Bluetooth Low Energy and 802.15.4 IPs provide us with a highly-proven and robust connectivity solution for our chip design, allowing us to focus our R&D resources on differentiating our MCU to deliver outstanding performance for the most demanding wireless audio and smart home AI/ML use cases.”
“Wireless connectivity is a fundamental requirement of every intelligent device, and we’re proud to be the trusted supplier of embedded wireless IP to industry leaders and innovators alike, including Alif Semiconductor,” said Tal Shalev, Vice President and General Manager, Wireless IoT Business Unit at Ceva. “Our Bluetooth Low Energy IP has powered billions of devices to date, and we’re excited to partner with Alif to enable their Balletto family of intelligent MCUs with robust connectivity and high-bit rate audio.”
The Ceva-Waves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity, spanning RF, Modem, Baseband Controller, and complete Host and Profile software stacks. All the latest features of Bluetooth are supported, including AoA / AoD / Direction Finding, LE Audio / Auracast, Periodic Advertising with Response, and other enhancements such as Channel Sounding. It also comprises an IEEE 802.15.4 addon for Thread, Zigbee and Matter support. With more than 4.5 billion devices shipped to date and dozens of licensees, the Ceva-Waves Bluetooth IP is widely deployed in consumer, automotive, industrial, medical and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, beacons, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.
The Ceva-Waves Bluetooth IP is part of the Ceva-Waves unique and broad family of wireless connectivity IP platforms that also includes the Ceva-Waves Wi-Fi, UWB, NB-IoT and Links multi-protocol platforms.
Omnivision launches newest generation of the World’s smallest shutter image sensor
Omnivision has announced the new OG0TC BSI global shutter (GS) image sensor for eye and face tracking in AR/VR/MR consumer headsets and glasses. For the first time ever, Omnivision is bringing its patented DCG high dynamic range (HDR) technology to the AR/VR/MR market in the 2.2-micron (µm) pixel OG0TC GS image sensor.
With a package size of just 1.64mm x 1.64mm, the OG0TC is an ultra-small and low-power image sensor for optimizing primarily inward-facing tracking cameras. This small form factor is key to industrial designs as multiple cameras are required for tracking all aspects of the face (eyes, brows, lips, etc.). The OG0TC is pin-to-pin compatible with Omnivision’s previous-generation BSI GS image sensor for easy upgrades.
“Ultra-low power consumption is critical for AR/VR battery-powered devices, and our OG0TC BSI GS image sensor reduces power by more than 40% over our previous-generation OG0TB sensor, which is already an extremely low-power device,” says Devang Patel, marketing director – IoT/Emerging, Omnivision. “Pin-to-pin compatibility makes the upgrade to the OG0TC easy for our customers, so they do not need to make any change to their design to save power and enjoy new features like DCG™ technology.”
Key features of the OG0TC image sensor include:
● The sensor is built on Omnivision’s PureCel Plus-S stacked-die technology.
● It features Omnivision’s patented DCG HDR technology and offers 400×400 resolution with a 2.2µm pixel in a 1/14.46-inch optical format.
● Nyxel technology enables the best quantum efficiency at the 940nm near-infrared (NIR) wavelength for sharp, accurate images of moving objects.
● It consumes less than 40% of the power at 30 frames per second (fps) compared with the previous-generation sensor.
● The sensor’s high modulation transfer function enables sharper images with greater contrast and more detail.
● It supports a flexible interface, including MIPI with multi-drop, CPHY, etc.
Patel adds, “We are excited to introduce our single-exposure DCG HDR technology for ghost-free image capture to the AR/VR market. It already has proven to be extremely successful in the security, mobile and automotive industries.”
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