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Skyworks to support Wi-Fi 6E

Thu, Feb 13, 2020

Working with the Wi-Fi Alliance, Skyworks Solutions is developing future-proof connectivity and supporting the Alliance’s next-generation wireless technologies.

Skyworks addresses all existing Wi-Fi standards and is working within the Wi-Fi Alliance to develop its Wi-Fi 6E products that operate in the 5.925 to 7.125GHz frequency range.

Demand for high data applications such as streaming media/TV/audio, social media and smart home devices, has led to calls to open up additional frequency bands to complement the existing 2.4 and 5GHz bands. This new spectrum is expected to be made available by regulators around the world and it represents an opportunity to deliver the benefits of Wi-Fi 6 coupled with increased bandwidth available in the new 6GHz band.

“The 6GHz band addresses the growing need for Wi-Fi spectrum capacity to ensure users continue to experience reliable and seamless connectivity,” said Kevin Robinson, senior vice president of Marketing, at the Wi-Fi Alliance. “We are glad to see Wi-Fi Alliance members working closely in Wi-Fi Alliance to ensure that new products meet high standards for interoperability and security.”

Dave Stasey, vice president and general manager of diversified analogue solutions for Skyworks, added: “We look forward to . . . providing the highest performance solutions for our OEM customers which deliver maximum Wi-Fi range and speeds.”

Skyworks’ powerful modules facilitate Wi-Fi functionality with best-in-class linearity and performance in the smallest footprint available, explains the company. By incorporating the required functionality to deliver maximum performance, products reduce time to market in this sensitive arena. They contain a logarithmic power detector to support wide dynamic ranges, low power consumption and improved thermal management.

Skyworks Solutions specialises in analogue semiconductors for a wireless networking revolution. Its semiconductors connect people, places and things within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Skyworks has engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

http://www.skyworksinc.com

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Hailo-8 has processor architecture specifically for deep learning

Wed, Feb 05, 2020

Artificial intelligence (AI) chipmaker, Hailo, is sampling the Hailo-8 deep learning processor. The chip’s architecture enables edge devices to run sophisticated deep learning applications that could previously run only on the cloud. It can be used in multiple industries, but the company has a focus on automotive.

The Hailo-8 processor features up to 26 Tera operations per second (TOPS), to “significantly outperform” other edge processors in terms of area and power efficiency, says Hailo. The architecture design relies on the core properties of neural networks, so that edge devices can now run deep learning applications at full scale more efficiently, effectively, and sustainably than traditional solutions, while significantly lowering costs, explains the company.

Hailo is working with leading OEMs and Tier-1 automotive companies in advanced driver assistance systems (ADAS). The processor is also suitable for smarter edge and IoT devices which also require the use of high-performance cameras to perform tasks such as semantic segmentation and object detection in real-time. The Hailo-8 can perform these at full resolution, yet consuming only a few Watts. The processor’s heat dissipation removes the need for active cooling systems in the automotive industry, claims Hailo.

Hailo is an AI-focused Israel-based chipmaker. The company has developed a specialised deep learning processor that delivers the performance of a data centre-class computer to edge devices. Hailo’s AI processor is the product of a rethinking of traditional computer architecture, enabling smart devices to perform sophisticated deep learning tasks such as object detection and segmentation in real-time, with minimal power consumption, size, and cost. The deep learning processor is designed to fit into a multitude of smart machines and devices, including autonomous vehicles, smart cameras, smartphones, drones, AR/VR platforms, and wearables. The company was founded in 2017 by members of the Israel Defense Forces’ elite intelligence unit.

https://www.hailo.ai/

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NIR sensor saves power for mobile 3D optical sensing systems

Thu, Jan 09, 2020

3D optical sensing applications such as face recognition, payment authentication can operate at much lower power than alternative implementations, using the CGSS130, CMOS global shutter sensor (CGSS) near infra red (NIR) image sensor by ams.

The CGSS130 enables battery-powered devices to run for longer between charges while supporting sophisticated sensor functions.

According to ams, the CGSS130 sensor is four times more sensitive to NIR wavelengths than other image sensors on the market today, and detects reflections from very low power IR emitters in 3D sensing systems. It is the IR emitter that consumes most of the power in face recognition and other 3D sensing applications, says ams, which means using the CGSS130 sensor will enable manufacturers to extend battery runtime in mobile devices.

The 1.3Mpixel sensor also creates the opportunity to implement face recognition in wearable devices and in other products which are powered by a very small battery, or to enable a new range of applications beyond face recognition as the increased sensitivity extends the measurement range for the same power budget.

Following ams’ partnership with CMOS image sensor supplier, SmartSens Technology, the first 3D active stereo vision (ASV) reference design based on the CGSS130 was produced. The 1.3Mpixel stacked BSI sensor offers the highest quantum efficiency at 940nm, claims ams and, by supplying all main parts of the 3D system (illumination, receiver, software) it enables superior system performance with lower costs and a faster time to market.

The stacked BSI process used to fabricate the CGSS global shutter image sensors, results in a small footprint of 3.8 x 4.2mm. The sensor produces monochrome images with an effective pixel array of 1080 x 1280 at a maximum frame rate of 120 frames per second. The high frame rate and global shutter operation produce clean images free of blur or other motion artefacts, says ams.

The sensor also offers a high dynamic range (HDR) mode in which it achieves dynamic range of more than 100dB. It also implements advanced functions such as external triggering, windowing, and horizontal or vertical mirroring.

The CGSS130 is available for sampling.

ams is demonstrating the CGSS130 at CES, in the Venetian Tower, Suite 236 / 30th floor.

https://ams.com

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Nordic Semiconductor prepares for Bluetooth LE Audio

Wed, Jan 08, 2020

This year, the Bluetooth Special Interest Group (SIG) will release the Bluetooth LE (Low Energy) Audio specification. To support this forthcoming specification, Nordic Semiconductor has partnered with Bluetooth LE stack developer, Packetcraft, to develop an LE Audio evaluation platform.

It demonstrates the benefits of LE Audio and is designed to support the new LE Audio specifications which promise lower power consumption than classic Bluetooth audio, significantly extending battery life, improved audio quality and enables the development of devices capable of both wireless data transfer and audio streaming. The technology also supports broadcast for audio sharing.

Nordic’s LE Audio comprises a hardware reference design based on its nRF52832 Bluetooth LE system on chip (SoC), Cirrus Logic’s CS47L35 smart codec with an integrated low power audio DSP, Packetcraft’s Bluetooth LE host stack and link layer supporting LE Audio and an LE Audio software development kit (SDK). The platform allows developers to start evaluating the technology for Bluetooth LE Audio wireless speakers, over-the-ear headphones and true wireless ear buds.

It is designed to operate in either source (for example, audio source, voice call headset source, and peer-to-peer call) or sink (audio playback, headset playback, and peer-to-peer call). A pair of devices (source and sink) is required to complete an LE Audio link. The LE Audio solution also features Cirrus Logic’s SoundClear for uplink noise reduction and echo cancellation, playback enhancement, voice control, and hearing augmentation.

An acoustic connector is incorporate that can accommodate up to six microphones or two speakers, a 3.5mm headset jack, a 3.5mm source jack, and a USB connector for charging, debug (using Nordic development tools), and acoustic tuning (using the Cirrus Logic WISCE platform). When wirelessly streaming audio from a source device to wireless (sink) earbuds, the LE Audio evaluation platform extends battery life by around 40 per cent compared to contemporary off-the-shelf classic Bluetooth solutions, claims Nordic Semiconductor.

http://www.nordicsemi.com

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Skyworks to support Wi-Fi 6E

Hailo-8 has processor architecture specifically for deep learning

NIR sensor saves power for mobile 3D optical sensing systems

Nordic Semiconductor prepares for Bluetooth LE Audio

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