Wearable Archives - Page 35 of 57 - SmartCitiesElectronics.com

Bluetooth 5.2 modules brings security to short range radio

Wed, Sep 30, 2020

Swiss manufacturer, u-blox offers the NORA-B1 Bluetooth module which it says brings advanced security functionality to short range radio applications.

The Bluetooth 5.2 module is based on Nordic Semiconductor’s nRF5340 Bluetooth low energy chipset, which is the first to host an Arm Cortex M33 dual core microcontroller.

NORA-B1 exploits the chipset’s dual core microcontroller to handle performance-oriented applications and even drive a display without requiring an external host processer. The single low power optimised core is dedicated to managing network connectivity and a second high performance core is dedicated to running the device application. As a result, says u-blox, NORA-B1 enables smooth and uninterrupted operation with minimal processing latency.

The Arm TrustZone enables a trusted execution environment by fully separating secure and non-secure flash, RAM, peripherals and general purpose I/Os. NORA-B1 includes Arm CryptoCell-312, which provides hardware-accelerated cryptography and, in combination with the key management unit (KMU), enables a root of trust and secure key storage.

The compact, globally certified NORA-B1 brings Bluetooth 5.2 to wireless applications, for example LE audio, which can concurrently stream multiple channels with lower power consumption than existing technology, while also supporting ZigBee and Thread.

NORA-B1 is suitable for use in industrial, medical, and smart building and smart city markets, confirms u-blox, such as industrial machine control, asset tracking, remote controls and gateways, connected power tools requiring continuous motor control, and advanced medical wearables with demanding security requirements.

The NORA-B1 has a footprint of just 10.4 x 14.3 x 1.8 mm and has reduced host board complexity, says u-blox.

It will be available in several antenna variants, including a compact PCB antenna. Qualified for an extended temperature range up to 105 degrees C, NORA-B1 can operate reliably in harsh environments that are common in industrial settings as well as in smart indoor and outdoor lighting.

Customers will be able to receive samples in Q4 2020.

http://www.u-blox.com

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Wireless power receiver from Renesas has WattShare TRx mode

Wed, Sep 09, 2020

Renesas Electronics has added the P9415-R wireless power receiver to its portfolio. The 15W receiver uses WattShare technology and enables smartphones, power banks, and portable industrial and medical equipment, to wirelessly charge other mobile devices and accessories that also have wireless charging capabilities.

The P9415-R features up to 5W of transmit power capability in transmitter/receiver (TRx) mode, as well as receive up to 15W on Qi transmitters, enabling quick and convenient mobile device charging on the go.

Renesas believes the P9415-R will bring WattShare technology to a wider audience. It combines receiver and transmitter capabilities, allowing smartphones, smart watches, wireless ear buds and other devices to be wirelessly charged simply by placing them on top of a smartphone or other industrial and medical portable devices.

In WattShare TRx mode, the P9415-R enables these mobile devices to change the power flow direction and deliver up to 5W of power to charge other devices. Customers can use the same wireless power coil and same P9415 circuitry to both receive and transmit power wirelessly.

The P9415-R wireless power receiver has an MTP non-volatile memory for easy firmware and device function updates. It also has graphic user interface (GUI) support for user customisation.

It receives up to 30W in proprietary mode and has under voltage lockout down to 2.7V which increases the available charging area and connection times. Sensory accuracy has been improved compared with earlier devices in Renesas’ wireless portfolio to increase foreign object detection capabilities.

The receiver also has bi-directional communications to support proprietary authentication with encryption and x-y alignment circuitry for better receiver/transmitter device alignment.

It is also Renesas’ first WPC 1.3-ready wireless power receiver based on the Wireless Power Consortium’s latest inductive standard.

Renesas produces both the power receivers (PRx) used in smartphones and other applications, as well as the power transmitters (PTx) used in charging pads and automotive in-car applications.

The P9415-R 15W WattShare wireless power receiver is available now.

http://www.renesas.com

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Cadence digital and custom tool suite is optimised for TSMC’s 3nm process

Fri, Aug 28, 2020

The collaboration between Cadence and TSMC has broadened as the partners announce that the former’s digital full flow and custom tool suite has been optimised for TSMC’s 3nm (N3) process technology.

The Cadence tools have achieved the latest design rule manual (DRM) and Spice certification for the N3 process. These innovations assist in driving and delivering next-generation mobile, artificial intelligence (AI) and high performance computing (HPC) applications, developed on the N3 process technology, says Cadence, with reference flows and methodologies.

Customers can download the corresponding N3 process design kit (PDK) to begin design projects now.

The updated digital full flow for N3, features enhanced physical optimisation and timing signoff closure. It includes the Innovus Implementation System, Liberate Characterisation, Liberate Variety Statistical Characterisation, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity and Pegasus Verification System. In addition, the Genus Synthesis and its predictive iSpatial technology is enabled for these process technologies for mobile, AI and hyperscale designs, adds Cadence.

The digital suite and available reference flows help customers achieve better power, performance and area (PPA) while designing on TSMC’s N3 process. Tool suite enhancements include, improved extraction accuracy, updated routing rules, accurate LVF-generation during characterisation and robust support of advanced colouring.

The certification on TSMC’s N3 process includes the Virtuoso Custom IC design platform, consisting of the Virtuoso Schematic Editor, Virtuoso Layout Suite and Virtuoso ADE Product Suite, the Voltus-Fi Custom Power Integrity Solution, and the Spectre Circuit Simulation Platform, which includes the Spectre X Simulator.

Custom enhancements for TSMC’s N3 process technology include expanded 3nm design rule support, custom digital colour remastering, enhanced analogue cell support, additional productivity improvements with an enhanced device-level place and route flow and a front-to-back legacy-node design migration flow.

Suk Lee, senior director of the Design Infrastructure Management Division at TSMC, commented: “Our latest work enables our customers to design with the tools, benefitting from the significant power and performance boost of TSMC’s 3nm process technology and to quickly launch their new product innovations to market.”

http://www.cadence.com

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Binder unveils printing technique that gives sensors a new dimension

Thu, Aug 06, 2020

Functional electronic layers can be laid directly on a component, says binder. The binder Innovation & Technology Center has developed the direct printing technique.

As digitisation increases and smart systems proliferate, there is a need for a balance between more complex sensor networks with data processing and simpler, more user friendly operator support, says binder. The trend toward miniaturisation makes it difficult to equip parts due to a limited amount of space with conventional sensors. The binder method of direct printing is claimed to overcome all these challenges. Dr Stefan Ernst, one of the co-developers of the new printing technique, explains: “The printed electronics need less space. In addition, they are more flexible in application and more cost efficient,” he said.

Using a recently developed transfer printing technique, binder was able, for the first time, to apply planar functional electronic layers with a thickness of maximum precision to textured, three-dimensional surfaces in only one printing pass.

Circuit traces, sensors and displays, for example, can be printed without the need for foils or other substrate materials. A protective layer can be overprinted and specially developed nano pastes provide stable parameters for the printing process.

Intended uses in the industrial area range from flexible circuit traces and heating elements to sophisticated sensors. By printing capacitive sensor elements, for example, touch displays of almost any shape can be implemented on three-dimensional and/or textured surfaces. The same approach can also be used for an intuitive gesture control system. Temperature sensors or strain gauges can be implemented by measuring the change in the resistance values of the printed functional layers. The flexible printing technique allows the sensor to be quickly adapted to the application-specific task.

The newly created binder electronic solutions group provides custom-made solutions for connectors, contacts, circuit layout and automatic placement. Services range from design and prototype to series production.

http://www.binder-connector.de

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Bluetooth 5.2 modules brings security to short range radio

Wireless power receiver from Renesas has WattShare TRx mode

Cadence digital and custom tool suite is optimised for TSMC’s 3nm process

Binder unveils printing technique that gives sensors a new dimension

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