Wearable Archives - Page 30 of 57 - SmartCitiesElectronics.com

Force rebalance MEMS accelerometer reduces weight in navigation systems

Fri, Oct 15, 2021

Designed for challenging environments, the Tronics AXO315 force-rebalance digital MEMS accelerometer withstands severe temperature and vibration conditions experience in industrial, land, rail, navy, oil and gas and construction applications, says TDK.

The one-axis, closed looped digital MEMS sensor has a ±14g range. The in-plane linear accelerometer achieves a one-year composite repeatability of 1mg, and a 600ppm composite scale factor repeatability over temperatures ranging from -55 to +105 degrees C and under 4g vibrations.

In addition to vibration rejection, it exhibits superior Allan variance characteristics, says TDK, with a basis instability of 4.0 microg, a velocity random walk of 0.006m per second per sq root h and a very low noise of 15 microg/ sq root Hz, for high resolution and low error.

Its performance is equivalent to the incumbent analogue quartz accelerometers and mechanical inclinometers, but at a fraction of their size, weight, and price, says TDK, resulting in a reduction in size, weight and cost of materials in servo inclinometers and dynamic inclinometers in industrial motion control units, as well as inertial measurement units (IMUs) and inertial navigation systems (INS) for GNSS-aided positioning, navigation of manned and unmanned ground vehicles and trains.

The AXO315 features a force-rebalance architecture, a 24-bit digital SPI in an SMD package. It is also claimed to outperform all commercially available MEMS sensors components and offers easier integration compared to analogue sensors.

It is supplied in lightweight 1.4g hermetic SMD J-lead ceramic package (12 x 12 x 5.0mm), enabling low-cost assembly and reliability on PCB, even in fast-changing temperature conditions.

The sensor can be evaluated with an Arduino-based evaluation kit that is specifically designed to provide developers with improved testing functionalities such as output reading and recording, recalibration and digital self-tests.

Both sensor and evaluation kit are available from Digi-Key, Mouser and Farnell and its affiliates Newark and Element 14.

https://www.tronics.tdk.com

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Renesas bases RA2E2 microcontroller family on Arm Cortex-M23 core

Thu, Oct 14, 2021

For small and energy-sensitive IoT, wearable, medical, industrial automation, consumer and home appliance applications, Renesas offers the RA2E2 microcontroller group. It is based on the Arm Coretex-M23 core and is the latest addition to the 32-bit RA family.

The family of microcontrollers is claimed to offers a combination of low power consumption, a set of peripherals targeted at IoT endpoint applications and space-saving packaging options including a tiny 16-pin WLCSP (wafer level chip scale package) measuring only 1.87 x 1.84mm. The 48MHz RA2E2 family is claimed to offer the industry’s lowest operating power in their class, consuming only 81microA/MHz in active mode with software standby current of only 200nA with fast wake up. They also support a wide temperature range of Ta = -40/+125 degrees C for harsh IoT operating environments. The RA2E2 microcontrollers support an I3C bus interface and integrate cost-saving peripheral functions, including an on-chip oscillator with precision of +/- one per cent, power on reset, low voltage detector, EEPROM and a temperature sensor.

The RA2E2 Group includes nine devices, spanning from 16- to 24-pin packages, and from 16 to 64kbyte of flash memory and 8kbyte of SRAM. The devices also include 2kbyte of data flash memory, which is atypical in low-pin count devices, says Renesas. They are also claimed to be the only microcontrollers in their class to offer an I3C bus interface, delivering high-speed communications of 4.6Mbits per second while significantly reducing power consumption. Security features include a cryptography accelerator (AES256/128), a true random number generator (TRNG) and memory protection units.

The RA2E2 group is available today. Renesas is also offering the EK-RA2E2 evaluation kit.

The Renesas RA family includes over 160 parts ranging from 48 to 200MHz. They have a wide range of communications and security options, including Arm TrustZone technology. All RA devices are supported by the Renesas Flexible Software Program (FSP) that includes drivers and middleware to ease the implementation of communications and security. The FSP’s graphical user interface (GUI) simplifies and accelerates the development process, says Renesas. It enables flexible use of legacy code as well as easy compatibility and scalability with other RA devices. Designers using FSP also have access to the Arm ecosystem and tools as well as Renesas’ partner network.

http://www.renesas.com

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TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Fri, Oct 08, 2021

Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V.

Offering a high sensitivity of 110 mV/V/bar, C35 is suitable for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON.

Furthermore, C35 is designed for a wide temperature range from -40 degrees C to +150 degrees C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

TDK Corporation is a leader in electronic solutions for the smart society based in Tokyo, Japan. It was established in 1935 to market ferrite, a key material in electronic and magnetic products.

The company’s portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The range of products also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors.

In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

In fiscal 2021, TDK posted total sales of $13.3 billion and employed about 129,000 people worldwide.

For more information go to

https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements

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Reference design develops 3D spatial audio in headsets and earbuds

Fri, Oct 01, 2021

Three companies have collaborated to bring 3D spatial audio hardware and software together in a reference design for consumer electronics OEMs and ODMs.

Wireless connectivity and smart sensing specialist, Ceva, has partnered with wireless communications company, Beken and 3D spatial audio expert, VisiSonics to offer a 3D audio reference design to accelerate development and deployment of headsets and true wireless stereo (TWS) earbuds for use in gaming, multimedia and conferencing.

The reference design leverages Beken’s BK3288X Bluetooth Audio SoC series featuring the Ceva-X2 Audio DSP running VisiSonics’ RealSpace 3D audio software, together with Ceva’s MotionEngine Hear head tracking algorithms. OEMs and ODMs can use the ready-to-deploy SoC with any audio encoding format, to introduce 3D audio for VR, AR and the new generation of motion-aware earbuds. The single chip-based reference design provides a self-sufficient 3D audio solution, residing on the headset side, without the need for a 3D audio rendering engine on the host device. As well as being cost-efficient, this also enables a lower latency design, says Ceva.

Weifeng Wang, vice president of engineering at Beken, comments: “Spatial audio brings the wireless audio user experience to the next level and we’re pleased to partner with Ceva and VisiSonics to make it easy for our customers to leverage this exciting new technology in a cost-effective, power-efficient turnkey offering”.

“Spatial audio is an incredibly hot market right now as the Android and PC ecosystems look to build on the industry momentum behind its use in music and gaming to create immersive audio experiences,” adds Moshe Sheier, vice president of marketing at Ceva.

The 3D Audio Reference Design is available now directly from Ceva, and the associated software package combining VisiSonics’ RealSpace 3D audio with Ceva’s MotionEngine Hear is available now for licensing by Ceva and VisiSonics.

Ceva licenses wireless connectivity and smart sensing technologies. It provides DSPs, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence.

DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low-power always-on / sensing applications for multiple IoT markets.

https://www.ceva-dsp.com

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Force rebalance MEMS accelerometer reduces weight in navigation systems

Renesas bases RA2E2 microcontroller family on Arm Cortex-M23 core

TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Reference design develops 3D spatial audio in headsets and earbuds

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