Compact LTE-M / NB-IoT module by u-blox has 2G fallback capability 

The LEXI-R4 is a compact module that has been customised for applications where space is limited. It has dimensions of 16 x 16mm and supports all LTE-M and NB-IoT bands with an RF output power of 23dBm. It also has the possibility to operate on a 2G network. Typical applications are small asset trackers, such as pet and personal trackers, micromobility devices and luggage tags. It is also able to encompass larger applications, such as alarm systems, vending machines and stolen vehicle recovery systems, advised u-blox. 

The u-blox LEXI-R4’s compact dimensions are a 40 per cent footprint reduction compared to the company’s u-blox SARA-R4. The space gained can be used to host larger antennas, which can improve radio frequency (RF) performance, or to accommodate larger-size batteries.

It also has 2G fallback capability. Whenever LTE-M / NB-IoT coverage conditions are not optimal, it will keep functioning by falling back onto a 2G network. This is practical and convenient in countries where LTE-M / NB-IoT networks have yet to be fully deployed. 

The module is natively designed to support GNSS (Global Navigation Satellite System) AT commands and is also ready for GNSS bundling. Its dedicated port enables easy integration with any u-blox M10-based GNSS module, for instance the u-blox MIA-M10, to improve performance and lower power consumption, said u-blox. The module can also connect to additional positioning services such as AssistNow and CellLocate.   

“Since the module supports the u-blox M10 GNSS platform, customers save execution time and resources,” says Samuele Falcomer, senior product line manager, product centre cellular at u-blox. 

The module’s AT commands and a dedicated I2C port can operate the GNSS core to eliminate the need to integrate additional code into the MCU. “In addition, the LEXI-R4 module offers a single SKU with global LPWA (low power wide area) coverage that simplifies logistics,” added Falcomer.

The first samples will be available by the end of Q3 2023. 

u-blox provides positioning and wireless communication in automotive, industrial, and consumer markets. Its services and products let people, vehicles and machines determine their precise position and communicate wirelessly over cellular and short range networks. The company offers a broad portfolio of chips, modules, and secure data services and connectivity, to empower developers to introduce solutions for the IoT, quickly and cost-effectively. The company has headquarters in Thalwil, Switzerland and offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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Four LPDDR4X SDRAMs halve power consumption

Four SDRAMs by Alliance Memory combine low voltage operation with fast clock speeds. The fourth generation LPDDR4 SDRAMs range from 2Gbit to 16Gbit.

The latest additions to the company’s high speed CMOS mobile low power LPDDR4X SDRAMs are the 2Gbit AS4C128M16MD4V-062BAN, the 4Gbit AS4C256M16MD4V-062BAN, the 8Gbit AS4C512M16MD4V-053BIN and the 16Gbit AS4C512M32MD4V-053BIN. According to Alliance Memory, they deliver approximately 50 per cent lower power ratings in the 200-ball FBGA package for higher power efficiency. 

They have low voltage operation of 0.6V, lower than 1.1V for LPDDR4 SDRAMs, to increase battery life in portable electronics for the consumer, commercial, and industrial markets, including smartphones, smart speakers, security surveillance systems, and other IoT devices utilising AI and 5G technologies. They also provide increased efficiency for advanced audio and high resolution video in embedded applications. The LPDDR4X SDRAMs deliver clock speeds up to 1.86GHz for high transfer rates of 3.7Gbits per second. 

For automotive applications – including ADAS – the AEC-Q100-qualified AS4C128M16MD4V-062BAN and AS4C256M16MD4V-062BAN offer a temperature range of -40 to +105 degrees C and on-chip ECC for increased reliability. The AS4C512M16MD4V-053BIN and AS4C512M32MD4V-053BIN operate over an industrial temperature range of -40 to +85 degrees C. 

The AS4C512M16MD4V-053BIN, AS4C128M16MD4V-062BAN and AS4C256M16MD4V-062BAN are organised as single channel devices each consisting of eight banks of 16 bits; the AS4C512M32MD4V-053BIN offers two channels. All four components provide fully synchronous operation; programmable read and write burst lengths of 16, 32, and on the fly; and selectable output drive strength. An on-chip temperature sensor controls the self-refresh rate. 

Alliance Memory’s LPDDR4X SDRAMs are designed as drop-in, pin-for-pin-compatible replacements for use in high bandwidth, high performance memory system applications, eliminating the need for costly redesigns and part requalification. 

Samples and production quantities of the new LPDDR4X SDRAMs are available now, with lead times of 12 weeks. 

Alliance Memory provides critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kbit to 16Gbyte. 

Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, USA and regional offices in Europe, Asia, Canada, and South America. 

http://www.alliancememory.com

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Nordic Semiconductor PMIC for embedded BLE is available from Rutronik

The nPM1300 power management IC (PMIC) from Nordic Semiconductor is now available at Rutronik. The IC integrates essential functions required for embedded Bluetooth Low Energy designs with hard reset functions for one or two buttons, accurate battery indication, a system level watchdog, power failure warning, and recovery from a failed startup in a single device. The level of integration and compact package reduces the number of components required and simplifies system design, said Rutronik.

It is designed to provide efficient power control for Nordic’s nRF52 and nRF53 series SoCs and ensures support for wireless networks such as Bluetooth LE, Thread, Zigbee or Low Energy Audio. 

The nPM1300 is also power efficient and includes accurate measurement functions for monitoring charge level and estimating battery life. It can be used with USB-C compatible chargers for lithium-ion, lithium polymer, and lithium iron phosphate batteries up to 1000mAh. The nPM1300 has four individually controllable power rails including two high performance buck regulators with a 200mA current limit and two 100mA load switches or 50mA LDOs. The PMIC has an operating temperature range of -40 degrees C to +85 degrees C.

The battery charger complies with JEITA and has a termination range of 3.5 to 4.45V and charge current from 32 to 800mA. The input regulator has an input range of 4.0 to 5.5V and output from 4.0 to 5.5V unregulated. USB current limit is 1500mA and the design includes overvoltage protection at 22V transient. 

Other features include an input regulator with USB support, an 800mA charger, ship- and hibernate modes and five general purpose I/Os and three LED drivers.

The nPM1300 PMIC can be used in a choice of applications for wearable devices, handheld entertainment devices, personal health and medical devices and rechargeable smart home sensors.

Rutronik Elektronische Bauelemente was founded in 1973 and is an independent family-owned company based in Ispringen, Germany. It has over 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, for comprehensive customer support in Europe, Asia and North America. 

The company focuses on high-growth future markets, identified as advanced materials, advanced measurement, processing and analytics, advanced robotics, automation, biotechnology, energy and power, future mobility, IIoT and internet of everything, industry 4.0, medical and healthcare, and transportation, logistics and supply chain.

To serve customers in these future markets, the Rutronik Automotive, Embedded, Power, Smart and System Solutions groups bundle expertise, specific product portfolios, and consultancy support. The services range from competent technical support in product development and design-ins, through the diverse product portfolio of leading manufacturers, to the company’s software and hardware solutions with partly patented Rutronik IP.

http://www.rutronik.com

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Alliance Memory combines NAND flash and eMMC controller in FPGA package

Compliant With JEDEC eMMC v5.1, the ASFC16G31M-51BIN integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package. The 16Gbyte industrial grade device is available from Alliance Memory.

The device for solid-state storage in consumer, industrial, and networking applications features boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write levelling, high-priority interrupt (HPI), secure trim / erase and high-speed HS200 and HS400 modes. The ASFC16G31M-51BIN is also backwards-compatible with eMMC v4.5 and v5.0. 

The eMMC can be used in smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, surveillance, automation, PoS systems and emerging embedded applications. According to Alliance Memory, the ASFC16G31M-51BIN simplifies designs for fast and easy system integration in these products, speeding up product development and time to market. It also saves valuable space by eliminating the need for an external controller. The FTL software provides high reliability and stable performance with wear levelling and bad block management, the company added. 

The ASFC16G31M-51BIN operates over an industrial temperature range of -40 to +85 degrees C and offers programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8 or 3V dual supply voltages. 

Samples of the eMMC are available now. Production quantities are available with lead times of 8 to 10 weeks. 

David Bagby, Alliance Memory’s president and CEO confirmed that eMMCs are a new focus product for the company. “We are making a significant investment in this product portfolio, and with further, higher-density additions we’ll be launching in Q3 2023, Alliance Memory is set to become one of the leading providers of eMMC technology,” he predicted. 

http://www.alliancememory.com 

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