Thin magnetic sheets have high permability for NFC

Noise suppressing / magnetic sheets by TDK have high permeability and low magnetic loss for NFC (near field communication) applications. The IFQ06 thin magnetic sheets are flexible and can be easily formed to a desired shape, said the company.

The sheets are suitable for 13.56MHz NFC applications and protect the system from metal objects located directly behind coils.

The latest addition to the Flexield family of magnetic shielding materials, the IFQ06, has high permeability and low magnetic loss, said TDK and provides highly effective protection against performance-reducing design features that can complicate NFC designs, such as metal objects directly behind the antenna.

These hazards are becoming increasingly common as electronic devices evolve to be smaller and more multi-functional, making it increasingly difficult to keep advanced functionalities from interfering with each other. NFC uses electromagnetic induction where the antenna receiving a carrier wave from a reader / writer allows the on-board IC chip to perform signal processing.

Metal objects, in particular, can absorb or disturb the magnetic flux lines of the generated H field, creating eddy currents which reduce effective range. These disturbances can also shift the inductance value and self-resonance frequency, reducing performance because of tuning issues between the two antennas. In some cases, metal close to the antenna will carry an induced current that produces a countering magnetic field, shortening the communication distance and making communication impossible.

Placing the IFQ06 material between the antenna coil and any metal surface confines the magnetic flux within the magnetic shield generated by the reader / writer. As a result, the generation of an induced current on the metal surface is eliminated and optimum 13.56MHz communication conditions can be maintained.

TDK lists other benefits of the IFQ06 series as its ability to shape / direct the magnetic H field, influence the quality factor (Q) of the inductive antenna, increase the coupling factor (K) between two antennas, help set the inductance value (Ls) for resonant tuning, complete the magnetic field path and to improve security by encapsulating the magnetic field and its respective information.

TDK’s IFQ06 flexible magnetic sheet materials are offered in a choice of three formats: roll or sheet materials for prototyping, lower volumes or where large areas need to be covered and custom cut parts which exactly match design requirements for higher volume or automated assembly options.

Standard thicknesses available are 0.05, 0.1 and 0.2mm. Thicknesses of 0.065 and 0.075mm are available on request.  

High surface resistivity is above 10 MOhm allowing for direct contact to metal antennas.

The material is available with an optional high temperature resin [IFQ06S] that supports applications up to +125 degrees C.

http://www.tdk.com

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Nordic Semiconductor disrupts IoT with low power wireless SoCs

A fourth generation, low power wireless SoC has been introduced by Nordic Semiconductor. The first SoC in the nRF54 series is the nRF54H20 and suitable for disruptive IoT applications demanding high processing power, excellent energy efficiency and security, said Nordic Semiconductor.

The nRF54 series of Bluetooth Low Energy (Bluetooth LE) SoCs add to Nordic’s portfolio of the nRF51, nRF52, and nRF53 series. At the same time it introduces a new hardware architecture fabricated on the GlobalFoundries 22FDX process node. 

Capable of supporting Bluetooth 5.4 and future Bluetooth specifications, plus LE Audio, Bluetooth mesh and Thread, Matter, the nRF54H20 will be the foundation for a new wave of revolutionary IoT end products, promised Nordic Semiconductor. Its combination of advanced features will enable complex end products that have previously been unfeasible, claimed the company.

The nRF54H20 comprises multiple Arm Cortex-M33 processors and multiple RISC-V coprocessors. The processors are clocked at up to 320MHz and each processor is optimised for a specific type of workload.  

The dedicated application processor features double the processing power (2x CoreMark) of the application processor in the nRF5340 SoC. The nRF54H20’s computing resources are supported by integrated memory comprising 2Mbyte non-volatile memory and 1Mbyte of RAM. The SoC’s level of integration will enable developers to shrink designs by replacing multiple components, such as application microcontroller, external memory and wireless SoC, with a single, compact device. In addition to advanced wearables, smart home, medical and LE Audio applications, the nRF54H20 SoC can be used for applications demanding complex machine learning (ML) and support for sensor fusion at the edge.

The nRF54H20 features several new digital and analogue interfaces, including a high performance external memory interface (400Mbytes per second), high speed USB (480bits per second), two I3C peripherals, a CAN FD controller and a 14-bit ADC. These interfaces are in addition to analogue and digital interfaces integrated on the nRF54H20.

The multi-protocol 2.4GHz radio ensures the nRF54H20 SoC is the first in the world to offer -100dBm RX sensitivity when receiving a 1Mbit per second Bluetooth LE signal, according to Nordic Semiconductor. Combined with up to 10dBm TX power, the nRF54H20 offers an ample link budget for enhanced robustness and longer range. The radio RX current consumption is just half that of the nRF5340, said Nordic. For applications that are mainly receivers, such as earbuds and wearables, the low energy consumption allows for more compact batteries or extended battery life, explained Nordic Semiconductor.

The nRF54H20 is a secure low power, multi-protocol SoC and is designed for PSA Certified Level 3, the highest level in the Platform Security Architecture (PSA) Certified IoT security standard. The SoC supports security services such as secure boot, secure firmware update and secure storage. It has cryptographic accelerators that are hardened against side-channel attacks and tamper sensors that detect an attack in progress and take appropriate action.

The nRF54H20 SoC is available for sampling now to selected customers.

http://www.nordicsemic.com

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Energy harvesting PMIC contributes to low power IoT

Adding to its range of power ICs, Nexperia has introduced the NEH2000BY power management IC (PMIC) for low power embedded applications, including the IoT.

The NEH2000BY PMIC recharges a battery or storage capacitor using energy harvested from ambient sources, such as light (which can be harvested using a photovoltaic cell). The PMIC will enable the development of electronic devices that are self-powered, smaller, and environmentally friendly, said Nexperia and exploit energy harvesting to help mitigate the environmental impact of the billions of batteries produced and discarded each year.

The PMIC makes it much easier to design energy harvesting solutions which can be up to 20x smaller than other competing offerings and do not require manual optimization for individual applications, claimed the company. It is designed without inductors, which simplifies PCB design and “significantly” reduces BoM and board size. The assembly area is just 12mm².

To achieve the highest conversion efficiency, energy harvesting must be able to adapt as the ambient energy source fluctuates. To this end, the NEH2000BY performs maximum power point tracking (MPPT), an adaptive algorithm to optimise how it transfers harvested energy, achieving optimum average conversion efficiency by up to 80 per cent. The MPPT algorithm combines speed with accuracy, allows the PMIC to adapt to environmental changes in less than one second: significantly faster than any other currently available solution, said Nexperia. By maximising the amount of energy harvested over the course of a day, the PMIC can broaden the number of applicable use cases, while the self-optimisation functionality and the ability to operate autonomously without pre-programming make it simpler to design products using ambient energy.

Nexperia’s energy harvesting technology enables economical energy harvesting from various ambient sources in applications consuming up to several mW of power, including wireless IoT nodes, wearable smart tags and electronic shelf labels.

Dan Jensen, general manager business group analogue and logic ICs at Nexperia commented: “The NEH2000BY . . . will allow the adoption of energy harvesting in a larger range of use cases. By eliminating the requirement to change batteries in these applications, NEH2000BY will significantly reduce the amount of hazardous waste produced, with enormous environmental benefits.”

The NEH2000BY is available in a 16-lead, 3.0 x 3.0mm QFN package and operates between -40 and +85 degrees C.

http://www.nexperia.com

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Infineon includes Bluetooth 5.5 in Airoc SoCs

The newly release Bluetooth 5.4 specification is integrated in Infineon’s Airoc CYW20829 Bluetooth LE SoC. According to Infineon, with the right combination of low power and high performance, Airoc CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation and automotive designs.

CYW20829 is a dual-core Arm M33 device where one M33 core is reserved as the Bluetooth controller, and the second Arm Cortex-M33 is available for customer applications. The CPU subsystem provides 256k RAM, XIP interface for external flash, and a rich set of peripherals including CAN. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys and cryptography acceleration.

The recently released Bluetooth Core Specification 5.4 adds several significant capabilities to the existing specification, including PAwR (periodic advertising with response), encrypted advertisement data (EAD) and Le GATT security levels characteristic. PAwR enables energy-efficient, bi-directional communication in a large scale one-to-many or star topology. EAD provides a standardised approach to the secure broadcasting of data in advertising packets, advised Infineon.

With PAwR, thousands of Bluetooth 5.4-enabled electronic shelf labels (ESL) and sensors will have bidirectional communication with a single access point. Messages can contain commands, sensor data values or other data, as defined by the application layer. EAD enables the encrypted data over-the-star network to be authenticated and decrypted only by devices that have shared the session key previously. Additionally, LeGATT security levels characteristic enables devices to identify the security mode and level for GATT functionality. The combination of these features enable low power, efficient radio usage and secure star networks that can be deployed in large scale ESL and sensor applications.

“With Infineon’s AIROC CYW20829 Bluetooth LE SoC, our customers can achieve great RF performance, the latest Bluetooth features, built-in security, rich set of peripherals, and low power, all in one device,” said Shantanu Bhalerao, Vice President of the Bluetooth product line at Infineon. 

Airoc CYW20829 has best-in-class RF link budget, claimed Infineon, with an integrated power amplifier providing 10dBm of transmit output power and receive sensitivity of -98dBm for LE 1Mbits per second and -106dBm for LE Long Range 125kbits per second. 

The Airoc CYW20829 is supported by the ModusToolbox development environment which enables developers to accelerate time-to-market for Bluetooth-enabled IoT solutions.

The SoC is currently sampling to select customers.

http://www.infineon.com

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