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Infineon goes beyond standard Wi-Fi with lates AIROC device

Fri, Oct 27, 2023

The latest addition to Infineon Technologies’ AIROC portfolio is the Airoc CYW5551x. This single device combines Wi-Fi 6 / 6E performance and advanced Bluetooth connectivity, making it suitable for a host of IoT applications.

The AIROC CYW5551x Wi-Fi 6/6E and Bluetooth 5.4 family delivers secured, reliable 1×1 Wi-Fi 6 / 6E (802.11ax) connectivity that goes beyond the standard, said Infineon. This is combined with advanced low power Bluetooth connectivity. The optimised CYW55512 is a dual-band Wi-Fi 6 solution and the CYW55513 is a tri-band Wi-Fi 6 / 6E device. Both feature power-efficient designs that are suitable for use in smart homes, industrial applications, wearable devices and equipment and other small factor IoT applications, said the company.

“Infineon’s new CYW5551x family brings the range, reliability, and network robustness from our 2×2 Wi-Fi 6/6E CYW5557x family of devices to an IoT optimised family,” said Sivaram Trikutam, vice president of Wi-Fi Products of Infineon. “As part of the company’s digitalisation and decarbonisation strategy, this family is optimised for very low power consumption, making it ideal for battery-operated devices like wearables and IP cameras,” he said. They are also tuned for best performance across a wide temperature range, enabling them to serve industrial and infrastructure applications such as electric vehicle charging and solar panel controls, logistics.

The AIROC CYW551x family offers support for the 6GHz band for Wi-Fi 6E, delivering lower latency and reduced interference. Bluetooth 5.4 low energy (LE) with Audio is range and power optimised with up to 20dBm transmit power.

Other features include improved multi-layer security (PSA Level 1-certifiable) and design versatility supported by a wide ecosystem of module and platform partners.

The devices feature Linux, RTOS and Android support, and have a fully validated Bluetooth stack and sample code to accelerate development time.

Infineon’s AIROC CYW55512 and CYW55513 are sampling now. The CYW5512 will be commercially available in March 2024, and the CYW55513 will be commercially available in June 2024.

http://www.infineon.com

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Prophesee claims event-based vision sensor is world’s smallest

Thu, Oct 19, 2023

Claimed to be the world’s smallest and most power efficient event-based vison sensor, the GenX320 brings intelligence, privacy and safety to consumer edge AI devices, claimed Prophesee.

The company’s latest event-based Metavision sensor has low power, low latency, high flexibility for efficient integration in AR/VR headsets, security and monitoring/detection systems, touchless displays, eye tracking features and always-on smart IoT devices, said the company.

It is, said Prophesee, the industry’s first event-based vision sensor developed specifically for integration into low power edge AI vision devices. The fifth generation Metavision sensor is available in a tiny 3.0 x 4.0mm die size.

The 320 x 320 6.3 micron pixel BSI stacked event-based vision sensor offers a tiny 1/5 inch optical format. It has been developed with a specific focus on the requirements of efficient integration of event sensing in energy-, compute- and size-constrained embedded at-the-edge vision systems. It enables robust, high-speed vision at ultra-low power and in challenging operating and lighting conditions, added the company.

Features of the GenX320 include low latency microsecond resolution timestamping of events with flexible data formatting. There are also on-chip intelligent power management modes reduce power consumption to as low as 36 microW and enable smart wake-on-events. Deep sleep and standby modes are also featured.

Ease of integration/interfacing with standard SoCs with multiple integrated event data pre-processing, filtering, and formatting functions minimises external processing overhead. In addition, MIPI or CPI data output interfaces offer low-latency connectivity to embedded processing platforms, including low power microcontrollers and modern neuromorphic processor architectures.

The GenX320 is AI-ready, with on-chip histogram output that is compatible with multiple AI accelerators. For security, sensor-level privacy is enabled via the event sensor’s inherent sparse frameless event data with inherent static scene removal.

There is also native compatibility with Prophesee Metavision Intelligence event-based vision software suite, which is available free of charge and is used by community of 10,000+ users.

The high speed eye-tracking allows for foveated rendering for seamless interaction in AR/VR/XR headsets. The low latency touch-free human machine interface is suitable for consumer devices (TVs, laptops, game consoles, smart home appliances and devices and smart displays. The event-based sensor is also suitable for smart presence detection and people counting in IoT cameras and other devices as well as for always-on area monitoring systems and fall detection cameras in homes and health facilities.

The GenX320 is available for purchase from Prophesee and its sales partners. It is supported by a complete range of development tools, including a comprehensive evaluation kit housing a chip on board (COB) GenX320 module, or a compact optical flex module. In addition, Prophesee is offering a range of adapter kits that enable seamless connectivity to a large range of embedded platforms, such as a STM32 MCU, enabling faster time-to-market.

Prophesee creates neuromorphic vision systems. It developed an event-based vision approach to machine vision which allows for significant reductions of power, latency and data processing requirements to reveal what was invisible to traditional frame-based sensors until now. Prophesee’s patented Metavision sensors and algorithms mimic how the human eye and brain work to dramatically improve efficiency in areas such as autonomous vehicles, industrial automation, IoT, mobile and AR/VR. Prophesee is based in Paris, with local offices in Grenoble, Shanghai, Tokyo and Silicon Valley.

http://www.prophesee.ai

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Qualcomm launches next-generation XR and AR platforms

Wed, Oct 04, 2023

Two spatial computing platforms called Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 have been introduced by Qualcomm to enable the next generation of mixed reality (MR), virtual reality (VR) devices and smart glasses.

Snapdragon XR2 Gen 2 brings premium MR and VR technology into a single chip architecture for immersive experiences in thinner and more comfortable headsets, that do not require an external battery pack.

It is engineered to deliver a lag-free experience with immersive sound blending virtual content with the user’s physical surroundings and transition seamlessly between MR and VR experiences.

Snapdragon AR1 Gen 1 platform is designed with power optimisations for sleek, lightweight smart glasses that enable the user to capture, share or live-stream hands-free, directly from the glasses. On-device AI enables personal assistant experiences such as audio quality enhancement, visual search and real-time translation. There is also support for a visual heads-up display to enable content consumption, including video, that blend seamlessly in the users’ field of view.

The platforms were developed in close collaboration with Meta and will commercially debut on Meta devices in 2023. The Meta Quest 3 will be powered by Snapdragon XR2 Gen 2 Platform, and Ray-Ban Meta smart glasses collection will be powered by Snapdragon AR1 Platform. Other manufacturers are expected to follow next year.

“At Meta, we’re focused on developing the technologies of the future in mixed reality and smart glasses, as well as the foundational innovations that will one day power our vision for AR glasses,” said Andrew “Boz” Bosworth, Meta’s CTO and Head of Reality Labs.

“The Snapdragon XR2 Gen 2 and Snapdragon AR1 platforms are the latest purpose-built processors that are designed to power the next generation of MR and VR devices and sleek smart glasses for all,” said Hugo Swart, vice president and GM of XR, Qualcomm Technologies. “The commercial debut of these two platforms with Meta is a further step forward in realizing our joint vision – unlocking premium, all-in-one XR devices and smart glasses that are affordable to users around the globe.”

http://www.qualcomm.com

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IP and SDK accelerate on-device and edge AI design, says Cadence

Fri, Sep 15, 2023

AI IP and software tools to address the escalating demand for on-device and edge AI processing have been unveiled by Cadence. The scalable Cadence Neo neural processing units (NPUs) deliver a range of AI performance in a low-energy footprint, said the company and this is claimed to bring new levels of performance and efficiency to AI SoCs.
The Neo NPUs deliver up to 80TOPS performance in a single core, in order to support both classic and new generative AI models. They can also offload AI/ML execution from any host processor, including application processors, general-purpose microcontrollers and DSPs. This is achieved with a simple and scalable AMBA AXI interconnect.
Cadence has also introduced the NeuroWeave software development kit (SDK) which it said provides developers with a “one-tool” AI software solution across Cadence AI and Tensilica IP products for no-code AI development.
“While most of the recent attention on AI has been cloud-focused, there are an incredible range of new possibilities that both classic and generative AI can enable on the edge and within devices,” pointed out Bob O’Donnell, president and chief analyst at TECHnalysis Research. For these intuitive, intelligent devices to be realised will need a flexible, scalable combination of hardware and software solutions with a range of power requirements and compute performance, “all while leveraging familiar tools” he believed. “New chip architectures that are optimised to accelerate ML models and software tools with seamless links to popular AI development frameworks are going to be incredibly important parts of this process,” he added.
The Neo NPUs are suitable for power-sensitive devices as well as high-performance systems with a configurable architecture. SoC architects will be able to integrate an optimal AI inferencing solution in a range of products, including intelligent sensors, IoT and mobile devices, cameras, hearables/wearables, PCs, AR/VR headsets and advanced driver-assistance systems (ADAS). New hardware and performance enhancements and key features/capabilities include:
The single core NPUs are scalable from 8GOPS to 80TOPS, with further extension to hundreds of TOPS with multi-core devices, said Cadence. They support 256 to 32K MACs per cycle, allowing SoC architects to optimise embedded AI to meet power, performance and area (PPA) tradeoffs.
Offloading of inferencing tasks from any host processor (e.g., DSPs, general-purpose microcontrollers or application processors) significantly improves system performance and power, said Cadence.
Support for Int4, Int8, Int16 and FP16 data types across a wide set of operations that form the basis of CNN, RNN and transformer-based networks allows flexibility in neural network performance and accuracy tradeoffs while the NPUs offer up to 20 times higher performance than the first-generation Cadence AI IP, with two to five time the inferences per second per area (IPS/mm2) and five to 10 times the inferences per second per Watt (IPS/W)

Upgrades to the common software toolchain include the NeuroWeave software development kit (SDK). Providing customers with a uniform, scalable and configurable software stack across Tensilica DSPs, controllers and Neo NPUs to address all target applications, the NeuroWeave SDK streamlines product development and enables an easy migration as design requirements evolve. It supports many industry-standard domain-specific ML frameworks, including TensorFlow, ONNX, PyTorch, Caffe2, TensorFlow Lite, MXNet and JAX for automated end-to-end code generation, together with Android Neural Network Compiler; TF Lite Delegates for real-time execution and TensorFlow Lite Micro for microcontroller-class devices.
The Neo NPUs and the NeuroWeave SDK are expected to be in general availability beginning in December 2023.

http://www.cadence.com

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Infineon goes beyond standard Wi-Fi with lates AIROC device

Prophesee claims event-based vision sensor is world’s smallest

Qualcomm launches next-generation XR and AR platforms

IP and SDK accelerate on-device and edge AI design, says Cadence

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