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Ultrasonic ToF sensor have high computational power

Mon, Sep 04, 2023

Available in a reflowable package, the SmartSonic ICU-20201 ultrasonic ToF (time of flight) sensor has been designed by TDK in a miniature 3.5 x 3.5mm² form factor.

It integrates a PMUT (piezoelectric micromachined ultrasonic transducer) with an low power SoC in the miniature package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m over a wide and configurable field of view on any surface and under any lighting condition, said TDK. The company added that these results are possible in any lighting condition, including full sunlight, and independently of the target’s colour and optical transparency.

It also has a powerful embedded processor and extended memory space for high computational power, sufficient to allow complete application algorithms directly on the chip.

Typical applications are sensing accuracy in robotics, drones, smart homes or buildings and mobile devices. It can also be used in enterprise settings that require shelf inventory monitoring or level sensing, such as in smart homes or smart buildings.

Massimo Mascotto is director of product marketing at InvenSense, a TDK Group company. He said that the ICU-20201’s “increased computational capability enables smarter product design and an enhanced end user experience”.

The ICU-20201 is available now.

TDK was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK‘s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices. The company also provides sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

InvenSense is a TDK Group company and targets the consumer electronics and industrial areas with integrated motion, sound, pressure and ultrasonic solutions. InvenSense’s productss combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesise, and calibrate the output of sensors, maximising performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in mobile, wearables, smart home, industrial, automotive, IoT and robotics.

InvenSense became part of the MEMS sensors business group within the Sensor systems business of TDK in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California, USA and has offices worldwide.

https://invensense.tdk.com/

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Cadence-Arm collaboration pushes Neoverse V2 verification

Thu, Aug 31, 2023

Cadence Design Systems has collaborated with Arm for its Neoverse V2 by fine-tuning its AI-driven RTL-to-GDS digital flow for Neoverse V2 and delivered corresponding 5nm and 3nm Rapid Adoption Kits (RAKs) which are designed to support customers achieve power, performance and area (PPA) targets faster. The Cadence AI-driven verification full flow supports Neoverse V2, providing designers with optimal verification throughput and preparedness for Arm SystemReady compliance, added Cadence.
The AI-driven Cadence RTL-to-GDS digital full flow RAKs for 3nm and 5nm nodes include Genus Synthesis, Modus DFT Software, Innovus Implementation System, Quantus Extraction, Tempus Timing and ECO Option, Voltus IC Power Integrity, Conformal Equivalence Checking, Conformal Low Power and the AI-based Cerebrus Intelligent Chip Explorer.
Benefits of the digital RAKs for Arm Neoverse V2 designers include, for example, the Cerebrus AI capabilities which automate and scale digital chip design, delivering better PPA and improving designer productivity. The inclusion of Cadence iSpatial technology provides an integrated and predictable implementation flow for the faster design closure, added the company. The RAKs also include a smart hierarchy flow that delivers optimal turnaround times on large, high-performance CPUs.
In another example, the Tempus ECO technology offers sign off-accurate final design closure based on path-based analysis. The incorporation of the GigaOpt activity-aware power optimisation engine is claimed to significantly reduce dynamic power consumption.
The AI-driven verification full flow is optimised to support Arm Neoverse V2 and includes the Xcelium Logic Simulation platform, Palladium Enterprise Emulation platforms, Protium Enterprise Prototyping systems, Helium Virtual and Hybrid Studio, Jasper Formal Verification platform, Verisium Manager Planning and Coverage Closure tools, Perspec System Verifier, and VIP and System VIP tools and content for Arm-based designs.
The verification full flow provides Neoverse V2 designers with pre-silicon server base system architecture (SBSA) compliance verification and optimised PCI Express (PCIe) integration while the Helium Virtual and Hybrid Studio includes editable virtual and hybrid platform reference designs for Neoverse V2. These designs incorporate Arm Fast Models to jumpstart early software development and verification. The Helium gearshift technology enables customers to position workloads in a high-performance hybrid environment before shifting to a fully accurate RTL environment, offering detailed verification using either the Palladium or Protium platforms.
“The growing demand for complex workloads such as big data analytics, HPC and ML inference requires specialised compute solutions that achieve greater performance and efficiency,” said Eddie Ramirez, vice president of go-to-market, infrastructure line of business at Arm. “Through this latest collaboration, customers can leverage Cadence’s comprehensive digital and verification flows to validate their solutions and bring the power of their Neoverse V2-based products to market faster. Furthermore, silicon partners will get the benefits of these advanced design flows when running their EDA workloads on Arm-enabled servers and cloud instances.”

http://www.cadence.com

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Headset increases productivity with hands-free operation

Wed, Aug 30, 2023

The next generation of RealWear’s hands-free, wearable computers for frontline workers is the Navigator Z1 Intrinsically Safe (IS) headset, which accesses AI and 5G connectivity.

Built for productivity and safety in industries such as oil and gas, pharmaceuticals, and mining, the hands-free IS wearable solution frees a worker’s hands to make operations smarter, safer, and more efficient.

The Navigator Z1 is certified for use in areas where nearly all electronics are strictly prohibited due to the potential risk of explosion or combustion. It can be used on sites including oil and gas production areas, for rig inspections at sea or for repair in mission-critical production equipment in processing mills, chemical facilities, and mines.

It is “the smartest and lightest IS wearable with integrated battery available to frontline workers who work in some of the most challenging sites on earth,” said Dr. Chris Parkinson, co-founder and CEO of RealWear. “We’re especially keen to introduce AI Core and 5G IS connectivity to create a new frontier of smart, connected wearable solutions for frontline workers,” he added.

Technical improvements in this version of the headset includes the introduction of RealWear’s new AI Core, especially designed for on-device enhanced AI experiences. The headset is also lighter than earlier models but retains the ruggedness and durability levels, said RealWear. There is also improved screen visibility with an HD 720p display and a high resolution front-facing camera (48 Mpixel) for better remote collaboration and low-light image capture for inspections and auditing.

The headset has a wide temperature range for use in more climates and environments, enhanced noise cancellation for improved voice-responsiveness and accuracy and improved connectivity with faster Wi-Fi 6 and an optional 5G IS solution for private and secure enterprise connectivity.

There is also a thermal camera module to spot invisible issues before they become critical and a removable integrated snag-free battery for enhanced safety and for extended use. The headset operates with Enterprise Secure Android 12.

RealWear Navigator Z1 capabilities include purpose-built software for remote expert guidance and training. Remote experts can conduct in-the-moment maintenance and repair, potentially reducing costly travel and downtime via apps like Microsoft Teams and Zoom.

Using just simple voice commands, workers can connect to FSM (field service management) enterprise AI systems to handle work orders safely and quickly, and conduct asset maintenance at reduced operational costs.

Inspectors can inspect a job site, take high quality photos and dictate notes using the field data collection component of an inspection data management system (IDMS) such as hands-free solutions from RealWear and HUVR. Captured data is instantly uploaded and geocoded for integrity verification, auditing and compliance purposes.

Device administrators can access RealWear’s enterprise-grade RealWear Cloud web portal to add approved apps to the headset, adjust a variety of settings, and even remotely connect to the headset to offer remote device troubleshooting.

To take full advantage of the powerful Qualcomm 6490 chipset, RealWear has begun to offer early access of the new headset to its global developer community.

“We’re thrilled that RealWear is utilising the Qualcomm 6490 platform in RealWear Navigator Z1 that will help frontline workers in extremely hazardous zones where rugged equipment and safety is essential,” said Jeff Henckels, director of XR Product Management, Qualcomm Technologies. “The Qualcomm 6490 is a perfect fit for RealWear’s next generation headsets as it enables powerful connections and reduced latency, an advanced ISP and advanced Edge-AI computing to deliver astonishing performance at lower power.”

The headset will launch with certifications for ATEX Zone 1, CSA C1/D1 and IECEx.

http://www.realwear.com

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TMCS1123 extends EZShunt portfolio to simplify current sensing

Wed, Aug 23, 2023

The latest addition to Texas Instruments’ current sensors portfolio is the TMCS1123 Hall-effect current sensor. It helps engineers simplify designs while improving accuracy, said the company.

Designed for a broad range of common-mode voltages and temperatures, the TMCS1123 series includes what is claimed to be a lowest-drift isolated Hall-effect current sensor for high voltage systems. There is also a portfolio of current shunt monitors that eliminate the need for an external shunt resistor for non-isolated voltage rails.

The TMCS1123 is also claimed to have the industry’s highest reinforced isolation and highest accuracy over lifetime and temperature. Its high accuracy and low propagation delay enables designers to use Hall-effect sensors in previously unrealisable high voltage systems, said the company, to reduce system cost and size.

The need for highly accurate current measurements in high-voltage systems such as electric vehicle chargers and solar inverters is growing, but Hall-effect current sensors have typically been overlooked given their high drift over lifetime. The TMCS1123 Hall-effect current sensor features the highest reinforced isolation working voltage of 1,100V DC. It also features a maximum sensitivity error of ±0.75 per cent with 50 ppm per degree C drift over temperature and ±0.5 per cent drift over lifetime. The TMCS1123 features low propagation delay of 600 nanoseconds and bandwidth of 250kHz, which enable faster control loops while keeping noise low to help increase system efficiency. The high precision and stability over lifetime remove the need to recalibrate equipment, reducing costly and time-consuming maintenance, added TI.

For non-isolated systems up to 85V and 75A RMS, TI also offers what is believed to be the industry’s smallest fully integrated current shunt monitor and the industry’s highest accuracy 75A integrated shunt solution.

TI’s EZShunt portfolio of current-sensing solutions simplifies designs by removing the need for an external shunt resistor. It provides a fully integrated current-sensing solution that fits within the footprint of a 1206 shunt resistor.

Pre-production quantities of the TMCS1123 Hall-effect current sensor are available now, in a 10.3 x 10.3mm, 10-pin small outline integrated circuit (SOIC) package. Designers can purchase the TMCS1123EVM evaluation module.

Higher bandwidth and automotive-qualified versions of the TMCS1123 are expected to be available in fourth quarter of 2023 and second quarter of 2024, respectively.

http://www.ti.com

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Ultrasonic ToF sensor have high computational power

Cadence-Arm collaboration pushes Neoverse V2 verification

Headset increases productivity with hands-free operation

TMCS1123 extends EZShunt portfolio to simplify current sensing

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