Navitas unveils GaNSafe, a protected GaN power semiconductor

Rugged and protected, the fourth generation GaN technology from Navitas Semiconductor offers efficiency, power density and reliability, opening up GaN to applications such as data centre, solar and electric vehicle use. 

GaNSafe is a wide bandgap power platform for demanding, high power applications. The power ICs integrate GaN power and drive, with control, sensing and protection to enable faster charging, higher power density, and greater energy savings. It is covered by a 20 year warranty – an industry first, said Navitas. 

The initial, high power 650/800V GaNSafe portfolio covers a range of RDS(on) from 35 to 98 mOhm in a robust, and cool-running surface mount TOLL package, to address applications from 1,000 to 22,000W. 

Additional application-specific protection features have been introduced for the power ICs to perform under grueling high-temperature, long-duration conditions. Safety features include protected, regulated, integrated gate drive control, with zero gate source loop inductance for reliable high speed 2MHz switching capability to maximise application power density.

There is also high speed short circuit protection, with autonomous ‘detect and protect’ within 50 nanoseconds which is four times faster than competing discrete solutions.

There is also electrostatic discharge (ESD) protection of 2kV, compared to zero for discrete GaN transistors and an increased voltage capability of 650V continuous, and 800V transient to protect during extraordinary application conditions.

The TOLL package has just four pins and programmable turn-on and turn-off speeds (dV/dt) to simplify EMI regulatory requirements. 

Unlike discrete GaN transistor designs, with voltage spikes, undershoot and specification breaches, GaNSafe delivers an efficient, predictable, reliable system, said the company. The TOLL package has achieved IPC-9701 mechanical reliability standard as well as reducing connections, compared to multi-chip modules and with improved cooling capability, said Navitas.

Navitas’ market-specific system design centers offer complete platform designs with benchmark efficiency, density and system cost using GaNSafe products to accelerate customer time-to-revenue and maximise chance of first-time-right designs. These system platforms include complete design collateral with fully-tested hardware, embedded software, schematics, bill-of-materials, layout, simulation and hardware test results.

“Our original GaNFast and GaNSense technologies have set the industry standard for mobile charging, establishing the first market with high-volume, mainstream GaN adoption to displace silicon,” said Gene Sheridan, Navitas Semiconductor’s CEO and co-founder. “GaNSafe takes our technology to the next level, as the most protected, reliable and safe GaN devices in the industry, and now also targeting 1.0 to 22 kW power systems in AI-based data centres, EV, solar and energy storage systems. Customers can now achieve the full potential of GaN in these multi-billion dollar markets demanding the highest efficiency, density and reliability.”

The GaNSafe portfolio is available immediately to qualified customers with mass production expected to begin in Q4 2023. 

http://www.navitassemi.com

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Second generation DC/DC converter targets e-mobility

The second generation of 4kW liquid cooled DC/DC converters from Bel Power Solutions, the 700DNG40-24-8, creates DC voltages in hybrid and electric vehicles suitable to power low voltage accessories and replacing a traditional alternator.

The converter is smaller than its predecessor, the 700DNC40-24-8G, and operates at a wider input voltage range from 450 to 900V DC to deliver up to 4000W of output power. The compact design weighs just 4.5kg, making it suitable for confined spaces in a variety of deployments in construction, mining, bus and trucking, along with marine and ground support equipment.

The 700DNG40-24-8 has high efficiency of up to 95 per cent and is reliable with low output voltage noise and excellent dynamic response to load/input changes, said Bel Fuse. The 700DNG40-24-8 converter can be operated in parallel with up to eight units, and includes optional UDS functionality, CAN FD and cybersecurity. 

The 700DNG40-24-8 DC/DC converter is available immediately. It will be exhibited at the Battery Show North America in Novi, Michigan (12 to 14 September) on the company’s booth #936.

It is available through distributors, Digikey and Mouser.

Bel designs, manufactures and markets a broad array of products that includes circuit protection, connectors, cable assemblies, discrete components, magnetics and power supplies. The company operates facilities around the world.

http://www.belfuse.com

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Multi-mode cellular and satellite IoT module has embedded positioning 

Developed to ensure seamless connectivity even when no terrestrial cellular network is available, the u-blox SARA-S520M10L is the company’s cellular and satellite IoT module with accurate, low power positioning and “ubiquitous connectivity” said u-blox. 

The module’s communication and tracking capability makes it suitable for asset tracking, fleet management, maritime transportation, mining, utilities and smart agriculture applications. It also serves market segments such as anti-theft systems, industrial monitoring and control, and applications that require communication in safety-critical scenarios, advised u-blox. 

At approximately 400mm2, the u-blox SARA-S520M10L is claimed to be the smallest multi-mode cellular and satellite IoT module on the market. It provides LTE-M/NB-IoT, L-band satellite connectivity, and embedded navigation capability for connectivity through terrestrial cellular networks and geostationary (GEO) satellites. It can provide location fixes using up to four satellite constellations and is pin-compatible with other u-blox cellular-only modules in the SARA form factor.  

This is the first u-blox module designed with the 2nd generation of the u-blox UBX-R5 chip, the UBX-R52/S52. The S52 variant was developed to support satellite IoT communication alongside LTE-M/NB-IoT cellular standards. 

“Comparable solutions on the market require two distinct subsystems, one for cellular and another for satellite connectivity,” said Alessandro Bonetti, senior product manager, product centre cellular at u-blox. Building the module around a single, highly integrated, multi-mode modem SoC reduces size and complexity, Bonetti added. He said the versatile SoC, combined with the company’s GNSS capability serves mobile and stationary IoT applications in “challenging environments such as isolated places, mountains, or in the middle of the ocean”. 

The first samples will be available by Q1 2024.

u-blox specialises in positioning and wireless communication in automotive, industrial and consumer markets. The company’s services, and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules, and secure data services and connectivity to develop solutions for the IoT quickly and cost-effectively. With headquarters in Thalwil, Switzerland, the company has offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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MRigidCSP package is claimed to increase MOSFET’s mechanical strength  

Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications.  A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.

http://www.aosmd.com

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