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ST collaborates with indie Semiconductor to enhance in-car wireless charging privacy and security

Fri, Dec 01, 2023

ST has introduced the STSAFE-V100-Qi secure element to strengthen privacy and security when charging car occupants’ portable devices. ST also revealed its collaboration with indie Semiconductor to integrate the new secure element in indie’s Qi wireless in-car charging reference design.

ST’s new IC enables in-car charging to meet the latest Wireless Power Consortium (WPC) specifications, which call for protection by a secure element. It is also certified to the highest level of security applicable for Qi chargers, common criteria (CC) EAL4+, ensuring heightened cybersecurity protection.

ST’s secure element families are proven to protect the confidentiality, integrity, and authenticity of information and devices in security-conscious applications such as banking, ticketing, and identity protection, and in this Qi wireless-charging reference design, contribute to optimised charging and safety in an automotive application.

Customised for Qi charging at ST’s factory, the STSAFE-V100-Qi also supports secure boot, secure storage, and secure software update. This extra safeguarding strengthens protection against risks such as remote tampering, counterfeiting, and copying. Designed with secure software updates, the IC ensures a high level of security for the life of the vehicle.

“indie’s advanced Qi standards-based wireless charging silicon solutions enhance the overall in-cabin user experience, bringing convenient portable device charging to vehicles across all segment classes,” commented Fred Jarrar, Vice President and General Manager of indie Semiconductor’s Power and USB product lines. “ST’s secure element brings the highest level of cybersecurity protection to our reference design, enabling brand protection for our automotive customers and safety, security and reassurance for vehicle occupants.”

“By integrating our STSAFE-V100-Qi, the reference design meets the latest WPC specification and Common Criteria EAL4+ to assure protection of charging devices at up to 15W,” said Laurent Degauque, Marketing Director, Connected Security, STMicroelectronics. “As a result, indie’s customers benefit from a powerful combination of a high-quality charging system with the highest level of security.”

For more information, please go to https://www.st.com/en/secure-mcus/stsafe-v100-qi.html

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Infineon introduces the industry’s first USB 10 Gbps peripheral controller

Thu, Nov 30, 2023

The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications. Now, Infineon introduces the latest addition to the family: The EZ-USB FX10. The device offers fast connectivity with USB 10Gbps and LVDS interfaces, increasing the total bandwidth up to 3 times compared to its predecessor.

The EZ-USB FX10 is equipped with dual ARM® Cortex®-M4 and M0+ core CPUs, a 512 KB flash, a 128 KB SRAM, a 128 KB ROM, and seven serial communication blocks (SCBs). It also includes a cryptography accelerator and a high-bandwidth data subsystem. The high-bandwidth data subsystem enables direct memory access (DMA) data transfers between LVDS/LVCMOS and USB ports at speeds of up to 10 Gbps. Data transfer is supported by an additional 1 MB of SRAM for USB data buffering. The peripheral controller provides USB-C connector orientation detection and flip-mux functionality, eliminating the need for external logic. This comprehensive feature set makes the EZ-USB FX10 an ideal choice for developers looking for a powerful and adaptable USB controller.

The EZ-USB FX10 requires a smaller PCB footprint and thus helps to optimise the BOM. The 10 x 10 mm² BGA package makes it ideal for space-constrained applications. Additionally, it supports USB-C direct connection without a high-speed signal multiplexer, which simplifies the design process. The Quick Start Development Kit includes firmware and a configuration tool for easy integration. The EZ-USB FX10 DVK (development kit) also comes with a standard FPGA Mezzanine Card (FMC) connector for easy connection to field-programmable gate array (FPGA) boards and an all-in-one programming and debugging accessory board. The controller comes with a comprehensive set of application notes for hardware and software design, enabling developers to create high-performance devices for various applications.

The EZ-USB FX10 will be officially launched at the International Technical Exhibition on Image Technology and Equipment (ITE 2023) in Yokohama, Japan on 6 December.
Availability

The EZ-USB FX10 peripheral controller in a 10 x 10 mm² BGA package will be available in the fourth quarter of 2024. Engineering samples are available now.

http://www.infineon.com/ez-usb-fx10

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NXP introduces battery cell controller IC designed for lifetime performance and battery pack safety

Wed, Nov 29, 2023

NXP has introduced its next-generation battery cell controller IC, designed to optimise battery management systems (BMS) performance and safety. With down to 0.8 mV cell measurement accuracy and maximum cell balancing capability over a wide temperature range, NXP’s MC33774 18-channel analog front-end device comes with ASIL D support for use in safety-critical, high-voltage lithium-ion (Li-ion) batteries to maximise the usable capacity.

Li-ion batteries are commonly used in EVs because of their high energy density by volume and weight, low self-discharge, low maintenance, and ability to sustain thousands of charge-discharge cycles. They account for approximately 30 to 40 percent of the total cost of the EV. A typical 800 V Li-ion battery system comprises around 200 individual cells connected in series. It is critical to accurately estimate the battery pack’s state-of-charge (SoC) at any given temperature and instant in the years-long life-cycle. NXP’s MC33774 is designed to deliver lifetime accurate cell measurement data in temperatures ranging from -40°C to +125°C, enabling very precise range predictions.

“The MC33774 has undergone a rigorous design and validation process to ensure its safety and reliability in automotive use,” said Robert Li, Vice President and General Manager, Product Line Driver and Energy Systems at NXP. “This includes system-level validation to test electromagnetic compatibility, electrostatic discharge, transient immunity, and communication reliability in demanding scenarios. The MC33774 is designed to reduce costs for OEM systems while maintaining its reliability, allowing for a safe launch of cars despite shorter development cycles in the EV industry.”

Based on NXP’s SmartMOS SOI (Silicon-on-Isolator) technology, the MC33774 Li-ion battery cell controller offers cell measurement accuracy down to ±0.8 mV, which helps to ensure lifetime performance with both nickel manganese cobalt (NCM) and lithium iron phosphate (LFP) cell chemistries. The precision design and calibration technologies of the NXP MC33774 save customers end-of-line (EoL) calibration costs.

The NXP MC33774 18-channel Li-ion battery controller IC is part of the NXP High Voltage BMS chip-set solution, which includes future products like the MC33777, a battery junction box controller for pack level measurement, and the already released MC33665 battery management communication gateway. The comprehensive and robust BMS system solution offers first-time-right battery systems while working to avoid field incidental surprises. The complete design package, which includes production-grade software and functional safety libraries, helps to accelerate the development time of functional safety systems and saves system bill-of-material costs.

https://www.nxp.com

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TDK releases new ASIL C ready stray-field robust 3D HAL sensors

Wed, Nov 29, 2023

TDK has furtherer extended its Micronas 3D HAL position sensor family with new HAL 3930- 4100 and HAR 3930-4100 for automotive and industrial applications. Both sensors empower precise position detection with robust stray-field compensation capabilities, offering flexible digital output interfaces in the form of PWM or SENT. The single die devices are defined as SEooC (Safety Element out of Context) ASIL C ready according to ISO 26262 and can be integrated in automotive safety-related systems up to ASIL D. The sensors are suitable for applications such as steering angle position detection, transmission position detection, shifter position detection, accelerator and brake pedal position detection.** . The start of production is planned for January 2024; samples are now available on request.

Both sensors offer user-configurable PWM or SENT output interfaces, which enhances adaptability. Additionally, the sensors introduce a switch output with versatile high-/low-side switch configurations. The switch signal originates from calculated position data or other sources along the device’s signal path, such as temperature or magnetic-field amplitude. As ASIL C ready devices, HAL 3930-4100 and HAR 3930-4100 both conduct self-tests when starting up and during regular operation to enhance its reliability. These tests are designed to either prevent the sensor from giving incorrect readings or to report errors either via the SENT interface according to the SENT standard or via the PWM interface.

HAR 3930-4100 is the dual-die version of the HAL 3930-4100, providing full redundancy. It is equipped with two independent dies stacked on top of each other, separated both mechanically and electrically. These two dies, while measuring nearly identical magnetic fields, ensure synchronised output signals. This redundancy design, housed within a single package, accomplishes the dual feat of reducing system costs and elevating overall reliability. Smaller PCBs and fewer solder joints further bolster system dependability. The HAR 3930-4100 is conveniently available in a compact SSOP16 package, while the single-die variant is housed in a SOIC8 package.

HAL 3930-4100 and HAR 3930-4100 offer an extensive range of measurement capabilities, encompassing 360° angular measurements, linear movement tracking, and the provision of 3D position data for magnets. This 3D position information can be transmitted through SENT or two PWM outputs. Moreover, the sensors feature a modulo function, primarily tailored for chassis position sensor applications. This function facilitates the partitioning of the 360° measurement range into smaller, more precise segments like 90°, 120°, and 180°.

Furthermore, the on-chip signal processing functionality computes up to two angles from magnetic-field components, converting them into a digital output signal. This flexible feature empowers customers to fine-tune essential parameters such as gain, offset, reference position, and more through non-volatile memory programming, ensuring seamless alignment with their specific magnetic circuitry requirements.

Further information on the products can be found https://www.micronas.tdk.com/en/products/direct-angle-sensors/hal-39xy.

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ST collaborates with indie Semiconductor to enhance in-car wireless charging privacy and security

Infineon introduces the industry’s first USB 10 Gbps peripheral controller

NXP introduces battery cell controller IC designed for lifetime performance and battery pack safety

TDK releases new ASIL C ready stray-field robust 3D HAL sensors

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