Next-Gen ethernet switches from Microchip feature time sensitive networking and scalable port bandwidths

The growth of the industrial automation market encompasses innovative technologies like Machine Learning (ML) and robotic systems. Embedded solutions with deterministic communication are essential for industrial automation applications to control, monitor and process data. To provide designers with a reliable and robust network solution with deterministic communication, Microchip has announced its next-generation of LAN969x Ethernet switches with Time Sensitive Networking (TSN), scalable bandwidths from 46 Gbps to 102 Gbps and a powerful 1 GHz single-core Arm® Cortex®-A53 CPU.

For applications that require greater redundancy, the LAN969x Ethernet switches can be configured with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP). HSR and PRP are hardware protocols that provide zero-loss redundancy in Ethernet networks. The LAN969x Ethernet switches support multiple HSR and PRP Redundancy Box (RedBox) instances that can operate in parallel and in series, as well as at Ethernet port speeds from 10 Mbps to 10 Gbps.

The LAN969x can implement a QuadBox, which is a function that connects two HSR networks to each other. This feature is particularly useful in applications where high reliability and zero downtime are critical. Alternative solutions that implement a QuadBox typically require multiple different components that can drive up design complexity and system costs.

“Prior to the introduction of Microchip’s LAN969x Ethernet switches, customers who wanted to implement TSN and HSR/PRP features required multiple ICs. Microchip’s new LAN969x solution is a single chip that can reduce the number of components and system level costs,” said Charles Forni, vice president of Microchip’s USB and networking business unit. “These devices are also supported with our VSC6817SDK IStaX Linux® application software package that can enable designers to quickly bring products to market.”

The LAN969x Ethernet switches are highly configurable with options of up to 30 ports. The Ethernet ports support multiple interfaces including RGMII, SGMII, QSGMII, USGMII, and USXGMII. The LAN969x family targets secure and safety-critical applications where high- port-count 10M/100M/1G/2.5G/10G switching links are required.

The LAN969x family is available with security add-ons such as secure boot and secure firmware execution based on the customer’s root-of-trust manufacturing process. Security is provided through Ternary Content Addressable Memory (TCAM)-based frame processing using a Versatile Content Aware Processor (VCAP), Arm Trusted Firmware methodology for fast secure boot, crypto libraries and hardware security accelerators for boot and code encryption, and one-time programmable immutable key storage.

The new family of LAN969x mid-range Ethernet switches rounds out Microchip’s portfolio of TSN switches. The SparX-5i family supports up to 64-ports and 200 Gbps of switching bandwidth, while the LAN9662 and LAN9668 support from 4 to 8 ports and 4 to 11 Gbps of switch bandwidth.

The LAN969x family of Ethernet switches is supported by the EV23X71A Evaluation Board. Other resources include the IStaX VSC6817SDK Linux Application Software Package to support TSN standards and HSR/PRP redundancy.

https://www.microchip.com.

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New MOSFET relays from Omron extend capacity and operating temperature

Omron has further expanded its MOSFET relay line-up to offer higher operating temperature and enhanced capacity in a high-current six-pin DIP format. Omron’s new G3VM-63BR and G3VM-63ER extend the company’s 60V DIP6 MOSFET relay range up to 0.7A continuous load current, whilst providing high operating temperatures to 110degC.

Operating from -40 to 110 deg C, the company’s latest MOSFET relays contribute to much smaller and denser equipment than equivalent mechanical devices. Power consumption on the input is exceptionally low compared to all electromechanical relays, but especially reed relays, further contributing to energy-saving equipment.

Maximum resistance with output on is typically 0.3Ω (0.1Ω. with connection C), whilst typical capacitance between output terminals is specified as 520pF. Their maximum trigger LED forward current is 2mA, whilst turn ON time and OFF times are 2ms and 3ms respectively.

For factory automation applications, the new models have NC contacts allowing status output to linked devices including power off status. The new relays can also be used alongside the no contact type, enabling switching control of multiple loads with just one input control. The beneficiaries in factory automation include PLCs machine tools, inverters, robot controllers, temperature control together with fire, gas or smoke alarm systems. Further uses for the G3VM-63ER extend to sensor signal transfer and output signal switching – for example with gas detection and similar alarm applications.

The new relays are available now as stick packaging:50 pcs, or tape: 500 pcs packaging (only for SMT type) with a lineup that includes PCB and surface-mount terminals.

https://components.omron.com/eu-en

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Renesas launches RZ/G3S 64-bit microprocessor with enhanced peripherals for IoT Edge and gateway devices

As the latest addition to Renesas’ RZ/G Series MPU, the RZ/G3S is designed to meet the demanding requirements of modern IoT devices, offering power consumption as low as 10µW (microwatts) in standby mode and fast startup for the Linux operating system. The new MPU comes with a PCI Express interface that enables high-speed connectivity with 5G wireless modules. Additionally, the device boasts enhanced security features such as tamper detection to ensure data security. These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.

“Renesas’ RZ/G has seen a steady increase in adoption in the global industrial human machine interface market,” said Daryl Khoo, Vice President of Embedded Processing 1st Division at Renesas. “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets. Renesas has been aggressively expanding our connectivity portfolio in these markets through strategic acquisitions to offer advanced connectivity solutions that are power efficient at the system level and enhance data utilisation.”

The RZ/G3S employs an Arm Cortex-A55 core as the main CPU with a maximum operating frequency of 1.1 GHz and two Cortex-M33 cores as sub-CPUs operating at 250 MHz. Users can distribute the MPU’s workloads to sub-CPUs, allowing the device to efficiently handle tasks such as receiving data from sensors, controlling system functions and managing power systems. This reduces the workload on the main CPU, resulting in fewer components, lower costs and a smaller system size.

The device’s newly added power management system is designed to reduce power consumption to extremely low levels — less than 10 µW. The MPU also supports the DDR self-refresh function which allows to retain DRAM data, while also enabling fast Linux startup. The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices. Moreover, the device offers a standby mode that can maintain sub-CPU operation at a power level as low as 40 mW, offering the flexibility to optimise power consumption based on the specific operating requirements of each application.

The RZ/G3S is equipped with a wide range of peripheral functions including Gigabit Ethernet, CAN, USB, as well as the PCI Express interface. By connecting with 5G communication modules, the device can achieve high-speed communication at Gigahertz levels.

Similar to other RZ/G devices, the RZ/G3S features an ECC (Error Correction Code) function in both internal memory and external DDR interface to maintain data integrity. The Verified Linux Package (VLP) based on the industrial-grade Linux software (Civil Infrastructure Platform™ (CIP) Linux) is available for the RZ/G3S. With VLP, developers receive over 10 years of maintenance support, ensuring long-term protection against security threats. The device also provides tamper detection along with secure boot, secure debug and more. RZ/G series products are already Level 2 PSA Certified from Arm and Renesas has plans to include the RZ/G3S in the future.

Renesas has combined the new RZ/G3S MPU with optimised power management ICs and clock products to develop the “Single Board Computer Gateway”. The RZ/G3S’s rich set of interfaces allows the device to connect with various sensors via USB, CAN, RS485, UART, and I2C. It also offers high performance wireless connectivity options to build a robust network for home automation or IoT applications. Its multicore design allows for real-time processing of data while being power efficient with its advanced sleep mode functions. The Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimised, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

https://www.renesas.com/rzg3s

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XENSIV stray field robust linear TMR sensor enables high-precision length measurements

The sensor comes in a wafer-level package and is well suited for linear and angular incremental position detection. The device is qualified for industrial and consumer applications according to the JEDEC standard JESD47K and can be used as a replacement for optical encoders and resolvers. It is well suited for positioning lenses for zoom and focus adjustment in cameras.

The TLI5590 is a low field sensor with Infineon TMR technology which was developed for high-volume sensor systems. As a result, the sensor offers ultra-high sensitivity, low jitter, and low power consumption. Compared to linear Hall sensors, TMR sensors offer better linearity, lower noise, and lower hysteresis. The high signal-to-noise ratio and the lower power enable cost-effective magnetic designs with lower battery consumption.

As a result, the new sensor enables accurate detection with rapidly changing directions. The TLI5590 consists of two TMR Wheatstone bridges, where the TMR resistance depends on the direction and strength of the external magnetic field. In combination with a multipole magnet, each bridge provides a differential output signal, i.e., sine and cosine signals. These can be further processed for relative position measurement.

The sensor is housed in an extreme small 6-ball wafer level package SG-WFWLB-6-3. Due to the higher integration density, the sensor size has been reduced, which supports miniaturisation and position detection in microsystems. The TLI5590-A6W enables fine measurement with a very high accuracy of better than 10 µm, which is achieved by using a suitable linear or rotary magnetic encoder. With an extended operating temperature range of up to +125°C, the sensor can be used flexibly in various industrial and consumer applications. In addition, its high temperature stability makes it the perfect choice for use in harsh environments.

https://www.infineon.com/linear-sensors/tli5590-a6w

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