SemiQ unveils high-performance QSiC power modules in half-bridge packages

SemiQ has expanded its QSiC power modules portfolio with the introduction of a new series of 1200V silicon-carbide (SiC) power MOSFETs in half-bridge packages.

Engineered and tested to operate reliably in demanding environments, these new compact, high-performance modules enable high-power-density implementations while minimising dynamic and static losses. Featuring high breakdown voltage (>1400V), the new QSiC modules support high-temperature operation (Tj = 175°C) with low Rds(On) shift over the full temperature range. In addition, the modules exhibit industry-leading gate oxide stability and long gate oxide lifetime, avalanche unclamped inductive switching (UIS) ruggedness and long short-circuit withstand time.

With a solid foundation of high-performance ceramics, the new SiC modules are suitable for EV charging, on-board chargers (OBCs), DC-DC converters, E-compressors, fuel cell converters, medical power supplies, photovoltaic inverters, energy storage systems, solar and wind energy systems, data centre power supplies, UPS/PFC circuits, Vienna rectifiers, and other automotive and industrial applications.

To ensure that each module has a stable gate threshold voltage and high-quality gate oxide, SemiQ’s modules undergo gate burn-in testing at the wafer level. Besides the burn-in test, which helps to stabilise the extrinsic failure rate, stress tests such as gate stress, high-temperature reverse bias (HTRB) drain stress, and high humidity, high voltage, high temperature (H3TRB) allow achieving the required automotive and industrial grade quality levels. The devices also have extended short-circuit ratings. All modules have undergone testing exceeding 1350V.

https://semiq.com/

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Nordic-powered module provides Bluetooth LE audio connectivity

Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The SoC is designed for advanced Bluetooth LE audio applications, as well as sophisticated metering, wearable, smart home, industrial, and medical use cases. Measuring just 16.5 by 13.0 by 2.5 mm, the ‘BTM-N340X’ module supports LE Audio and its Low Complexity Communication Codec (LC3), which together enable higher quality, lower power wireless audio streaming compared with existing Classic Bluetooth audio solutions.

The module employs the nRF5340 SoC’s dual Arm Cortex-M33 processors – providing a high performance application processor capable of DSP and Floating Point (FP) alongside a fully programmable, ultra low power network processor. The application core manages the LC3 codec, while the Bluetooth LE protocol is supervised by the network processor.

“The BTM-N340X module has been designed for a wide range of applications, aiming in particular to provide enhanced audio experiences via Bluetooth LE Audio,” says Bob Wu, CTO at Rayson Technology. “It enables one device to stream audio to multiple pairs of wireless headphones, and can facilitate audio broadcasts through public address systems, such as in airports and museums. This module is also compatible with smart speakers and home audio systems.”

The module’s ultra-low power consumption is made possible due to the nRF5340’s power-optimised multiprotocol radio, which offers a TX current of 3.4 mA (0 dBm TX power, 3 V, DC/DC) and RX current of 2.7 mA (3 V, DC/DC). The sleep current is as low as 0.9 µA. Additionally, because the cores can operate independently, developers have the flexibility to optimise performance for power consumption, throughput, and low latency response.

Two flexible antenna options are available for the module—a pre-certified U.F.L Connector and a PCB pin out—depending on the product application. The module is designed to operate within a temperature range of -40 to +85°C.

“The dual processors made the nRF5340 SoC an excellent choice for this module’s LE Audio applications,” says Wu. “The large memory capacity, radio sensitivity, and low power consumption were also major drawcards. In addition to the excellent technical capabilities of the chip, the high level of support from Nordic was a key factor when making our selection.”

https://www.nordicsemi.com

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Supermicro offers rack scale solutions with new 5th gen Intel Xeon processors 

Supermicro, announces rack scale air and liquid cooled solutions based on the X13 family of workload-optimised servers now support the new 5th Gen Intel Xeon processors (formerly codenamed Emerald Rapids). The new product lineup includes GPU servers for Generative AI, throughput and latency-optimised E3.S Petascale servers, cost-effective high-density Enterprise and Simply Double storage servers for large-scale object storage, and a new 4-node SuperEdge systems with enhanced storage capacity.

Supermicro X13 systems take advantage of the new processors’ built-in workload accelerators, enhanced security features, higher core count, more last-level cache, and increased performance within the same power envelope as the previous generation of Intel Xeon processors. The 5th Gen Intel Xeon processors provide a 36% higher average performance/watt across workloads vs. 4th Gen Intel Xeon Scalable processors.

The new Intel Trust Domain Extensions (Intel TDX) are built into the CPU die. Supermicro X13 systems also include firmware protected hardware root of trust (RoT) compliant with NIST 800-193, as well as benefiting from Supermicro’s supply chain attestation and ‘Made in the USA’ program for added security from production to end customer.

“5th Gen Intel Xeon processors deliver meaningful performance and efficiency improvements for our customers’ most important workloads,” said Lisa Spelman, corporate vice president and general manager Xeon Products & Solutions at Intel. “Supermicro’s X13 range of servers are designed to give customers the fastest path to increased performance given their compatibility with 4th Gen Xeon based platforms already in the market.”

Among the new additions to the broad X13 server range is a new dual processor GPU server with 8 Intel Data Centre GPU Max 1550 OAM GPUs optimised for large-scale AI training, generative AI, and HPC applications. The Intel Data Centre GPU Max 1550 GPUs utilises the open-standard Open Accelerator Module (OAM) form factor for flexible high-speed interconnect and contains 128GB of HBM2e memory for a maximum GPU memory bandwidth of 3276.8 GB/second. Both CPU and GPU direct-to-chip liquid cooling are available on the system via Supermicro’s complete rack integration and liquid cooling solutions.

Supermicro is also launching several new servers supporting the new Intel Xeon E-2400 processors (formerly codenamed Catlow Platform, Raptor Lake-E). The new systems are optimised for maximum efficiency Edge and Cloud workloads and include the I/O flexible WIO, storage-optimised, short-depth, and mid-tower configurations, as well as multi-node Supermicro MicroCloud and Supermicro MicroBlade architectures. The new Intel Xeon E-2400 processors have up to 8 cores and a top frequency of 5.6 GHz. These servers are available for shipping immediately

https://www.supermicro.com/

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Time-of-flight sensor from ST boosts ranging performance and power saving

ST has announced the latest-generation 8×8 multi-zone time-of-flight (ToF) ranging sensor that delivers a range of improvements including greater ambient-light immunity, lower power consumption, and enhanced optics.

ST’s direct-ToF sensors combine a 940nm vertical cavity surface emitting laser (VCSEL), a multi-zone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400cm away, across 64 independent zones, and up to 30 captures per second.

The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extending the sensor’s maximum range in daylight from 170cm to 285cm and reducing power consumption from 4.5mW to 1.6mW in low-power mode.

ST released the first multi-zone time-of-flight sensor with the VL53L5CX in 2021. By increasing performance, the new VL53L8CX now further extends the advantages of these sensors over alternatives with conventional optics, which have fewer native zones and lose sensitivity in the outer areas. Thanks to its true 8×8 multi-zone sensing, the VL53L8CX ensures uniform sensitivity and accurate ranging throughout the field of view, with superior range in ambient light.

When used for system activation and human presence detection, the VL53L8CX’s greater ambient-light immunity enables equipment to respond more consistently and quickly. As part of ST’s STGesture platform that also includes the STSW-IMG035 turnkey gesture-recognition software and Gesture EVK development tool, the new sensor delivers the precision needed for repeatable gesture-based interaction. In addition to motion gesture recognition, hand posture recognition is also possible leveraging the latest AI models available in the STM32ai-modelzoo on GitHub.

Moreover, the VL53L8CX provides increased accuracy for monitoring the contents of bins, containers, silos, and tanks, including liquid-level monitoring, in industrial bulk storage and warehousing. The superior accuracy can also enhance the performance of drinks machines such as coffee makers and beverage dispensers.

Mobile robots including autonomous vacuum cleaners can leverage the VL53L8CX to improve guidance capabilities like floor sensing, small object detection, collision avoidance, and cliff detection. Also, the synchronisation pin enables projectors and cameras to benefit from coordinated autofocus. There is also a motion indicator, an auto-stop feature that allows real-time actions, and the sensor is immune to cover-glass crosstalk beyond 60cm. Now supporting SPI connectivity, in addition to the 1MHz I2C interface, the new sensor handles host data transfers at up to 3MHz.

Designers can quickly evaluate the VL53L8CX and jump-start their projects taking advantage of the supporting ecosystem that includes the X-NUCLEO-53L8A1 expansion board and SATEL-VL53L8 breakout boards. The P-NUCLEO-53L8A1 pack is also available, which contains a STM32F401 Nucleo microcontroller board and X-NUCLEO-53L8A1 expansion board ready to power up and start exploring.

 

http://www.st.com/VL53L8CX

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