Skyworks’ advanced AI noise suppression enables highest audio quality for new audio/video applications on the Edge

Skyworks Solutions is introducing its newest software solution for removing unwanted background noise from speech signals at CES 2024. The AI Noise Suppression solution delivers a new benchmark of performance for noise reduction, increasing speech intelligibility, preserving quality and reducing listener fatigue when using handsets, headsets, conference systems, automotive telematics, wireless microphones and audio-visual systems.

According to Astute Analytica, the edge AI market is predicted to grow from $1.4 million in 2021 to $8 million in 2027, with a large portion coming from the Internet of Things (IoT), wearable consumer devices and the need for faster computing in 5G networks.

While AI noise suppression has become common in desktop and cloud applications, performance lags on the edge. To address this challenge, the new software from Skyworks is highly scalable, from desktop CPU/GPU down to edge platform, with performance that rivals much larger CPU solutions.

“With the proliferation of AI noise suppression in desktop and cloud applications, it’s imperative the industry also overcomes performance lags on the edge to meet market demands,” said Yusuf Jamal, senior vice president and general manager of the Diversified Analog Solutions at Skyworks. “Skyworks is actively developing audio and other signal processing applications at the edge that will replace traditional signal processing techniques and drive new IoT edge applications. The AI Noise Suppression solution delivers benchmark performance, scalable from the edge to the cloud while requiring less memory and computational resources.”

The Skyworks AI Noise Suppression solution meets the needs of the market by:
Achieving subjective and objective test scores in embedded implementations that compete with desktop CPU/GPU solutions while requiring less than 10% CPU load on a HiFi4 core running at 600 MHz
The ability to run at 48 kHz, enabling advanced noise reduction on full bandwidth signals in audio/video production and playback
Not requiring connection to large cloud servers or tethering to desktop PCs or mobile phones
Not interfering with the original speech signal as confirmed by subjective testing based on ITU-T P.808
The solution allows for advanced noise reduction on full bandwidth signals, giving it the best audio quality on the market and opening additional applications in the areas of audio/video production and playback.

https://www.skyworksinc.com/

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Production reference design for advanced in-cabin sensing to enhance vehicle safety and comfort

Eyeris Technologie, OMNIVISION and Leopard Imaging, have announced their partnership on a production reference design to improve safety and comfort in the entire automobile cabin. This jointly developed reference design integrates Eyeris’ advanced monocular three-dimensional (3D) sensing AI software algorithm into Leopard Imaging’s 5-megapixel (MP) backside illuminated (BSI) global shutter (GS) camera, which uses OMNIVISION’s OX05B image sensor and OAX4600 image signal processor (ISP). The advanced depth-aware driver monitoring system (DMS) and occupant monitoring system (OMS) production reference design will be showcased during CES 2024 at Leopard Imaging’s booth #9529,

The new production reference design is the first in the automotive industry to address the need for depth-aware in-cabin sensing data. Eyeris’ monocular 3D sensing AI technology enables any 2D image sensor, including the latest RGB-IR sensors, to provide valuable depth-aware whole-cabin sensing including DMS and OMS data. In addition to using OMNIVISION’s OX05B 5MP RGB-IR image sensor, this advanced production reference design also uses OMNIVISION’s OAX4600 ISP to process Eyeris‘ monocular 3D sensing AI data. Together with Leopard Imaging’s camera design-house capabilities, this comprehensive production reference design enables auto manufacturers and tier-ones to achieve faster time-to-market with reduced costs and low integration risk.

“Our partnership with OMNIVISION and Leopard Imaging offers automotive customers the industry’s most advanced 3D software along with a hardware production reference design kit for in-cabin sensing,” said Modar Alaoui, founder and CEO of Eyeris. “It is a true turn-key solution that’s readily available, with a unique combination of AI-based depth-aware DMS and OMS data, processed on OMNIVISION’s RGB-IR image sensor and ISP platform.”

“We are excited to partner with Eyeris and Leopard Imaging on this combined solution, which integrates a unique set of capabilities developed specifically for monocular 3D in-cabin monitoring systems,” said Paul Wu, staff marketing manager at OMNIVISION. “OMNIVISION’s ISP processing technology and dedicated neural processing unit (NPU) ensure robust, latency-free image processing, and our OX05B sensor offers the best performance in extremely low light conditions.”

“We’re delighted to work with Eyeris and OMNIVISION on this advanced production reference design for in-cabin monocular 3D sensing AI,” said Cliff Cheng, senior vice president of marketing, Leopard Imaging. “Our camera design and manufacturing experience combined with our advanced imaging solutions are a testament to our commitment for pushing innovation boundaries for the future of automotive in-cabin sensing.”

https://www.eyeris.ai.

https://www.ovt.com.

https://www.leopardimaging.com.

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u-blox module unlocks new automotive use cases

u-blox has announced JODY-W6, a concurrent dual-band Wi-Fi 6E module with Bluetooth 5.3, including LE Audio, in a compact size (13.8 x 19.8 x 2.5 mm). The new module targets automotive use cases in infotainment and navigation, advanced telematics, as well as OEM telematics.

According to the TSR (Techno Systems Research CO. LTD.) Wireless Connectivity Market Report, Wi-Fi 6 and 6E technologies are experiencing significant and promising growth in the automotive industry. Wi-Fi 6 focuses on efficiency, with reduced data congestion, improved network capacity, and lower overall power consumption. Instead, Wi-Fi 6E focuses on spectrum, enabling more concurrent users, reduced congestion, and enhanced security.

Not only does the u-blox JODY-W6 deliver the benefits of Wi-Fi 6E, but it also features dual-mode Bluetooth with LE Audio. JODY-W6 is globally certified and can withstand operating temperatures from -40 °C up to 105 °C.

The module is available with either two or three antennas. Upon request, it can also integrate an LTE filter. An EVK and an M.2 card will be available for the JODY-W6 series. Furthermore, its compatibility with previous JODY modules to ensure seamless scalability.

“JODY-W6 is a smart and reliable solution that helps overcome congestion and fulfils scalability requirements through its highly adaptable compact size. Specific use cases include support for AppleCarPlay and AndroidAuto, personalised entertainment, data off-loading, and smart/roof-integrated antennas.

The u-blox JODY-W6 comes equipped with an embedded NXP Semiconductors AW693 chipset.

“The AW693 SoC (System-on-Chip) embedded in the automotive JODY-W6 SoM (System-on-Module) leverages the latest concurrent dual-band Wi-Fi 6E and Bluetooth LE audio technologies to unlock new opportunities for a wide variety of use cases and businesses in the automotive domain. The AW693 chipset is packed with advanced features, including MU-MIMO, OFDMA, and target wake time (TWT), allowing the u-blox JODY-W6 compact module to benefit from the synergy of our gold partnership,” says Larry Olivas, Vice President and General Manager of Wireless Connectivity Solutions, NXP Semiconductors.

https://www.u-blox.com

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NXP and MicroEJ collaborate to use software containers to accelerate embedded platform development

NXP Semiconductors has announced the NXP Platform Accelerator, developed in collaboration with MicroEJ. The NXP Platform Accelerator leverages MICROEJ VEE software containers with standard APIs to bring a smartphone-like software design process experience to the industrial and IoT edge. The use of MICROEJ VEE enables software portability across NXP’s broad portfolio of RTOS-based MCUs and Linux-based applications processors, enabling manufacturers to significantly accelerate new product development and reduce costs. Furthermore, the NXP Platform Accelerator provides dedicated APIs to create easy access to advanced functionalities integrated in NXP’s processor portfolio, such as power management and 3D/2D graphics.

Why it matters: Smart devices across industrial and IoT markets are challenging to develop and deploy. Many are designed for a single purpose, with fixed functionality and limited computing capability that may be insufficient to support the evolving needs of an increasingly automated environment. Scaling product capability requires redeveloping and integrating low-level software, RTOS or higher-level OS, and middleware, which can create major development challenges and significantly slow product development.

The NXP Platform Accelerator solves this challenge by utilising software containerisation that enables binary software portability across the breadth of NXP’s processors portfolio, from MCUs to applications processors. Reusability at the binary level enables customers to prototype new products as quickly as possible and create a broad portfolio of complex smart devices that evolve with market needs and trends. Furthermore, the NXP Platform Accelerator enables sandboxed application deployment at the edge, bringing smartphone-like capability to the edge, such as partial or complete over-the-air updates, downloadable apps, and microservices.

More details: “Just like what happened in the smartphone industry, containerisation can be a tremendous tool to drive the rapid development of new smart device platforms,” said Charles Dachs, Senior Vice President and General Manager, Industrial and IoT Edge, NXP. “By integrating MicroEJ’s software container with NXP’s broad portfolio of edge processing solutions, we equip engineers to bring more products to market faster, with reduced costs, and to support the continuous evolution of their smart devices across industrial and IoT markets.”

“Software portability and BoM optimisation are often mutually exclusive,” said Fred Rivard, CEO of MicroEJ. “The NXP Platform Accelerator combines these two objectives, thanks to tiny software containers. This small-footprint innovation allows developers to benefit from both an optimised bill of materials and a modern software design process. This enables engineers to create new products and platforms more quickly, design products that are lower power and lower cost, while still allowing for feature-rich differentiation and innovation by device manufacturers.”

The NXP Platform Accelerator integrates advanced development tools, including simulation, virtual device management and a multi-language framework for combination of C, Java, and JavaScript languages, as well as agile collaboration processes and support for Android Studio, IntelliJ and Eclipse IDEs. In addition, the NXP Platform Accelerator integrates dedicated APIs for power management and graphic functions, making it extremely easy for customers to utilise the complex and powerful hardware IP brought by NXP. For example, a simple call to “low power profile” from the customer application layer will trigger performance optimisation for a given power profile. In addition, NXP-tailored containers support broad scalability and integrate NXP-specific optimisations and libraries that leverage processor hardware innovations.

The NXP Platform Accelerator is currently available for NXP’s processors, including power-efficient i.MX RT595 and high-performance multi-core i.MX RT1170 crossover MCUs.

http://nxp.com/PlatformAccelerator

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