Renesas launches RZ/G3S 64-bit microprocessor with enhanced peripherals for IoT Edge and gateway devices

As the latest addition to Renesas’ RZ/G Series MPU, the RZ/G3S is designed to meet the demanding requirements of modern IoT devices, offering power consumption as low as 10µW (microwatts) in standby mode and fast startup for the Linux operating system. The new MPU comes with a PCI Express interface that enables high-speed connectivity with 5G wireless modules. Additionally, the device boasts enhanced security features such as tamper detection to ensure data security. These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.

“Renesas’ RZ/G has seen a steady increase in adoption in the global industrial human machine interface market,” said Daryl Khoo, Vice President of Embedded Processing 1st Division at Renesas. “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets. Renesas has been aggressively expanding our connectivity portfolio in these markets through strategic acquisitions to offer advanced connectivity solutions that are power efficient at the system level and enhance data utilisation.”

The RZ/G3S employs an Arm Cortex-A55 core as the main CPU with a maximum operating frequency of 1.1 GHz and two Cortex-M33 cores as sub-CPUs operating at 250 MHz. Users can distribute the MPU’s workloads to sub-CPUs, allowing the device to efficiently handle tasks such as receiving data from sensors, controlling system functions and managing power systems. This reduces the workload on the main CPU, resulting in fewer components, lower costs and a smaller system size.

The device’s newly added power management system is designed to reduce power consumption to extremely low levels — less than 10 µW. The MPU also supports the DDR self-refresh function which allows to retain DRAM data, while also enabling fast Linux startup. The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices. Moreover, the device offers a standby mode that can maintain sub-CPU operation at a power level as low as 40 mW, offering the flexibility to optimise power consumption based on the specific operating requirements of each application.

The RZ/G3S is equipped with a wide range of peripheral functions including Gigabit Ethernet, CAN, USB, as well as the PCI Express interface. By connecting with 5G communication modules, the device can achieve high-speed communication at Gigahertz levels.

Similar to other RZ/G devices, the RZ/G3S features an ECC (Error Correction Code) function in both internal memory and external DDR interface to maintain data integrity. The Verified Linux Package (VLP) based on the industrial-grade Linux software (Civil Infrastructure Platform™ (CIP) Linux) is available for the RZ/G3S. With VLP, developers receive over 10 years of maintenance support, ensuring long-term protection against security threats. The device also provides tamper detection along with secure boot, secure debug and more. RZ/G series products are already Level 2 PSA Certified from Arm and Renesas has plans to include the RZ/G3S in the future.

Renesas has combined the new RZ/G3S MPU with optimised power management ICs and clock products to develop the “Single Board Computer Gateway”. The RZ/G3S’s rich set of interfaces allows the device to connect with various sensors via USB, CAN, RS485, UART, and I2C. It also offers high performance wireless connectivity options to build a robust network for home automation or IoT applications. Its multicore design allows for real-time processing of data while being power efficient with its advanced sleep mode functions. The Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimised, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

https://www.renesas.com/rzg3s

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XENSIV stray field robust linear TMR sensor enables high-precision length measurements

The sensor comes in a wafer-level package and is well suited for linear and angular incremental position detection. The device is qualified for industrial and consumer applications according to the JEDEC standard JESD47K and can be used as a replacement for optical encoders and resolvers. It is well suited for positioning lenses for zoom and focus adjustment in cameras.

The TLI5590 is a low field sensor with Infineon TMR technology which was developed for high-volume sensor systems. As a result, the sensor offers ultra-high sensitivity, low jitter, and low power consumption. Compared to linear Hall sensors, TMR sensors offer better linearity, lower noise, and lower hysteresis. The high signal-to-noise ratio and the lower power enable cost-effective magnetic designs with lower battery consumption.

As a result, the new sensor enables accurate detection with rapidly changing directions. The TLI5590 consists of two TMR Wheatstone bridges, where the TMR resistance depends on the direction and strength of the external magnetic field. In combination with a multipole magnet, each bridge provides a differential output signal, i.e., sine and cosine signals. These can be further processed for relative position measurement.

The sensor is housed in an extreme small 6-ball wafer level package SG-WFWLB-6-3. Due to the higher integration density, the sensor size has been reduced, which supports miniaturisation and position detection in microsystems. The TLI5590-A6W enables fine measurement with a very high accuracy of better than 10 µm, which is achieved by using a suitable linear or rotary magnetic encoder. With an extended operating temperature range of up to +125°C, the sensor can be used flexibly in various industrial and consumer applications. In addition, its high temperature stability makes it the perfect choice for use in harsh environments.

https://www.infineon.com/linear-sensors/tli5590-a6w

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HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip

HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.

Supporting an SPI interface, the chip brings seamless connectivity to a wide range of IoT devices, such as multi-channel temperature and humidity sensors. The joint partnership to develop the BSC2000 demonstrates the path to extreme-low power in IoT devices used in building, home and industrial automation; consumer electronics and wearables; smart transportation; agriculture; medical; and automotive markets.

“HaiLa is pleased to have collaborated with Presto Engineering on the silicon implementation of the BSC2000, and we’re excited to showcase our technology at CES 2024,” said Derek Kuhn, President and CEO, HaiLa Technologies, Inc. “This is another step forward in our mission to enable sustainable scaling of IoT over existing wireless infrastructures, helping end-users meet their net-zero goals through a massive reduction in battery waste. Presto’s long experience in ultra-low power RFID and NFC allowed HaiLa to complement its team with expert resources embedded into the development process, delivering the completed BSC2000 ASIC as one team.”

According to Cedric Mayor, CEO, Presto Engineering, “We are proud to support HaiLa on a key industry initiative to help reduce carbon footprint of connected objects. This project has shown that pushing the limit of IoT power efficiency is not only possible but a game changer for mitigating the cost and waste of battery usage.” Mayor adds, “With our deep expertise in RF mixed-signal chip design and ultra-low power architectures, we look forward to extending our partnership with HaiLa to jointly address new business opportunities leveraging their unique IP in future projects.”

HaiLa’s passive backscatter foundational technology is protocol-agnostic. As the most common wireless local area network (WLAN) technology in residential, enterprise and industrial environments globally, HaiLa has focused its first adaptation on Wi-Fi as a key infrastructure enabler for IoT deployments.

https://www.haila.io

https://www.presto-eng.com

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GaN FETs Enable 75 – 231 ampere laser diode control in nanoseconds for advanced automotive autonomy

EPC introduces three evaluation boards – EPC9179, EPC9181, and EPC9180 – featuring pulse current laser drivers of  75 A, 125 A, and 231 A , showcasing EPC’s AEC-Q101 GaN FETs. These FETs; EPC2252, EPC2204A, and EPC2218A are 30% smaller and more cost-effective than their predecessors. Designed for both long and short-range automotive lidar systems, these boards expedite solution evaluation with varied input and output options.

All boards share identical functionality, differing only in peak current and pulse width. Utilising a resonant discharge power stage, they employ a ground-referenced GaN FET driven by LMG1020 gate driver. The GaN FET’s ultrafast switching enables rapid discharge of a charged capacitor through the load’s stray inductance, enabling peak discharge currents of tens to hundreds of amps within nanoseconds. The printed circuit board is designed to minimise power loops and common source inductance while offering mounting flexibility for laser diodes or alternative loads. To enhance user-friendliness, all boards ship with EPC9989 interposer PCBs, featuring various footprints to accommodate a variety of laser diodes or other loads. Customers can choose one that meets their needs to evaluate the GaN solutions.

The EPC9179/81/80 boards are designed to be triggered from 3.3V logic or differential logic signals such as LVDS. For single-ended inputs, the boards can operate with input voltages down to 2.5 V or 1.8 V with a simple modification. Designing an automotive lidar system is complex, and finding a reliable solution is challenging. The purpose of these evaluation boards is to simplify the evaluation of powerful GaN-based lidar drivers that switch faster and deliver higher pulse current than other semiconductor solutions. For technical details, EPC offers full schematics, bill of materials (BOM), PCB layout files, and a quick start guide on EPC’s website.

“To meet the growing demand for automotive lidar, these cost-effective boards, featuring our latest AEC products, streamline evaluation, reducing time-to-market with exceptional switching performance,” said Alex Lidow, CEO, and co-founder of EPC.

https://epc-co.com

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