Smart Cities

Farnell allies with Würth Elektronik in home appliances campaign

Thu, Jan 25, 2024

Farnell has joined forces with Würth Elektronik to help design engineers further improve the connectivity and advanced feature sets of ordinary home appliances, without losing sight of the fundamental expectations for reliability, quiet operation and efficiency.

The “Home Appliances meet WE Components” campaign championed by Farnell has introduced a range of meticulously crafted products tailored for design engineers’ needs. Everything from switches and film caps to fast connectors, wireless solutions, sensors, common mode chokes, and snap ferrites have been optimised for every facet of modern appliance design.

Farnell Product Segment Leader for Würth Elektronik, Josh Ahern, said, “We rely on home appliances to keep our lives running smoothly. So much so that we often take them for granted, when in fact brewing our morning coffee and keeping our refrigerators chilled perform vital roles in our lives. However, as they become ever-more sophisticated, it is imperative that the components used to ensure their reliability as well as their expanding feature sets are developed with equally top-quality components. That’s why we are delighted to support WE’s campaign to inform and engage with the developers who are migrating our reliable household electronics to the next generation of usability and longevity.”

Simon Baumann, Coordinator international Engineering, White Goods at Würth Elektronik, concurs, “Most home appliances today contain a large number of electronic circuits. For example, motor control components, heating and cooling elements or user interfaces all have to work efficiently, reliably and be EMC compliant”.

As home appliances get smarter, they still need to be dependable, quiet and affordable to run. That means that developers have a lot more to consider when they are working on new appliance designs, and features that not only offer more benefits, but remain in compliance with regulatory requirements. The partnership between Farnell and WE facilitates the transition to exciting new home appliance designs and features.

https://www.farnell.com

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21.5-inch Full HD TFT display features high brightness specification

Wed, Jan 24, 2024

Review Display Systems (RDS) has announced the introduction of a new 21.5-inch TFT display module from industrial display manufacturer, Chefree Technology Corporation. The C23061500501-215H features Full HD resolution (1920 x 1080 pixels), a 16:9 wide aspect ratio, and vertical alignment (VA) mode display technology which ensures excellent optical performance and wide viewing angles.

The 21.5-inch display features vertical alignment (VA) wide viewing technology which enables viewing angles of 89 degrees in all viewing directions (left, right and up, down). The display module features a white LED backlight with integrated driver, and a 30K hour half-brightness lifetime, which enables a specified brightness rating of 1500cd/m² and ensures that the 21.5-inch TFT module produces display images that are bright, clear and colourful.

The dual channel LVDS data interface supports 8-bit RGB colour data which enables a colour palette of up to 16.7M colours. The 21.5-inch display module features mechanical outline dimensions of 495.6mm (l) x 292.2mm (h) x 10.35mm (d) and an active display area of 476.64mm (l) x 268.11mm (h). An extended operating temperature range of -20°C to +85°C is supported.

The 21.5-inch TFT display module is ideal for many varied applications including industrial process control, factory automation, in-vehicle systems, point-of-sale systems, digital signage, and medical equipment.

 

http://www.review-displays.co.uk

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New EnOcean bluetooth module with doubled radio transmission power

Tue, Jan 23, 2024

With the new EnOcean PTM 216B module, customers can now address even more applications thanks to the use of the latest generation kinetic harvester ECO 260. The combination of the new harvester with the latest generation system design, allows for more than double the radio transmission power compared to its highly successful predecessor, the PTM 215B. This significantly increases the usable communication distance. This enhancement enables control of high-bay lighting, expanding the application areas to include warehouses and architectural projects with high ceilings. PTM 216B brings great flexibility in terms of installation locations and repositioning capabilities. In modern offices with adaptable layouts and flexible walls, the elimination of wiring significantly streamlines the installation process.

EnOcean devices such as PTM 216B can be quickly configured using Near Field Communication (NFC) technology. NFC is a short-range wireless technology that enables communication between devices in close proximity, typically within a few centimetres. It allows two devices equipped with NFC capabilities to establish a connection by bringing them close together, triggering the exchange of data. A common use is for making contactless payments.

The integration of EnOcean devices into networks via NFC provides a simple, quick and reliable way of setting up lighting installations.

Energy-harvesting switches based on the PTM 216B and other EnOcean switch modules are available in a wide range of designs from multiple switch manufacturers around the world, all of which blend well into any environment. The unique combination of these features makes PTM 216B an ideal for lighting control and building automation use cases. Official switch OEM partners make use of the “Battery-free by EnOcean” brand to make sure it contains genuine technology from EnOcean for real maintenance-free operation in the field.

This new module will be featured at the EnOcean booth at Light + Building in Frankfurt from March 3-8, 2024. At the show, EnOcean will focus on sustainable IoT for green and healthy buildings. New energy harvesting products as well as IoT solutions and smart servers that help analyse the collected data and make informed decisions to optimise building performance will be at the heart of the EnOcean show presence.

https://www.enocean.com

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Renesas debuts its lowest power consumption, dual-core bluetooth low energy SoC with integrated flash

Fri, Jan 19, 2024

Renesas has introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash) and SoC die size (for cost), the DA14592 is very well suited to a broad range of applications including connected medical, asset tracking, human interface devices, metering, PoS readers and ‘crowd-sourced location’ (CSL) tracking.

The DA14592 utilises a new low-power mode to offer 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current. Additionally, it supports an ultra-low hibernation current of only 90nA, extending shelf-life for end-products shipped with ‘battery connected’, and ultra-low active current at 34µA/MHz for products requiring significant application processing.

Operating from only a system clock and its accurate on-chip RCX, this device removes the need for a sleep mode crystal in the majority of applications. Its reduced eBOM, coupled with the DA14592’s small package (offered in WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm) also presents designers with an small solution footprint. The DA14592 also includes a high-precision, sigma-delta ADC, up to 32 GPIOs and unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications requiring extra memory.

Renesas has integrated all external components required to implement a Bluetooth LE solution into the DA14592MOD module. It offers customers the fastest time-to-market and reduced overall project cost. Emphasis has been placed in the design of this module to ensure maximum design flexibility by comprehensively routing the DA14592’s functions to the outside of the module and using castellated pins for easy/low-cost module attachment during development.

“The DA14592 and DA14592MOD extend our leadership in Bluetooth LE SoCs with our trademark low power consumption and best-in-class eBOMs,” said Davin Lee, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas. “In addition, we have listened to our customers and continue to expand our product support by offering reference designs for applications such as crowd-sourced locationing, helping our customers to more easily differentiate their products, delivering premium value while maintaining lowest costs.”

https://www.renesas.com/DA14592.

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