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ST reveals new family of 100V trench Schottky rectifier diodes

Wed, Mar 27, 2024

ST has introduced 100V trench Schottky rectifier diodes that boost efficiency in power converters operated at high switching frequencies.
Raising power-converter operating frequency, encouraged by the minimal switching losses of technologies like wide-bandgap semiconductors, allows designers to set new benchmarks in power density. However, at elevated frequencies, the energy losses in conventional planar diodes, including silicon Schottky devices, used as rectifiers become a significant factor limiting conversion efficiency.

ST’s trench Schottky diodes significantly reduce the rectifier losses, with superior forward-voltage and reverse-recovery characteristics that enable increased power density with high efficiency. The forward voltage is 50-100mV better than in comparable planar diodes, depending on current and temperature conditions. Simply changing to these devices can increase the efficiency by 0.5%.

There are 28 variants in the new family, with eight current ratings from 1A to 15A, multiple surface-mount packages, in industrial and automotive grades. The industrial-grade parts target applications such as miniature switched-mode power supplies and auxiliary power supplies for telecom, server, and smart-metering equipment. In automotive, typical uses include space-constrained applications such as LED lighting, reverse-polarity protection, and low-voltage DC/DC converters. The parts are AEC-Q101 qualified, manufactured in PPAP-capable facilities, and specified from -40°C to 175°C.

When combined with ST’s flyback and buck-boost converters, such as the VIPer controllers and HVLED001A offline LED driver, the 100V trench Schottky rectifiers fulfil the active-components bill of materials for switched-mode power supplies. All are supported in ST’s eDesign Suite Rectifier Diodes Simulator, which helps to select the rating and footprint, simulate waveforms, and estimate power efficiency.

The diodes are 100% avalanche tested in production to ensure device robustness and system reliability. They are available in DPAK as well as SOD123 Flat, SOD128 Flat, SMB Flat, and PSMC (TO227A) surface-mount packages.

https://www.st.com/100v-trench-schottky

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Renesas introduces industry’s first general-purpose 32-bit RISC-V MCUs with internally developed CPU core

Wed, Mar 27, 2024

Renesas Electronics Corporation has announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the development of RISC-V products, Renesas has already designed and tested a new RISC-V core independently, which is now implemented in a commercial product and available globally. The new, R9A02G021 group of MCUs provides embedded systems designers a clear path to developing a wide range of power-conscious, cost-sensitive applications based on the open-source instruction set architecture (ISA).

While most of today’s RISC-V solutions target specific applications, the R9A02G021 group MCUs are designed to serve multiple end markets, such as IoT sensors, consumer electronics, medical devices, small appliances and industrial systems. Similar to existing general-purpose MCUs, designers will have access to a full-scale development environment for the R9A02G021, provided by Renesas and its extensive network of toolchain partners. This will allow them to significantly reduce costs, engineering resources and development time.
The R9A02G021 RISC-V group offers ample performance with clock speeds up to 48MHz, while consuming extremely low power in standby at 0.3µA. It provides 128KB of fast flash memory, 16KB of SRAM memory and 4KB of flash memory for data storage. Designed to withstand harsh conditions, the MCUs can operate reliably at ambient temperatures ranging from -40 °C to 125 °C. The MCUs come with standard serial communications interfaces, as well as digital-to-analog converter (DAC) and analog-to-digital converter (ADC) functions to facilitate high-speed and secure connections with sensors, displays and other external modules. The wide 1.6V to 5.5V input voltage range enables low-voltage, low-current operation and allows noise immunity, making the R9A02G021 ideal for battery-powered devices.

The R9A02G021 RISC-V MCUs are fully supported by Renesas’ e² studio Integrated Development Environment (IDE), offered to customers at no cost. The comprehensive toolchain includes a code configurator, the LLVM compiler and a fast prototyping board (FPB). Complete development environments are also available from Renesas’ partners: IAR with its Embedded Workbench IDE and I-jet debug probe, and SEGGER with the Embedded Studio IDE, J-Link debug probes and Flasher production programmers. Supporting documentation includes the FPB user manual, a Getting Started guide, schematics, Bill of Materials (BOM), and Gerber files.

The R9A02G021 RISC-V MCU is available today through global distributors, along with the FPB, software and development tools.

https://www.renesas.com/MCUs

Written by Annie Shinn

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Microchip expands TrustFLEX family with CEC1736 Real-time Platform Root of Trust Devices

Wed, Mar 27, 2024

As technology and cybersecurity standards continue to evolve, Microchip is helping make embedded security solutions more accessible with its CEC1736 TrustFLEX devices. The CEC1736 Trust Shield family is a microcontroller-based platform root of trust solution enabling cyber resiliency for data centres, telecom, networking, embedded computing and industrial applications. Now, as part of the TrustFLEX platform, the devices are partially configured and provisioned with Microchip-signed Soteria-G3 firmware to reduce the development time needed to integrate platform root of trust. These devices also help fast-track the provisioning of required cryptographic assets and signed firmware images, simplifying the process of secure manufacturing as required by the National Institute of Standards and Technology (NIST) and Open Compute Project (OCP) standards.

Specifically designed to meet NIST 800-193 platform resiliency guidelines, as well as OCP requirements, CEC1736 TrustFLEX devices can support security features necessary to enable hardware root of trust across various markets. The Trust Platform Design Suite tool will allow customers to personalize platform-specific configuration settings, including unique credentials, to support any application, host processor or SoC that boots out of an external SPI Flash device to extend the root of trust in the system.
Modern firmware security features enabled on the CEC1736 TrustFLEX—like SPI bus monitoring, secure boot, component attestation and lifecycle management—can keep both the pre-boot and real-time (time of check and time of use) environments shielded from both in-person and remote threats.
The highly configurable, mixed-signal, advanced I/O CEC1736 controllers integrate a 32-bit 96 MHz Arm® Cortex®-M4 processor core with closely coupled memory to offer optimal code execution and data access.
The CEC1736 TrustFLEX Configurator, part of the Trust Platform Design Suite, provides a visual view of different use cases to select, configure and generate a provisioning package for development, prototyping and production. The CEC1736 development board is equipped with a socket for easier evaluation and development.

https://www.microchip.com

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Infineon announces the industry’s first wide input voltage hot-swap controller for telecom infrastructure

Tue, Mar 26, 2024

Infineon is expanding its XDP digital power protection controller product family with the XDP700-002, the industry’s first -48 V wide input voltage digital hot-swap controller with a programmable safe operating area (SOA) control designed for telecom infrastructure.

It boasts superior current reporting accuracy of less than ±0.7 percent, enhancing the system’s fault detection and reporting accuracy. Furthermore, the product features boost-mode control technology for safer turn-on of field-effect transistors (FETs) in systems with non-optimal SOA. This new member of the XDP product family is tailored for a spectrum of telecom applications, including remote radio head power, base station power distribution, active and passive antenna systems, 5G small cell power, and telecom UPS systems.

The XDP700-002 employs a three-block architecture that combines high-precision telemetry for monitoring and fault detection, digital SOA control optimised for power MOSFETs, and integrated gate drivers for n-channel power MOSFETs. The XDP700-002 operates within an expansive -6.5 to -80 V input voltage range and can withstand transients up to -100 V for 500 ms, delivering current and voltage telemetry with a remarkable 0.7 percent and 0.5 percent accuracy respectively. It features precise PMBus compliant active monitoring for enhanced system reliability. A programmable gate shutdown during severe overcurrent (SOC) ensures robust shutdown operation within just 1 µs. The advanced closed-loop SOA control ensures higher MOSFET reliability, and the fully digital operating mode minimises the need for external components offering a compact solution making it an optimal fit for space-constrained designs in a cost-effective way.

With options for external FETs selection and a one-time programmable (OTP) option, the XDP700-002 offers flexibility for programming faults and warnings detection as well as de-glitch levels for various usage models. Its analog-assisted digital mode offers backward compatibility with legacy analog hotswap controllers. By offering robust functionality and adaptability, the XDP700-002 exemplifies Infineon’s continuous commitment to innovation and system reliability in telecom infrastructure.

https://www.infineon.com/xdp700-002.

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ST reveals new family of 100V trench Schottky rectifier diodes

Renesas introduces industry’s first general-purpose 32-bit RISC-V MCUs with internally developed CPU core

Microchip expands TrustFLEX family with CEC1736 Real-time Platform Root of Trust Devices

Infineon announces the industry’s first wide input voltage hot-swap controller for telecom infrastructure

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