Smart Cities

Global tracking and telematics click board from Mikroe has extensive network compatibility

Mon, Jun 03, 2024

Mikroe has launched 4G LTE&GNSS Click , a compact add-on board designed for advanced global tracking and telematics applications, enabling developers to build highly efficient and smaller solutions.

The board features the LENA-R8, a compact, multi-mode LTE Cat 1bis module from u-blox that supports 14 LTE bands, four GSM/GPRS bands for universal connectivity, and integrated u-blox GNSS for precise global tracking. The board facilitates communication via UART and includes a USB interface for device management and firmware updates. Key features include dual LED indicators for operational status, flexible power options, and a nano SIM card holder supporting various SIM voltages.

Ideally suited for IoT applications requiring broad global coverage and high-performance location services, the 4G LTE&GNSS Click board is a powerful tool for developers in the tracking and telematics markets. 4G LTE&GNSS Click is fully compatible with the mikroBUS socket and can be used on any host system supporting the mikroBUS standard. It comes with the mikroSDK open-source libraries, offering flexibility for evaluation and customisation.

http://www.mikroe.com

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Microchip adds 12 Products to its wireless portfolio that reduce barriers to Bluetooth integration

Fri, May 31, 2024

System designers face many barriers when adding Bluetooth functionality to their products, from skill and resource limitations to budget constraints to time-to-market pressures to challenging performance and integration requirements. Microchip has expanded its Bluetooth Low Energy portfolio with 12 new products, aimed at providing designers with an extensive array of choices to tackle their unique challenges, effectively lowering barriers across designs spanning from the simplest to the most advanced. These additions include the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC that offers the lowest entry point available for integrating a Bluetooth Low Energy microcontroller (MCU) into product designs. For a list of all 12 products see Microchip’s Bluetooth Low Energy webpage.

In addition to its Bluetooth MCUs, Microchip introduced the RNBD350 plug-and-play module that reduces the cost and complexity barriers to adding Bluetooth Low Energy connectivity to product designs. These modules minimise the time, money and engineering resources required for RF design optimisation, regulatory certification and software development.

Sample applications for Microchip’s Bluetooth Low Energy parts include IoT smart home and building systems, Industrial IoT (IIoT) solutions and automotive designs.

Designers using the newly expanded Bluetooth Low Energy portfolio for entry-level applications benefit from an easy development process, including in-house support services and development tools, without compromising Bluetooth functionality.

Developers can also tap into Microchip’s expanding wireless portfolio for end-to-end solutions. The portfolio offers a range of products in popular wireless technologies like Wi-Fi, Zigbee, Thread and sub-GHz that are designed to work seamlessly with the Bluetooth portfolio.

https://www.microchip.com.

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Advantech accelerates robotics deployment with NVIDIA Nova Orin platform

Fri, May 31, 2024

Advantech has announced the launch of its AMR-S100 Box PC to accelerate autonomous mobile robot (AMR) development, industrial automation, and edge AI deployments.

The AMR-S100 incorporates the NVIDIA Jetson AGX Orin system-on-module for powerful AI computing capabilities. AMR-S100 is designed to provide a production-ready solution for companies aiming to advance NVIDIA Isaac Perceptor from prototyping to the production phase. Additionally, it is seamlessly compatible with the NVIDIA JetPack SDK and approved sensor modules in the NVIDIA Nova Orin development kit, so customers can deploy AMR as well as other robot configurations and applications more efficiently in terms of time and cost. Advantech also provides its own ROS 2 Suite package to customers, allowing users to operate via remote control, perform hardware status monitoring, security management and more.

The AMR-S100 aims to be an ideal off-the-shelf product, as well as a key tool for ODM opportunities. By selecting Nova Orin compatible AMR-S100 and sensors, customers can get a head start on developing their application software, without having to worry about system software for the compute, sensors, performance, and thermal design. Advantech ACG plans to continue collaborating with NVIDIA on the latest technology to deliver the best platform for the autonomous mobile robot industry.

https://www.advantech.com

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Infineon announces next generation CoolGaN transistor families

Thu, May 30, 2024

Infineon has announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalisation and decarbonisation. These two product families are manufactured on high performance 8-inch in-house foundry processes in Kulim (Malaysia) and Villach (Austria). With this, Infineon expands its CoolGaN advantages and capacity to ensure a robust supply chain in the GaN devices market, which is estimated to grow with an average annual growth rate (CAGR) of 46 percent over the next five years according to Yole Group.

The new 650 V G5 family addresses applications in consumer, data centre, industrial and solar. These products are the next generation of GIT-based high voltage products from Infineon. The second new family manufactured on the 8-inch process is the medium voltage G3 devices which include CoolGaN Transistor voltage classes 60 V, 80 V, 100 V and 120 V; and 40 V bidirectional switch (BDS) devices. The medium voltage G3 products are targeted at motor drive, telecom, data centre, solar and consumer applications.

https://www.infineon.com

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