Smart Cities

Time aware shaper protocols shape in-vehicle networks

Tue, Feb 12, 2019

Excelfore adds time aware shaper (TAS) protocols for time sensitive networking (TSN) for automotive use.

To meet automotive requirements for deterministic network behaviour, new protocols must be added to Ethernet stacks to provide audio/video bridging (AVB) and TSN to enable Ethernet to meet the demands of in-vehicle infotainment, control and safety systems.

The Excelfore TAS protocols reside in network talkers and bridges with support for TSN enhancements including IEEE 802.1Qbv and 802.1Qci, explains Excelforce. The TAS provides a circuit-switched/ time-division-multiplexed (TDM) channel into the packet-based Ethernet network. This enables a specific time window to be guaranteed for the delivery of high priority traffic, for example for automotive control systems.

The Excelfore TAS has demonstrated the ability to reduce the variance in measured propagation delays by more than 65 per cent,% compared to Ethernet traffic without the TAS, reports Excelforce. This ensures deterministic sub-100 microsecond accuracy for time-sensitive traffic.

The Excelfore eAVB/TSN protocol stack, including the TAS protocol, is available for Linux, QNX, Integrity and Android operating systems, as well as a variety of smaller real time operating systems (RTOS). It is for use in cameras, video displays, head units, ECUs, and network gateways that bridge to CAN, LIN, and other popular automotive buses.

The TAS protocol will be demonstrated at this week’s Automotive Ethernet Congress (13 to 14 February) in Munich, Germany.

Excelfore provides cloud platform and connectivity applications for intelligent transportation. It provides middleware solutions for smart mobility networks that enable OEMs and suppliers to build the next generation of smart, autonomous and learning vehicles, fleets and associated infrastructure. In addition to the eAVB/TSN protocol stack, it provides the cloud-to-vehicle eSync system for over the air updates, diagnostics and telematics.

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Free Current Sensing e-book from Texas instruments

Mon, Feb 11, 2019

Designing accurate current-measurement circuits can be hard. Get 20 proven tips for solving application-specific, current-sensing design challenges.

Click here to download – http://www.ti.com

 

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Low-cost RFID ICs bring flexible electronics to everyday objects

Fri, Feb 08, 2019

Cost-effective digital traceability and interactivity can be introduced to everyday objects with the ConnectIC family of flexible RFID circuits, says PragmatIC.

The flexible IC company introduces the first products in the ConnectIC family, the PR1101 and PR1102 flexible integrated circuits (FlexICs). They are designed for use in closed high frequency, radio frequency identification (HF RFID) systems. The company expects the ConnectIC family to accelerate the smart packaging market.

They FlexICs have been developed using PragmatIC’s patented technologies and the ConnectICs are claimed to deliver connectivity at the lowest cost point in the market. These FlexICs are thin and flexible, making them suitable for embedding into a range of substrates, including paper and plastic. They reduce the complexity of inlays by using single layer antennae, which further reduces the cost to brand owners and retailers.

The ConnectICs can be used for high volume, fast moving consumer goods (FMCGs) and other mass market applications; PragmatIC believes they mean that electronic connectivity no longer limited to high value, luxury items.

The PR1100 is designed for proximity identification, with rapid detection of objects when one or more low-cost custom readers are integrated into the system. They can be used for hierarchical inventory management, item identification and tracking, supply chain assurance and brand authentication. They are targeted at market segments such as food and beverage, personal and home care, pharmaceutical and healthcare. They also support the introduction of digital interactivity into physical toys and games.

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Silicon Labs Showcases Smart Home and Building Automation Connectivity Solutions at Embedded World

Fri, Feb 01, 2019

Silicon Labs will showcase its latest Wireless Gecko connectivity solutions for smart home, lighting and building automation applications at Embedded World 2019. Hands-on demonstrations at Silicon Labs’ Booth 4A-128 highlight easy-to-deploy Bluetooth® mesh and Bluetooth 5 solutions, device-to-cloud connectivity with low-power Wi-Fi®, Zigbee® home automation and control, and next-generation Z-Wave® 700 smart home solutions.

“Silicon Labs offers IoT developers the essential hardware and software building blocks and tools they need to add wireless connectivity to their smart home and building automation products,” said Raoul Wijgergangs, Vice President and General Manager of Smart Home and Consumer Products at Silicon Labs. “From Bluetooth mesh to Wi-Fi to Zigbee and Z-Wave, we offer the full range of low-power connectivity options, and our Embedded World demos and expert engineers will show how easy it is to get started with wireless design.”

Silicon Labs Demos at Booth 4A-128

Bluetooth Xpress Solutions: Discover how to add Bluetooth 5 connectivity to end node designs with zero programming and no Bluetooth expertise. Pre-certified BGX13 Bluetooth Xpress PCB and SiP modules provide the easiest wireless development path.

Bluetooth Mesh Networking: Create secure, reliable, large-scale Bluetooth mesh networks based on Silicon Labs’ Wireless Gecko devices, Bluetooth mesh software, SDKs and tools. See how easy it is to implement a Bluetooth mesh for smart lighting.

Low-Power Wi-Fi: Add low-power, cloud-connected Wi-Fi to your IoT designs with little to no programming. Silicon Labs’ Wi-Fi devices – including the world’s smallest Wi-Fi SiP module with a built-in antenna – deliver best-in-class energy savings for longer battery life by slashing power consumption in half.

Zigbee Smart Home Control: Seamlessly control Zigbee-enabled, interoperable smart home devices from multiple name brand vendors. See how multiprotocol connectivity with Zigbee and Bluetooth Low energy can enhance the home consumer experience.

Z-Wave 700: Unlock the potential of the smart home with Z-Wave 700 based on the Wireless Gecko platform. Z-Wave 700 builds on industry-leading S2 security and interoperability and adds major improvements in energy efficiency, battery life and wireless range, enabling developers to create new classes of smaller, more intelligent smart home products.

Conference Sessions

Silicon Labs’ connectivity, security and embedded experts will deliver the following conference presentations at Embedded World (NCC Ost):

February 26

  • • “Context-Aware Smart Home – Opening the Eyes of AI in the Home through Sensors?” 10:00 – 10:30 a.m., Session 8.1: Intelligent Systems I Applications
  • • “Techniques for Securing Low-Cost Embedded Devices,” 10:00 – 10:30, Session 4.1 I: HW-based Security I
  • • “Making Products Safer and More Secure with an MPU,” 11:30 – 12:00, Session 4.1 I: HW-based Security I
  • • “Supercharging BLE Beacons with Bluetooth 5,” 12:00 – 12:30, Session 2.2: Communication II Bluetooth

February 27

  • • “The Benefits and Challenges of a Common Software Platform for IoT Development,” 14:30 – 15:00, Session 2.5: Communication V Wireless Multiprotocol
  • • “Extending the Abilities of Battery-Powered End Nodes through Better Power Supply Design,” 15:00 – 15:30, Session 5.4: Power Supply
  • • “Radio Scheduling in Dynamic Multiprotocol Applications,” 15:00 – 15:30, Session 2.5: Communication V Wireless Multiprotocol
  • • “Simplifying Product Returns Through Device Security,” 17:00 – 17:30, Session 4.3 II: Security Architectures & Hacking II

February 28

  • • “Common Pitfalls in IoT Security Implementations and How to Avoid Them,” 9:30 – 10:00, Session 4.4 I: Securing IoT I
  • • “Finding the Right Security Level for Your IoT Application,” 10:30 – 11:00, Session 4.4 I: Securing IoT I
  • • “Uncovering Real-Time Bugs with specialized RTOS Tools,” 14:30-15:00, Session 6.6: Software Engineering V Software Quality II

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Silicon Labs

Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and solutions for a smarter, more connected world. Our award-winning technologies are shaping the future of the Internet of Things, Internet infrastructure, industrial automation, consumer and automotive markets. Our world-class engineering team creates products focused on performance, energy savings, connectivity and simplicity. silabs.com

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About Smart Cities

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