Ceva launches multi-protocol wireless platform IP family to accelerate enhanced connectivity

Ceva has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.

The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications, with the following key features:
• Wi-Fi 6 optimised for cost-sensitive IoT applications,
• Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
• IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
• Optimised co-existence scheme for efficient concurrent communications
• Pre-integrated with a low power multi-protocol radio at TSMC 22nm process

With its modular architecture, the Ceva-Waves Links family is highly versatile to meet customers’ needs, leveraging the latest Ceva-Waves wireless IPs. Upcoming Links platforms may include:
• Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
• Next generation Bluetooth for Channel Sounding and High Data Throughout
• UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
• Optimised co-existence schemes for each specific configuration
• Pre-integrated radio solutions, including partner and customer’s own technology, to address a wide range of configurations and foundry process nodes

For more information, visit https://www.ceva-ip.com

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Microchip brings enhanced code protection and up to 15W of power delivery to its USB microcontroller portfolio

The well-known advantages of a Universal Serial Bus (USB) interface for embedded designs include its compatibility with various devices, streamlined communication protocol, in-field updatability and power delivery capabilities. To help easily incorporate this functionality into embedded systems, Microchip has launched the AVR DU family of microcontrollers (MCUs). As the next generation of Microchip 8-bit MCUs to integrate USB connectivity, the AVR DU family is designed to provide enhanced security features and higher power delivery than previous iterations.

“USB is the standard communication protocol and power delivery method for electronic devices,” said Greg Robinson, corporate vice president of Microchip’s 8-bit MCU business unit. “Microchip’s AVR DU family combines the flexibility of our most advanced 8-bit MCUs with the versatility of enhanced power delivery to bring the benefits of USB to a wider range of embedded systems.”

AVR DU MCUs support power delivery of up to 15W from the USB interface, a capability not commonly found in other USB microcontrollers within its class. This feature enables USB-C® charging with currents up to 3A at 5V, making these MCUs an excellent choice for devices like portable power banks and rechargeable toys.

To strengthen its defence against malicious attacks, the AVR DU family incorporates Microchip’s Program and Debug Interface Disable (PDID) feature. When enabled, the enhanced code protection is designed to lock out access to the programming/debugging interface and block unauthorised attempts to read, modify or erase firmware. To enable secure firmware updates, the AVR DU family employs Read-While-Write (RWW) Flash and, when combined with a secure bootloader, designers can use the USB interface for patching bugs, addressing security concerns and adding new features without disrupting product operation. This updated functionality in the AVR DU MCUs is designed to allow for uninterrupted, in-field updates to help extend the lifetime value of products.

Additionally, the AVR DU family helps reduce overall design and Bill of Material (BOM) costs through a USB clock recovery feature, which eliminates the need for a costly external crystal. Core Independent Peripherals (CIPs) enable designers to incorporate main device functions and system management tasks onto a compact, single-chip solution, saving board space and reducing design effort.

Developers of a wide range of embedded designs, from fitness wearables and home appliances to agricultural and industrial applications, can benefit from incorporating the highly efficient AVR DU MCUs into their designs.

https://www.microchip.com

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Renesas introduces new entry-level RA0 MCU series

Renesas Electronics Corporation has introduced the RA0 microcontroller (MCU) series based on the Arm Cortex-M23 processor. The new, low-cost RA0 devices offer the industry’s lowest overall power consumption for general purpose 32-bit MCUs.

The RA0 devices consume only 84.3μA/MHz of current in active mode and only 0.82 mA in sleep mode. In addition, Renesas offers a Software Standby mode in the new MCUs that reduces power consumption by a further 99 percent to a minuscule 0.2 µA. Coupled with a fast wake-up High-speed On-Chip Oscillator (HOCO), these ultra-low power MCUs deliver an ideal solution for applications including battery-operated consumer electronics devices, small appliances, industrial system control, and building automation applications.

Renesas is now shipping the first group in the RA0 Series, the RA0E1 Group. These devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and HMI functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 3mm x 3mm 16-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) on-chip oscillator (HOCO) improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs, it maintains this precision in environments from -40°C to 105°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.
The RA0E1 MCUs include critical diagnostic safety functions as well as an IEC60730 self-test library. They also offer security features including true random number generator (TRNG) and AES libraries for IoT applications, including encryption.

“Power-constrained IoT embedded applications addressing markets such as industrial and smart home have specific performance, efficiency and security needs,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “Renesas’ RA MCU Family, built on Arm technology, now offers solutions ranging from low power RA0 MCUs to the high performance AI-capable RA8 devices, all with a common design environment that enables easy and fast development and migration.”
The new RA0E1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA devices if customers wish to do so.

Renesas has combined the new RA0E1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the HVAC Environment Monitor Module for Public Buildings. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimised, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

https://renesas.com/RA0E1.

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Infineon announces next-generation PSOC Edge portfolio featuring powerful AI capabilities

Infineon has released details of its new PSOC Edge family of microcontrollers (MCUs) optimised for machine learning (ML) applications. The three new PSOC Edge MCU series, E81, E83 and E84 offer a scalable and compatible range of performance, features, and memory options. They are all supported with comprehensive system design tools and software that enable developers to quickly move from concept to product and bring new ML-enabled Internet of Thing (IoT), consumer and industrial applications to market.

“Next-generation IoT edge devices continue to require more performance without compromising power,” said Steve Tateosian, SVP of Industrial MCUs, IoT, Wireless and Compute Business, Infineon. “Infineon’s innovative new PSOC Edge E8 series of devices use ML capabilities to compute responsive AI while balancing performance and power requirements and providing embedded security for connected home devices, wearables, and industrial applications. As a leading provider of MCUs, we are committed to delivering solutions that extend the capabilities of future IoT systems.”

Infineon’s new PSOC Edge E81, E83 and E84 microcontrollers are based on the high-performance Arm Cortex-M55, including Arm Helium DSP support paired with Arm Ethos-U55, and Cortex-M33 paired with Infineon’s ultra-low power NNLite — a proprietary hardware accelerator intended to accelerate neural networks. In addition, all three series support extensive peripheral sets, on chip memory, robust hardware security features and a variety of connectivity options including USB HS/FS with PHY CAN, Ethernet, WiFi 6, BTBLE and Matter. The PSOC Edge E81 utilises the Arm Helium DSP technology along with Infineon NNLite Neural Network (NN) accelerator. The PSOC Edge E83 and E84 include the Arm Ethos-U55 micro-NPU processor, which provides a 480x improvement in ML performance compared to existing Cortex-M systems, and they support the Infineon NNlite neural network accelerator for ML applications in the low-power compute domain.
Target applications for the PSOC Edge E8x series include Human Machine Interface (HMI) in appliances and industrial devices, smart home and security systems, robotics, and wearables. All three series support voice/audio sensing for activation and control, while the E83 and E84 MCUs deliver increased capabilities for advanced HMI implementations, including ML-based wake-up, and vision-based position detection and face/object recognition. The PSOC Edge E84 series adds low-power graphics display (up to 1028×768) to the extensive feature set.

PSOC Edge E8 MCUs offer designers a full family of system and full software compatible devices. Hardware design support includes an evaluation base board with Arduino expansion header, sensor suite, BLE connectivity for provisioning and Wi-Fi for smart phone and cloud connectivity.

As with all Infineon MCUs, the series is supported by Infineon’s ModusToolbox software platform, which provides a collection of development tools, libraries, and embedded runtime assets for a flexible and comprehensive development experience. ModusToolbox supports a wide range of use cases including consumer IoT, industrial, smart home, and wearables.

Imagimob Studio is an Edge AI development platform, integrated into ModusToolbox, that delivers end-to-end ML development capability, from data in to model deployed. Starter projects and Imagimob’s Ready Models make it simple to get started. When used with PSOC Edge, Imagimob makes it possible to rapidly build and deploy state of the art machine learning models for the edge.

https://www.infineon.com/PSOCedge.

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