Smart Cities Archives - Page 475 of 568 - SmartCitiesElectronics.com

Aetina showcases AI in the smart factory

Mon, Apr 29, 2019

At this year’s Computex (28 May 1 June, Taipei, Taiwan), Aetina will display its edge artificial intelligence (AI) computing for the smart factory.

Aetina has co-operated with a third party in the textile industry to detect defects in textile production. Its small form factor, edge computing AI platform with five 2M cameras has been deployed in a defect-detect machine. The system consists of Aetina Jetson edge AI platform and third-party algorithm, which can detect up to nine kinds of textiles and reach 90% of accuracy. With this system, the factory can realise automation for production, says Aetina.

Analyst firm, IDC predicted that there would be a quarter of the edge device supported AI solution; it is essential to connect everything to the internet in the future. Aetina has integrated the eco-partner’s WiGi (5G last mile) solution so that the detected images of the textiles can immediately be sent to the cloud. The use of the internet, means that the factory’s control room can remotely deal with most of the problem and control the status of the factory.

“The combination of our edge AI platform and the 5G solution may realize the unmanned factory soon,” said Joe Lo, general manager, Aetina.

Aetina will be showing the combination of the smart factory and 5G at Computex 2019, booth 1-K0806.

Aetina was founded in Taiwan in 2012 and provides general purpose graphics processing units (GPGPUs) and Jetson edge AI computing solutions for embedded applications. The company focuses on the industrial market, providing industrial components and longevity service.

http://www.aetina.com

> Read More

Aetina showcases AI in the smart factory

Mon, Apr 29, 2019

At this year’s Computex (28 May 1 June, Taipei, Taiwan), Aetina will display its edge artificial intelligence (AI) computing for the smart factory.

Aetina has co-operated with a third party in the textile industry to detect defects in textile production. Its small form factor, edge computing AI platform with five 2M cameras has been deployed in a defect-detect machine. The system consists of Aetina Jetson edge AI platform and third-party algorithm, which can detect up to nine kinds of textiles and reach 90% of accuracy. With this system, the factory can realise automation for production, says Aetina.

Analyst firm, IDC predicted that there would be a quarter of the edge device supported AI solution; it is essential to connect everything to the internet in the future. Aetina has integrated the eco-partner’s WiGi (5G last mile) solution so that the detected images of the textiles can immediately be sent to the cloud. The use of the internet, means that the factory’s control room can remotely deal with most of the problem and control the status of the factory.

“The combination of our edge AI platform and the 5G solution may realize the unmanned factory soon,” said Joe Lo, general manager, Aetina.

Aetina will be showing the combination of the smart factory and 5G at Computex 2019, booth 1-K0806.

Aetina was founded in Taiwan in 2012 and provides general purpose graphics processing units (GPGPUs) and Jetson edge AI computing solutions for embedded applications. The company focuses on the industrial market, providing industrial components and longevity service.

http://www.aetina.com

> Read More

Arrow and IBM aim to reinvent Airport operations with new IoT solution

Mon, Apr 29, 2019

The Smart Airport Asset Management Solution, co-created with IBM, enables airport operators to improve the performance of escalators, moving walkways, baggage handling systems and potable water cabinets

Arrow Electronics has announced that it has launched the Smart Airport Asset Management Solution, an innovative IoT solution co-created with IBM.

Based on an Arrow-designed and sourced set of IoT sensors and gateways, the IBM Watson® IoT Platform, and IBM Maximo® Enterprise Asset Management software, the solution will provide airport operators with improved operational insights that optimise equipment maintenance to avoid downtime and improve the traveller experience.

“Over seven billion passengers fly every year, so creating smart airports is smart business,” said Aiden Mitchell, vice president of IoT for Arrow. “This solution we have developed with our suppliers will help improve the customer experience and demonstrates the model that IBM and Arrow are implementing across the relationships at the heart of IoT.”

The Smart Airport Asset Management Solution collects data such as temperature, vibration and motor fluid levels from sensors on motors and other moving parts in escalators, moving walkways and baggage handling systems. Additionally, sensors on potable water cabinets measure temperature, open/closed door, water flow and leakage to determine if the cabinet is functional. The solution resolves frequent operational challenges that most negatively impact travellers according to an Airport Service Quality report from the Airport Council International.

Data is collected from the sensors connected to wireless gateways, and then consolidated and analysed on the IBM Watson IoT Platform. The industry-leading IBM Maximo® portfolio creates a more efficient asset management process using the collected data to drive workflows, resource allocation, and provides analytics to assess the health of assets to guide scheduled and unscheduled maintenance.

“Harnessing data and analytics, this end-to-end IoT solution enables airports to improve the performance of key assets that directly impact customer experience,” said Adriana Robinson, vice president, IBM Watson IoT. “This will allow maintenance teams to predict airport facility equipment failure and create proactive maintenance workflows.”

The solution is available through Arrow, its business partners, and IBM.

> Read More

Power management IC reduces size of smart appliances

Fri, Apr 26, 2019

Rohm Semiconductor has introduced the BD71847AMWV, a power management IC (PMIC) optimised for NXP Semiconductors’ i.MX 8M mini applications processors to contribute to longer operating time and to reduce the size of smart speakers, networked audio, smart displays and other smart home appliances.

The BD71847AMWV has been added to Rohm’s portfolio of PMICs designed for NXP’s i.MX application processors. The i.MX ecosystem partner introduced the PMIC last year to support the i.MX 8M Quad and Dual applications processors.

i.MX 8M Mini applications processors allow customers to incorporate voice interface to audio/video streaming devices at minimal cost, explains Rohm. They integrate up to four Arm Cortex-A53 cores operating up to 1.8GHz along with an Arm Cortex-M4 or M7 that operates at up to 400MHz for low standby power consumption. For consumer and industrial application use, there is also support for 1080p video processing, 2D/3D graphics, advanced audio functions, and a variety of high-speed interfaces.

BD71847AMWV integrates all power rails required by the processor as well as power supplies for DDR and common system IO. In addition to DC/DC converters with what the company claims is industry-leading efficiency of 95 per cent, the PMIC features programmable power sequencer for flexible power control and management, seamless hardware control interface to i.MX 8M Mini, buffered sleep clock and protection functions. Customisation and programmability help to shorten development time, lower system bill of materials and to minimise footprint, says Rohm.

The PMIC integrates six DC/DC buck converter, six low drop out regulators, 1.8V/3.3V power switch for SDXC cards, 32kHz crystal driver and buffered output clock, monitoring and protection circuits, and programmable sequencer and power state control logic.

The 2.7 to 5.5V input voltage range supports a variety of power sources, from single-cell Li-ion battery to USB and wall adapter.

The PMIC is offered in a compact 56-pin 7.0 x 7.0mm QFN package. The pin layout is carefully designed to ensure easy connection to NXP’s i.MX 8M Mini applications processor and DDR memory. Rohm estimates that the level of integration results in the number of external parts required by 42 and mounting area by 42 per cent compared with discrete solutions (assuming Type 3 PCB for single-sided mounting). With two-sided mounting, the board size could be as small as 300mm².

The company has announced plans to expand its product portfolio to support future members of the i.MX 8M family.

The PMIC is sampling now, with OEM quantities expected in August 2019.

https://www.rohm.com

> Read More

Aetina showcases AI in the smart factory

Aetina showcases AI in the smart factory

Arrow and IBM aim to reinvent Airport operations with new IoT solution

Power management IC reduces size of smart appliances

About Smart Cities