Smart Cities

dSPACE works with AWS to drive innovation in autonomous driving with generative AI

Mon, Jul 01, 2024

dSPACE, and an Amazon Web Service (AWS) Automotive Competency Partner, is developing an advanced scenario generation solution by leveraging generative AI technologies from Amazon Web Services (AWS).

The new scenario generation feature, which dSPACE is developing with support from the AWS Generative AI Innovation Centre, will be integrated into the dSPACE portfolio for SIL/HIL testing and data-driven development. It is based on a large language model (LLM) available on Amazon Bedrock and retrieval-augmented generation (RAG) architecture, which leverages scenario data provided by dSPACE. As a result, users will be able to easily create a vast number of complex and realistic scenarios, including edge cases according to the ASAM OpenSCENARIO standard, simply by entering a textual scenario description. This allows automotive manufacturers and suppliers to simulate and validate their autonomous driving systems more comprehensively and efficiently, reducing the time and cost associated with physical prototyping and testing.

dSPACE’s collaboration with AWS and the integration of generative AI technologies into dSPACE products pave the way for more comprehensive and efficient validation pipelines, ultimately contributing to safer autonomous vehicles.

http://www.dspace.de

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Infineon extends its AIROC Wi-Fi 6/6E portfolio

Wed, Jun 26, 2024

Infineon has announced the company’s new AIROC CYW5591x connected microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimised, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network.

This flexible device family can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications. The product family is available in three versions: CYW55913 for tri-band (2.4/5/6 GHz), CYW55912 for dual-band (2.4/5 GHz), and CYW55911 for single-band (2.4GHz) support.
Key features
• An Arm Cortex M33 192MHz MCU with TrustZone CC312 with 768 KB SRAM
• Quad-SPI with XIP with on-the-fly encryption/decryption for FLASH and PSRAM
• 1×1 Tri-Band (2.4/5/6 GHz) 20MHz Wi-Fi 6/6E (802.11ax)
• Up to +24 dBm transmit power for Wi-Fi for best-in-class range
• Supports 6 GHz (Wi-Fi 6E) greenfield spectrum for lower congestion and reduced latency
• Matter-over-Wi-Fi support
• Bluetooth Low Energy 5.4 supports Bluetooth low energy 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for LE Long Range
• Bluetooth Low Energy range and power are also optizized with up to +19 dBm transmit power
• Best-in-class LE Longe Range sensitivity of -111.5 dBm
• Extensive peripherals and GPIO support: 3xSCB(I2C/SPI/UART), TCPWM, 7 channel 12-bit ADC, Digital Microphone support, TCM (I2S/PCM), and up to 47 GPIOs
• Hardware support for AES, RSA, ECC, ECDHA, ECDSA, Root-of-Trust
• Multi-layer security supporting lifecycle management, secured boot with firmware authentication and encryption, anti-rollback, crypto key establishment, and management
• PSA Level 2 Certifiable

https://infineon.com

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Now at Mouser u-blox explorer kit for rapid development of high precision GNSS applications

Wed, Jun 26, 2024

Mouser is now shipping the XPLR-HPG-1 Explorer kit from u-blox. This Explorer kit is comprised of a baseboard populated with a NORA-W106 module, which integrates a powerful dual-core 32-bit microcontroller with 802.11b/g/n Wi-Fi and dual-mode Bluetooth LE 5 connectivity. The baseboard also features three mikroBUS connectors with pre-mounted click boards hosting u-blox positioning and cellular modules. The GNSS RTK 2 click board features the ZED-F9R module, a high-precision dead-reckoning. The LBAND RTK click board includes the NEO-D9S module, a satellite data receiver for the L-band correction broadcast. The 4G LTE 2 click board features the LARA-R6001D, a compact LTE Cat 1 multi-mode module offering global coverage, enabling the reception of PointPerfect correction data via mobile networks. Equipped with its GNSS and communication modules, this Explorer kit can access correction data from a satellite broadcast via L-band satellite GNSS receiver or IP connectivity using LTE or Wi-Fi. PointPerfect, the u-blox GNSS augmentation service, provides correction data delivered via the Thingstream IoT service delivery platform. The XPLR-HPG-1 also supports the Networked Transport of RTCM via Internet Protocol (NTRIP. The XPLR-HPG-1 kit’s modular design also enables users to switch out Mikroe click boards. The Explorer kit provides a flexible, modular development and prototyping platform for centimetre-level accuracy positioning applications, such as autonomous robotics, asset tracking and connected health.

https://www.mouser.co.uk

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Industry-first embedded SIM from ST supports new standard for IoT

Thu, Jun 20, 2024

ST has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA standard for eSIM IoT deployment. Also known as SGP.32, the new standard introduces special features to facilitate managing IoT devices connected to cellular networks.

“Leveraging the incoming GSMA specification, our embedded SIM for IoT solution, ST4SIM-300, enhances flexibility, eases network provider switching, and simplifies managing large numbers of connected devices,” said Agostino Vanore, Edge Authentication and M2M Cellular Marketing Manager at STMicroelectronics. “In a more connected and secured world, it will enable seamlessly track assets across the globe, connect smart devices to the cloud, and securely handle data from billions of devices, supporting our healthcare and smart infrastructures, cities, factories, and homes.”

Unlike existing eSIM machine-to-machine (M2M) and eSIM Consumer specifications, eSIM for IoT (SGP.32) is created for the needs of today’s IoT deployments. ST’s ST4SIM-300 supports features including greater automation of remote SIM provisioning (RSP), easily managing SIM profiles for large fleets of devices, and remote switching between network providers that eliminates physical SIM card swaps. The new eSIM conforms to the latest 5G standard and facilitates deploying devices that have a limited user interface and deploying low-power wide-area network (LPWAN) devices.

ST is sampling ST4SIM-300 eSIMs in various form factors, including wafer-level chip-scale packages (WLCSP) suitable for smart meters, GPS trackers, asset monitors, remote sensors, medical wearables, and similar devices.

Built with an EAL6+ certified ST secure microcontroller, the ST4SIM-300 is architected for security from the ground up. Compatible with GSMA IoT SAFE applet the eSIM facilitates adding secure element features for end-to-end communication and supports scalable security by design for creators of IoT devices.

https://www.st.com/st4sim-300 

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