ST reveals automotive-grade inertial modules

ST has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.

The ASM330LHBG1 is AEC-Q100 Grade-1 qualified for the ambient operating temperature range -40°C to 125°C, allowing use such as next to the engine compartment and in areas exposed to sunlight. The modules deliver high accuracy and reliability for systems such as vehicle navigation, body electronics, in driver support and highly automated driving systems. Typical uses include support for precise positioning in navigation systems, digitally stabilising cameras, lidars, and radars, and in active suspension, door modules, vehicle-to-everything (V2X) applications, adaptive lighting, and motion-activated functions.

Equipped with ST’s machine-learning core (MLC) and programmable finite state machine (FSM), the ASM330LHBG1 can run artificial intelligence (AI) algorithms in the sensor to provide smart functionality at very low power. This IMU is pin-to-pin compatible and shares the same configuration of registers as ST’s automotive IMUs with a lower operating temperature range, permitting a seamless upgrade.

In addition, the modules contain embedded temperature compensation, which ensures stability over wide-ranging operating conditions, and provide a six-channel synchronised output to enhance the accuracy of dead-reckoning algorithms. There are also I²C, MIPI I3C, and SPI serial interfaces, smart programmable interrupts, and a 3KB FIFO that eases managing sensor data to minimise load on the host processor.

The independently tested and certified software adheres to ISO26262 and enables safety-compliant redundancy with two ASM330LHBG1 modules. Fulfilling safety element out of context (SEooC), this combination based on general-purpose hardware supports system certification up to automotive safety integrity level B (ASIL B) . This library provides software for configuring the sensing module, checking for correct operation before starting to acquire data, and handling the acquisition of the data coming from the sensing module. Each of these steps is associated with an error code that provides confirmation if a fault is detected. This solution comprising two identical sensors provides redundancy, checking the data coming from two different sensing sources are consistent.

https://www.st.com/safer-driving-smarter-life

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Omnivision unveils two new global shutter sensors for machine vision applications

Omnivision has created a new Machine Vision Unit, which will focus on creating innovative solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems (ITS).

Omnivision’s new GS sensors feature the industry’s smallest 2.2-micron (µm) backside-illuminated (BSI) pixel for high resolution in a compact design. The high-resolution, small-format GS sensors provide the highest shutter efficiency available on the market with the ability to capture high-speed moving objects clearly and accurately at high frame rates. They also feature high sensitivity, low noise and enhanced NIR quantum efficiency (QE) for industry-leading low-light performance.

Compared to the previous-generation 2.5µm frontside-illuminated (FSI) GS sensors, the 2.2µm BSI GS sensors can achieve 1.08x sensitivity with an F2.0 lens and 2.16x sensitivity with an F1.4 lens. The new OG05B1B is a 5-megapixel (MP) resolution CMOS monochrome GS sensor in a 1/2.53-inch optical format (OF). The new OG01H1B is a 1.5MP resolution CMOS monochrome GS sensor in a 1/4.51-inch OF.

Both image sensors feature Omnivision’s Nyxel near-infrared (NIR) technology, which boosts QE to 700-1050nm, enabling the capture of brighter images from farther away; PureCel Plus-S stacked-die architecture for best-in-class image sensor performance; and CSP package technology for the smallest possible dimensions.

Key features of the OG05B1B GS image sensor:
● 2592 x 1944 resolution (5MP)
● Fast frame rate of 60fps
● High shutter efficiency of 106 dB
● Interface: 4-lane MIPI & DVP
● External trigger snapshot mode enabling back-end exposure control for improved accuracy
● Nyxel boosting QE from 700 to 1050nm, 58% QE @850nm

Key features of the OG01H1B GS image sensor:
● 1440 x 1080 resolution (1.5MP)
● Fast frame rate of 120fps
● High shutter efficiency of 106 dB
● Interface: 4-lane MIPI & DVP
● External trigger snapshot mode enabling back-end exposure control for improved accuracy
● Nyxel boosting QE from 700 to 1050nm, 58% QE @850nm

The GS sensors are available for sampling now and will be in mass production this quarter.

https://www.ovt.com

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Panasonic introduces new Amorton indoor solar cell series

Panasonic’s hydrogenated amorphous silicon (a-Si:H) solar cells, known as Amorton, power indoor and outdoor applications like IoT devices, watches, sensor nodes, asset trackers, or remote controls. Amorton can harvest energy reliably and sustainably even in low light and artificial light environments.

Now Panasonic introduces its latest Amorton solar cell series: Named AMG-1401C and AMG-1701C, the new products benefit from a nearly perfect black-reflective surface and much higher efficiency (+20%). These breakthroughs have been made possible thanks to an optimised production process, which significantly increased the active area compared to the previous generation. The result is a 20% increase in efficiency, making the new AMG-series one of the most efficient indoor amorphous solar cells on the market today. The AMG-1401C and AMG-1701C, which are based on glass substrates, are 1.1mm thin, generate approx. 8uW/cm2 at 200lux per active area.

The external dimensions are only slightly larger than the active area, which means the space and material consumption in the final application can be optimized. The AMG-1401C with external dimensions of 41.4mm x 26.1mm generates a maximum of 77.8uW at 200 lux. The cell voltage is 2.2V, which means it can be combined with many power management ICs available in the market.

 https://industry.panasonic.eu/

 

 

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Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

New legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip has announced the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB® Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

https://www.microchip.com.

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