Get started with smart home audio design

Smart home technology has expanded rapidly in recent years. A growing number of households are adopting smart speakers like Amazon Echo and Google Home. Companies that once made simple home appliances now have a demand for high-fidelity audio output. This audio goes beyond the typical beep or tone announcing that the laundry is done; this type of audio technology enables a fridge to read a grocery list aloud, or have a light switch remind someone to turn off the lights before leaving the room.

Adding advanced audio features can be daunting, adding complexities to an engineering team’s already constrained design timeline. In this post, I’ll discuss four challenges related to smart home audio design and how to simplify the process.

1. Project requirements are difficult to define.

The project you’re working on sounds simple enough: make this appliance talk. But many design choices and challenges accompany audio output, and it can be difficult to choose the right amplifier among a sea of options that at first glance all seem very similar.

To simplify the amplifier selection process, TI’s interactive block diagrams provide component recommendations for specific smart home applications. For example, the smart speaker block diagram shown in Figure 1 highlights the audio subsystem and various speaker amplifiers with features that address a variety of smart home design requirements. Audio reference designs on the same page provide schematics and companion parts that you can use as a template for your project, increasing system-level knowledge and reducing component selection woes.

Figure 1: Smart speaker block diagram

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TI block diagrams are a great first step for starting a design, but the selection of a speaker amplifier will ultimately come down to your project requirements. Two of the most common requirements in smart home products are high efficiency and sleek device profiles.

2. Audio output and advanced features decrease energy efficiency.

Adding extra functionality to a smart home device increases power consumption, and audio is no exception. As tech companies strive to go green and governments add regulations on standby power, it’s become more important to optimize the next generation of products for low power consumption. Inefficient audio systems contribute heavily to wasted power and decrease user satisfaction by raising electricity bills, depleting batteries faster and even making devices hot to the touch.

Audio amplifiers are not always playing, but they must be responsive when users need feedback or a notification; think of a security camera or a smart display in idle mode. On the other hand, a Bluetooth® speaker blasting a summer playlist needs to play music efficiently so that its battery (and the pool party) can last all day.

There are two main aspects of power consumption in audio: efficiency during play and idle mode. A  Bluetooth® speaker blasting a summer playlist needs to play music efficiently so that its battery (and the pool party) can last all day. Whereas, a smart display waiting for a voice-command should not consume an excessive amount of power if it’s not playing audio.

To address diverse applications around the smart home, TI’s latest speaker amplifiers have advanced power-management features built in. A proprietary Hybrid Modulation scheme minimizes idle current losses in >12-V systems. An integrated Class-H control of the supply rail can extend runtime by 50% in battery-powered systems. Figure 2 shows how a Class-H solution dynamically changes the supply rail to reduce power losses.

Figure 2: A dynamic supply rail saves significant power over a fixed rail

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Using a device with an integrated boost and Class-H control can save space, overall bill-of-material cost, and power consumption while supporting look-ahead to prevent audio clipping. For applications above 12V, an amplifier with integrated Class-H control and an external boost can still provide significant power savings and look-ahead to prevent clipping. Both solutions save demand on the host processor and reduce software development through integration.

3. Physical constraints limit audio performance.

Electronics are shrinking into sleek, minimalistic designs. The limited form factor in home appliances that were never designed for audio makes it difficult to add extra components such as amplifiers, digital signal processors (DSPs), boost converters and speakers without compromising the overall solution size.

With these constraints in mind, TI’s audio teams have focused on creating amplifiers that integrate more features to reduce external components and optimize the audio subsystem’s footprint.

In a smart speaker that is the center of the smart home ecosystem, high-quality music and virtual assistant feedback are crucial to user satisfaction. Adding an audio DSP to produce high-quality output typically adds cost and increases the printed circuit board (PCB) footprint. TI offers audio amplifiers with integrated processing, enabling speaker tuning to output the clearest virtual assistant response and richest music experience. An external echo-cancellation algorithm can even use the post-processed signal to help a smart speaker more accurately distinguish between audio output and user voice commands.

Electromagnetic interference (EMI) is caused by the high switching frequency of Class-D speaker amplifiers, which adds distortion to an audio signal. This is usually suppressed by several large inductors, but features like spread spectrum and phase optimization suppress EMI without the need for large external inductors, and save both space and cost while producing audio output with ultra-low distortion.

Typically, a speaker’s output power is closely related to its size; if you want louder sound, you’ll need a bigger transducer, which isn’t always an option when designing a space-constrained product. A video doorbell needs to output a homeowner’s voice loud and clear, even in noisy environments, while maintaining a slim profile. Small speakers that fit in these designs tend to output lower power and are more easily damaged by overheating or over excursion. Thanks to TI speaker protection algorithms, smaller speakers can safely output higher volume and better quality than ever before. Hear the difference in this Smart Amp A/B experiment.

As pictured in Figure 3, TI Smart Amps allow engineers to take full advantage of a speaker’s capabilities and output higher average power without compromising the integrity of the transducer. Therefore, in a noisy environment, the increased output means a user can more easily hear from a video doorbell or a smart display. Clear communication is critical in these applications and the two-way audio reference design utilizing TI Smart Amplifiers can help lay the foundation for a successful project.

Figure 3: Speaker protection amplifiers enable speakers to output twice the loudness as traditional amplifiers without damaging them

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In addition to loudness, thermal dissipation is an important design consideration. Heat dissipates poorly in small form factors, posing a problem for ever-shrinking smart home products. Heat damages internal components and creates a poor user experience. Designing with thermal energy in mind means considering PCB layout and copper thickness or implementing features like thermal foldback, which enables speaker amplifiers to reduce heat by adjusting the gain on audio signals on the fly in the event of overheating. Keeping thermal management in mind from the beginning leads to safe and reliable products.

4. Advanced audio amplifier technologies/features require deep expertise and are difficult to implement.

Advanced features solve many problems and sound great on paper, but often are too difficult to implement. To simplify the design of next-generation products, TI has not only integrated advanced features into our amplifiers, but made them easily controllable through a free software tool.

The PurePath™ Console 3 software suite is an easy-to-use graphical user interface that simplifies working with these devices. Using the software, engineers can quickly tune audio output, calibrate settings and characterize speakers. Step-by-step tuning and characterization wizards as well as a library of training resources lower the learning curve associated with using new tools.

Power management, speaker protection and audio equalization are integrated in some TI Audio devices and are easily configurable through PurePath™ Console 3, requiring little to no extra software development effort. This makes it possible to create a power-efficient, high-fidelity audio subsystem that improves user satisfaction with low risk to your overall project timeline.

Additional resources

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Quick-start software to develop embedded ADAS

Software has been developed specifically to use the hardware accelerators in Renesas Electronics’ R-Car V3H SoC for advanced driver assistance systems (ADAS) in automotive design.

To accelerate the development of ADAS, the Perception Quick Start software,  based on the R-Car V3H SoC delivers reference software for camera obstacle detection (COD), lidar obstacle detection (LOD), and road feature detection (RFD), deemed as three key recognition areas for sensor-based Level 2+ autonomous vehicle systems.

The COD reference software uses convolutional neural network (CNN) IP, a computer vision engine (CV-E), and image rendering (IMR) technology to detect 2D objects such as cars, trucks, buses, and pedestrians. It achieves approximately 30 frames per second.

The LOD software uses CNN-IP and CV-E to detect 3D objects, including cars and trucks. The LOD achieves approximately 15 frames per second with 3D bounding boxes at 50m.

The RFD reference software uses CNN-IP, CV-E, IMR, and a versatile pipeline engine (IMP) to identify drivable free space, lanes (crossable and uncrossable), road boundaries, and distances to lanes and nearest objects to support NCAP 2020. The RFD achieves approximately 30 frames per second.

The R-Car V3H SoCs deliver a combination of high computer vision performance and artificial intelligence (AI) processing at low power levels, for automotive front cameras in Level 2+ autonomous vehicles. To advance recognition technology, Renesas designed the SoCs with dedicated hardware accelerators for key algorithms including convolutional neural networks, dense optical flow, stereo disparity, and object classification. The Perception software provides an end-to-end pipeline reference for developers working with these complex accelerators which are both cost-effective and power-efficient, thereby allowing customers to advance an application design even if they have limited experience at using the accelerators. The reference software covers input from sensor or recorded data, all stages of processing and display output on a screen.

“Specialised hardware accelerators play an essential role in achieving the computer vision performance and accuracy required in embedded ADAS and autonomy applications while still meeting stringent in-vehicle power consumption limits,” said Tim Grai, director or automotive advanced systems innovation department, Renesas. “However, the complexity of these accelerators can present a steep learning curve. With the Perception Quick Start software, we are able to offer a set of application software along with the underlying primitives to simplify the use of these complex accelerators needed to achieve embedded ADAS.”

Renesas will demonstrate the Perception software at TU-Automotive Detroit (Booth C190, 5-6 June, Novi, Michigan, USA).

http://www.renesas.com

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Accelerometers support CAN or RS-422 protocols

Accelerometers added to the Seiko Epson (Epson) portfolio can monitor the health of the wearer or buildings and infrastructure, as the company releases the M-A352 and the M-A552xxx accelerometers.

The M-A352 accelerometer is designed for infrastructure health monitoring. It  provides the necessary noise performance of one micrG/√Hz or better (servo accelerometer class) for a stable supply and cost competitiveness, says Epson.

The M-A552AC1 and M-A552AR1 three-axis accelerometers boast the same performance as the M-A352 but are equipped with the controlled area network (CAN) and RS-422 interfaces, respectively. These interfaces are widely used in industrial applications. The M-A552AC1 and M-A552AR1 are housed in metal packages that provide IP67-equivalent protection against water and dust.

This level of protection against the elements enables the accelerometers to be used in a range of industrial applications that require long distances, stability and reliability, says Epson.

The accelerometers make it easy for developers to build multi-node (multi-point) measurement systems, synchronised measurement systems and other complex, sophisticated measurement systems. They are easy to install, connect, and use even outdoors and under other harsh environmental conditions, adds Epson, and can reduce customer system development times.

Samples of the new products will begin shipping in the summer of 2019, with volume production scheduled for the spring of 2020.

The MA-A552AC1 (CAN) and MA-A552AR1 (RS-422) accelerometers can be used in structure health monitoring to monitor buildings, bridges, tunnels, and steel towers for earthquake detection, environmental vibration measurement and industrial equipment monitoring. They can also be used in unmanned vehicles (e.g., terrestrial vehicles, undersea probes), and for the measurement of the vibration and path of industrial equipment and vehicles.

Epson Europe Electronics is a marketing, engineering and sales company and the European headquarters for electronic devices of Seiko Epson, Japan. Headquartered in Munich, Germany, since 1989, Epson Europe Electronics has 50 employees, European sales representatives and a Europe-wide network of distributors. Epson Europe Electronics provides value added services for semiconductors, sensors, sensing systems and timing devices for a variety of markets, including industrial, automotive, medical, and communications.

http://www.epson-electronics.de

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Proximity sensors have predictive maintenance features

Proximity sensors with IoT features for predictive maintenance have been announced by Omron. The company has released a total of 2,512 models of its DC three-wire E2E Next series proximity sensors.

The sensors are also claimed to have the longest sensing distances, at least twice that of Omron’s previous offerings. This allows for more spacious design, reduces the risk of contact and improves facility operation rates, due to the prevention of stoppage and downtime.

The sensors reduce the risks of sudden facility stoppages by two thirds and also detect warning signs of such stoppages and notify users via the network. They help improve facility operation rates by preventing unforeseen facility stoppages and reducing facility downtime, continues Omron.

Current proximity sensors characteristically have short sensing distances, which carries the risk, for example that equipment vibration may cause the sensor body to move too far away from or come in contact with the sensing object. Such incidents are said to account for approximately 20 per cent of facility stoppages.

The E2E Next series proximity sensors (DC three-wire models) are equipped with Omron’s own thermal distance control 2 and Prox3 hybrid circuitry technologies, which enable sensing distances that are at least twice as long as in previous models, and reduce risks of such facility stoppages by a factor of three. Distances between sensor bodies and sensing objects are constantly monitored, and users are notified via IO-Link communication if they become too great or too small. This allows users to identify warming signs of sudden facility stoppages and arrange timely maintenance.

Omron supplies control components and equipment, ranging from vision sensors and other input devices to various controllers and output devices such as servomotors, as well as a range of safety devices and industrial robots. Devices are combined via software.

Omron’s business fields range from industrial automation and electronic components to automotive electronic components, social infrastructure systems, healthcare, and environmental solutions.

Omron was established in 1933, and today has over 36,000 employees worldwide, in 117 countries.

http://www.omron.com/

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