Smart Cities

IO-Link IC connects industry 4.0 devices

Wed, Apr 01, 2020

The CCE4503 is the latest member of the IO-Link family from Dialog Semiconductor.  It is the first to be launched by the company since it bought Creative Chips at the end of last year. The IC connects the smallest and most price-sensitive IO-Link device sensors and actuators for the industrial IoT (IIoT).

IO-Link is the first globally standardised, serial bi-directional point-to-point communication technology (IEC 61131-9) for an industrial automation network, providing data access to the cloud. It provides robust communications for the last stretch between sensors, actuators and any fieldbus within a network.

The CCE4503 is a robust device-side IO-Link-compliant transceiver that combines IO-Link standard communications with advanced protection circuitry and low power dissipation. It is packaged in a tiny DFN10 (3.0 x 3.0mm). Its size enables it to be used to add IO-Link connectivity to the most space-constricted industrial sensor and actuator devices, says Dialog.

“Industrial sensors and actuators are integrating more functionality in smaller form factors with greater demands for cloud connectivity,” said Dr Lutz Porombka, vice president of Dialog’s Industrial Mixed Signal business unit.

The CCE4503 is sampling now and is supported by a comprehensive set of development support tools, industry standard IO-Link software and a full-featured customer evaluation board.

https://www.dialog-semiconductor.com

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DRAM modules are designed for edge computing

Mon, Mar 30, 2020

The advent of 5G and the exponential growth of connected devices, mean that more data is generated and processed at the edge. To help businesses keep up with this quantity of data, Innodisk has introduced DDR4-3200 modules which are optimised for edge computing.

Gartner predicts that enterprise-generated data created and processed outside centralised data centres will reach 75 per cent by 2025, up from 10 per cent in 2018.

Edge computing requires high-performance memory modules optimised for processing enormous amounts of data quickly. The DDR4-3200 range of modules is available in a choice of form factors and capacities, namely 4Gbyte, 8Gbyte and 16Gbyte across SODIMM, UDIMM and RDIMM form factors including optional error code correction (ECC).

Innodisk says it is the first company to pack this level of performance into a 4Gbyte module.

Innodisk provides flash memory, DRAM modules and embedded peripheral products for industrial and enterprise applications.

https://www.innodisk.com

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Aetina integrates InnoAge to Jetson edge computing

Mon, Mar 30, 2020

World-leading out-band management for edge artificial intelligence (AI) devices, is claimed by Aetina as it unveils how it has integrated Innodisk’s InnoAge into its Jetson edge computing platform.

Management is critical in edge devices used in vertical applications, says Aetina.

It has integrated what is believed to be the industry’s first out-of-band management solid state device (SSD) InnoAge with the Aetina Jetson edge computing platform. The result reduces the cost of manually repairing the edge device and primarily reduces the downtime of the equipment, says Aetina, for convenient control of edge devices.

The integrated system effortlessly restarts and restored in the event of the edge device crashing, reports Aetina.

Its Jetson edge computing platform has a small form factor and low power consumption, making it suitable for embedded edge devices.

To maintain numerous edge devices, in-band management could be limited if an unpredictable issue occurs which makes it more expensive in terms of labour costs as well as possibly extending the downtime of edge devices.

InnoAge SSD equipped with an Azure Sphere chip can cut a separate space in the solid state hard disk and install a separate operating system. InnoAge connected with Azure Cloud and the system of the device can automatically be stored in the solid state hard disk. Once the operating system or software of the edge device crashes, the user can reset or restore the system of edge devices through the management platform on Azure Cloud. The real-time status of edge devices can also monitor the cloud management platform, which facilitates remote control and management of many edge devices.

Aetina says that the Azure Sphere provides the world’s premier data security ability, making the inference results of edge AI computing secure for uploading to the cloud database without security risks.

Aetina was founded in Taiwan in 2012. It provides support for general purpose graphics processing units (GPGPU) and Jetson edge AI computing solutions for embedded applications.

http://www.aetina.com

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Foremost prepares for multi-band network PIM test

Mon, Mar 30, 2020

A rugged enclosure for PIM testing in complex multi-band 4G and 5G networks has been developed by Foremost Electronics, working closely with customer, AceAxis.

AceAxis creates intellectual property rights (IPR) and technology to build, test and analyse the telecomms networks of the future. The company says it is a pioneer in the development of remote radio head (RRH) and embedded test and measurement technology for the telecomms market. Its technology is changing the way cell-site radio equipment is designed and tested and introducing products with a focus on innovation, value, time to market and quality.

AceAxis required a case for a single board device for passive intermodulation (PIM) testing in complex multi-band 4G and 5G networks. The test system analyses the digital bitstream (I/Q data) on the fibre interface between the base band unit (BBU) and remote radio head (RRH) to measure the effects of PIM.

There were a number of very specific requirements for the enclosure. It had to be a compact customer-specific form factor with a maintenance-free conduction cooling concept for a high thermal performance without the use of fans. It also required comprehensive EMC shielding and the integration of custom-developed rubber frames to protect the surface of the case, eliminating the use of conventional rubber feet, while ensuring a firm grip even when the enclosures are stacked or placed on a workbench or table.

Foremost is an added value channel partner for nVent Schroff and therefore has access to a wide range of standard, customisable and complete custom enclosure solutions and accessories.

To shorten the development time for a non-standard case Foremost used products from the nVent Interscale case range for the AceAxis design. The Interscale enclosure range provides a choice of enclosures with heights of one, two or 3U and with various widths and depths. It offers a range oof matched accessories such as mounting plates for PCBs or fan kits if required.

The Interscale components selected provided customisation and guarantees  EMC protection with a special locking mechanism of the side panels. Fan cooling was not permitted, so a heatsink with a thermal pad to the processor was used. The custom rubber frame assembly is screwless and easy to remove and the cases have been painted to meet AceAxis’ requirements.

Foremost is a specialist distributor of electromechanical components.

http://www.4most.co.uk

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